• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.873-879
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• 2014

UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

• Structural Engineering and Mechanics
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• v.17 no.3_4
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• pp.347-356
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• 2004

In order to extend the lifetime of buildings and civil infrastructure, patch type fibrous composite retrofitting materials are widely used. Retrofitted concrete columns and beams gain stiffness and strength, but lose toughness and show brittle failure. Usually, the cracks in concrete structures are visible to the naked eye and the status of the structure in the life cycle is estimated through visual inspections. After retrofitting of the structure, crack visibility is blocked by retrofitted composite materials. Therefore, structural monitoring after retrofitting is indispensable and self diagnosis method with optical fiber sensors is very useful. In this paper, we try to detect the peel out effect and find the strain difference between the main structure and retrofitting patch material when they separate from each other. In the experiment, two fiber optic Bragg grating sensors are applied to the main concrete structure and the patching material separately at the same position. The sensors show coincident behaviors at the initial loading, but different behaviors after a certain load. The test results show the possibility of optical fiber sensor monitoring of beam structures retrofitted by the composite patches.

• Fashion & Textile Research Journal
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• v.8 no.5
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• pp.585-590
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• 2006

In the variation of physical properties of adhesive fabrics, the objective of this study is to analyze fitness of fusible interlining to four sorts of fabrics for men's suit with various structural parameters. Four fusible interlinings are used for adhering to fabrics for men's suit. Mechanical properties of these 16 adhesive fabrics fused with these interlinings are measured by KES-FB system for analysing appearance and wearing properties of garments and for examining the fitness of fusible interlining to the fabrics for men's suit. The variation of bending property for adhesive fabrics are found to be higher in the order of interlining 1(Cotton30/Rayon70, plain), interlining 2(Polyester30/Rayon70, warp knit), interlining 4(Polyester, shingosen fabrics with drawing textured yarn) and interlining 3(Polyester, double dot coating interlining). The variation of adhesive effect shows the same results with bending property and shows negative relation with extensibility in weft direction per extensibility in warp direction(EM2/EM1). The variation of peel strength of adhesive fabrics, woolen fabrics in the case of face fabrics and interlining 3 in the case of interlining shows the largest value respectively.

• Transactions on Electrical and Electronic Materials
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• v.15 no.3
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• pp.155-158
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• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.

• Korean Journal of Materials Research
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• v.25 no.11
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• pp.622-629
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• 2015

Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and $SiO_x$-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

• Current Photovoltaic Research
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• v.5 no.3
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• pp.83-88
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• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• Korean Journal of Materials Research
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• v.30 no.3
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• pp.105-110
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• 2020

Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

• Macromolecular Research
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• v.14 no.5
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• pp.517-523
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• 2006

The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.11-15
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• 2011

In this study we synthesized low VOC-solvent soluble thermo plastic polyurethane, The effect of chain extender and NCO/OH ratio for properties of thermoplastic polyurethane was investigated. Also, we prepared low VOC-type primer by TPU and acrylic modified tackifier resin. When NCO/OH ratio was 2 or more, TPU was insoluble in low VOC solvent. And peel strength was higher value using polar type tackifier than non-ploar type tackifier.