Etchless Fabrication of Cu Circuits Using Wettability Modification and Electroless Plating |
Park, Sang-Jin
(Department of Materials Science and Engineering, Chungnam National University)
Ko, Tae-Jun (Computational Science Research Center, Korea Institute of Science and Technology) Yoon, Juil (Department of Mechanical System Engineering, Hansung University) Moon, Myoung-Woon (Computational Science Research Center, Korea Institute of Science and Technology) Han, Jun Hyun (Department of Materials Science and Engineering, Chungnam National University) |
1 | H. C. Kim, S. K. Rha and Y. S. Lee, Korean J. Mater. Res., 24, 632 (2014). DOI |
2 | Y. R. Cho, Y. S. Lee and S. K. Rha, Korean J. Mater. Res., 23, 661 (2013). DOI |
3 | T. Hatano, Y. Kurosawa and J. Miyake, J. Electron. Mater., 29, 611 (2000). DOI |
4 | E. Edqvist, N. Snis and S. Johansson, JMM., 18, 015007 (2008). |
5 | P. Calvert, Chem. Mater., 13, 3299 (2001). DOI |
6 | A. Kumar, H. A. Biebuyck and G. M. Whitesides, Langmuir, 10, 1498 (1994). DOI |
7 | L. Courbin, E. Denieul, E. Dressaire, M. Roper, A. Ajdari and H. A. Stone, Nat. Mater., 6, 661 (2007). DOI |
8 | W. Barthlott and C. Neinhuis, Planta, 202, 1 (1997). DOI |
9 | K. Tsougeni, N. Vourdas, A. Tserepi, E. Gogolides and C. Cardinaud, Langmuir, 25, 11748 (2009). DOI |
10 | T. J. Ko, K. H. Oh and M. W. Moon, Adv. Mater. Interfaces, 2, 1400431 (2015). DOI |
11 | M. Paunovic, Modern Electroplating, 5th ed., p.433, M. Schlesinger and M. Paunovic, ECS, New Jersey, USA (2010). |
12 | L. S. Li, X. R. Li, W. X. Zhao, Q. Ma, X. B. Lu and Z. L. Wang, Int. J. Electrochem. Sci., 8, 5191 (2013). |
13 | G. Whyman, E. Bormashenko and T. Stein, Chem. Phys. Lett., 450, 355 (2008). DOI |
14 | K. Woo, D. Kim, J. S. Kim, S. Lim and J. Moon, Langmuir, 25, 429 (2008). |
15 | A. B. D. Cassie, Discuss. Faraday Soc., 3, 11 (1948). DOI |
16 | D. Quere, Nat. Mater., 1, 14 (2002). DOI |
17 | A. Marmur, Langmuir, 19, 8343 (2003). DOI |
18 | R. N. Wenzel, Ind. Eng. Chem., 28, 988 (1936). DOI |
19 | A. Lafuma and D. Quere, Nat. Mater., 2, 457 (2003). DOI |
20 | M. Reyssat, J. Yeomans and D. Quere, Europhys. Lett., 81, 26006 (2008). DOI |
21 | C. Ishino, K. Okumura and D. Quere, Europhys. Lett., 68, 419 (2004). DOI |
22 | C. Ishino and K. Okumura, Europhys. Lett. E, 25, 415 (2008). |
23 | D. Bartolo, F. Bouamrirene, E. Verneuil, A. Buguin, P. Silberzan and S. Moulinet, Europhys. Lett., 74, 299 (2006). DOI |
24 | S. Moulinet and D. Bartolo, Europhys. Lett. E, 24, 251 (2007). |
25 | J. Schultz and M. Nardin, Handbook of Adhesive Technology, 2nd ed., p.54, A. Pizzi and K. L. Mittal, Marcel Dekker, Inc., New York, USA (2003). |