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A Study on the Soldering Characteristic of 4 Bus Bar Crystalline Silicon Solar Cell on Infrared Lamp and Hot Plate Temperature Control

적외선 램프 및 핫 플레이트 온도 제어를 통한 4 Bus Bar 결정질 실리콘 태양전지 솔더링 특성에 관한 연구

  • Lee, Jung Jin (Nano Materials & Components Research Center, Korea Electronics Technology Institute) ;
  • Son, Hyoung Jin (Nano Materials & Components Research Center, Korea Electronics Technology Institute) ;
  • Kim, Seong Hyun (Nano Materials & Components Research Center, Korea Electronics Technology Institute)
  • 이정진 (전자부품연구원 나노소재부품연구센터) ;
  • 손형진 (전자부품연구원 나노소재부품연구센터) ;
  • 김성현 (전자부품연구원 나노소재부품연구센터)
  • Received : 2017.08.02
  • Accepted : 2017.09.20
  • Published : 2017.09.30

Abstract

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

Keywords

References

  1. Hsieh, H. H., et al. "The effects of temperature and solders on the wettability between ribbon and solar cell." Solar Energy Materials and Solar Cells, Vol. 93, No. 6, pp.864-868, 2009. https://doi.org/10.1016/j.solmat.2008.10.005
  2. Kim, S. J., et al. "Soldering Process of PV Module Manufacturing and Reliability." Korean Solar Energy Society Conference Proceedings, 2011.
  3. So, A. C. K. and Yan, C. C. "Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints." Electronic Components and Technology Conference, 1996. Proceedings., 46th. IEEE, 1996.
  4. Yang, T. L., et al. "Growth kinetics of Ag 3 Sn in silicon solar cells with a sintered Ag metallization layer." Solar Energy Materials and Solar Cells, 123 pp.139-143, 2014. https://doi.org/10.1016/j.solmat.2014.01.018
  5. Gao, W., et al. "Effect of glass phase on solder joint reliability in crystalline silicon photovoltaic modules." Journal of Materials Science: Materials in Electronics, Vol. 26, No. 10, pp.7811-7814, 2015. https://doi.org/10.1007/s10854-015-3429-x
  6. Che, F. X., John H. L. P. "Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8 Ag-0.7 Cu solder joints." Journal of Alloys and Compounds, 541, pp.6-13, 2012. https://doi.org/10.1016/j.jallcom.2012.06.104
  7. Jeong, J. S., Park, N.C., and Han, C.W. "Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module." Microelectronics Reliability, Vol. 52, No. 9, pp.2326-2330, 2012. https://doi.org/10.1016/j.microrel.2012.06.027
  8. Chuang, C. M., and Lin, K. L. "Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate." Journal of Electronic Materials, Vol. 32, No. 12, pp.1426-1431, 2003. https://doi.org/10.1007/s11664-003-0111-5
  9. Geipel, T., et al. "Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics." Solar Energy Materials and Solar Cells, 159, pp.370-388, 2017. https://doi.org/10.1016/j.solmat.2016.08.039
  10. Wassink, R. J. K. Soldering in Electronics (Ayr, Scotland: Electrochemical Publications Ltd., pp.149-159. 1989.