• Tribology and Lubricants
• /
• 제31권4호
• /
• pp.141-147
• /
• 2015

Gas foil thrust bearings (GFTBs) have attractive advantages over rolling element bearings and oil film thrust bearings, such as oil-free operation, high speed stability, and high-temperature operation. However, GFTBs have lower load carrying capacity than the other two types of bearings owing to the inherent low gas viscosity. The load carrying capacity of GFTBs depends mainly on the compliance of the foil structure and the formed hydrodynamic wedge, where the gas pressure field is generated between the top foil and the thrust runner. The load carrying capacity of the GFTBs is very important for the suitable design of oil-free turbomachinery with high performance. The aim of the present study is to identify the characteristics of the load carrying performance of GFTBs. A new test rig for the experimental measurements is designed to provide static loads up to 800 N using a pneumatic cylinder. The maximum operating speed of the driving motor is 30,000 rpm. A series of experimental tests—lift-off test, static load performance test, and maximum load capacity test—estimate the performance of a six-pad GFTB, in terms of the static load, driving torque, and temperature. The maximum load capacity is determined by increasing the static load until the driving torque rises suddenly with a sharp peak. The test results show that the torque and temperature increase linearly with the static load. The estimated maximum load capacity per unit area is approximately 80.5 kPa at a rotor speed of 25,000 rpm. The test results can be used as a design guideline for GFTBs for realizing oil-free turbomachinery.

• Journal of Welding and Joining
• /
• 제31권5호
• /
• pp.54-58
• /
• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• ETRI Journal
• /
• 제39권6호
• /
• pp.866-873
• /
• 2017

We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

• 설비공학논문집
• /
• 제16권11호
• /
• pp.1051-1059
• /
• 2004

Two phase thermosyphone loop for electronics cooling are designed and manufactured to test its performance under the partial load and low environment temperature conditions. The thermosyphone device has six evaporators connected parallel for the purpose of cooling six power amplifier units (PAU) independently. The heater modules for simulating PAUs are adhered with thermal pad to the evaporator plates to reduce the contact resistance. There are unbalanced distributions of liquid refrigerant in the differently heated evaporators due to the vapor pressure difference. To reduce the vapor pressure differences caused by partial heating, two evaporators are connected each other using the copper tube. The pressure regulation tube successfully reduces these unbalances and it is good candidates for a field distributed systems. Under the low environment temperature operating condition, such as $-30^{\circ}C$, there may be unexpected subcooling in condenser. It leads the very low saturation pressure, and under this condition there exists explosive boiling in evaporator. The abrupt pressure rise due to the explosive boiling inhibits the supplement of liquid refrigerant to the evaporator for continuous cooling. Finally the cooling cycle will be broken. For the normal circulation of refrigerant there may be an optimum cooling air flow rate in condenser to adjust the given heat load.

• Journal of Welding and Joining
• /
• 제29권6호
• /
• pp.65-70
• /
• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• 한국의류산업학회지
• /
• 제25권4호
• /
• pp.497-507
• /
• 2023

This study measured the effect 3D printing products comprised of different materials and shapes on heat transfer in clothing to derive fundamental data on thermal comfort among clothing comfort. The variables were three types of material (EVA foam, TPU-10%, TPU-10%+EVA), two types of shape (without holes, with holes), and two types of covers(without cover, with cover). All samples (12 types) prepared by combining these variables were placed on the hot plate set at 36℃, and the surface temperature was measured at three points for 10 minutes. The surface temperature change was dependent on the material, shape, and cover of the sample. The sample printed with TPU exhibited higher temperature transfer compared to the EVA foam sample after 10 mins. In addition, the temperature transfer was better when there were holes, and rate decreased when the sample was covered with fabric. We confirmed that material selection of the pad and thermal conductivity of the cover are extremely important in solving thermal stress to the human body caused by functional clothing with protectors. Additionally, as the protector, it is recommended to design the outer shell with a passage, such as a hole, to allow the rapid transfer of heat to the external environment.

• 폴리머
• /
• 제30권6호
• /
• pp.519-524
• /
• 2006

나노피막을 형성하는 유기솔더 보존제의 주성분인 저분자 imidazole계 유기물을 대체할 수 있는 고분자 물질을 합성하였다. Cu와 같은 금속과의 접착성이 종은 비닐 피리딘을 주요 단량체로 하였고 물성 개질을 위한 공중합용 단량체로 아크릴아미드와 알릴아민을 사용하였다. 다양한 조성의 공중합체를 제조하여 코팅성, 용해도, 열적 특성, 산화방지 특성 등의 유기솔더 보존제로서의 특성을 평가하였다. 공중합체중 알릴아민을 함유한 공중합체의 경우 전반적으로 Cu pad에 대해 뛰어난 코팅능과 열적안정성을 보였고, 분자량 및 알릴아민 함유량에 따라 그 특성이 변화하였다. Oxygen induced temperature를 측정하여 시간에 따른 열 안정성을 확인해 본 결과 $230^{\circ}C$까지는 70분이상 동안 아무런 산화반응에 의한 열량 변화를 관찰할 수 없었고, 모든 알릴아민계 공증합체가 산소조건하에서 $200^{\circ}C$에서 1시간 동안 무게감량의 변화가 거의 없었으므로 충분한 열적 안정성을 갖고 있는 것으로 확인되었다.

• 마이크로전자및패키징학회지
• /
• 제30권3호
• /
• pp.40-50
• /
• 2023

최근 스마트폰의 부품 수는 급격히 증가하고 있는 반면, PCB 기판의 크기는 지속적으로 감소하고 있다. 따라서 부품의 실장밀도를 개선하기 위해 PCB를 쌓아서 올리는 stacked PCB 구조의 3D 실장 기술이 개발되어 적용되고 있다. Stacked PCB에서 PCB 간 솔더 접합 품질을 확보하는 것이 매우 중요하다. 본 연구에서는 stacked PCB의 신뢰성을 향상시키기 위하여, 인터포저(interposer) PCB 및 sub PCB의 프리프레그의 물성, PCB 두께, 층수에 대한 휨의 영향을 실험과 수치해석을 통해 분석하였다. 또한 솔더 접합부의 응력을 최소화하기 위해 인터포저 패드 설계 구조에 따른 접합강도를 분석하였다. 인터포저 PCB의 휨은 프리프레그의 열팽창계수가 적을수록 감소하였으며, 유리전이온도(Tg)가 높을수록 감소하였다. 그러나 온도가 240℃ 이상이면 휨의 개선 효과는 크지 비교적 크지 않다. 또한 FR-4 프리프레그에 비하여 FR-5을 적용할 경우에 휨은 더 감소하였으며, 프리프레그의 층수와 두께가 높을수록 휨은 감소하였다. 한편 sub PCB의 경우, 휨은 프리프레그의 Tg 보다 열팽창계수가 더 중요한 변수임을 확인하였고, 두께를 증가시키는 것이 휨 감소에 효과적이었다. 솔더 접합력을 향상시키기 위하여 다양한 인터포저 패드 디자인을 적용하여 전단력 시험을 수행한 결과, 더미 패드를 추가하면 접합강도가 증가하였다. 또한 텀블 시험 결과, 더미 패드가 없을 때의 크랙 발생율은 26.8%이며, 더미 패드가 있으면 크랙 발생율은 0.6%로 크게 감소하였다. 본 연구의 결과는 stacked PCB의 설계 가이드라인 제시를 위한 유용한 결과로 판단된다.

• 한국식품위생안전성학회지
• /
• 제26권2호
• /
• pp.120-124
• /
• 2011

훈제연어의 L. monocytogenes에 대한 식중독 안전관리 방안 마련 및 위해평가 수행 등을 위하여 성장예측모텔을 개발하였다. 미생물 성장예측모델 개발 방법은 대상 식품 및 환경 조건에 따라 다양하며 통계적으로 유용한 모델을 사용하여야 하기에 본 연구에서는 미생물 성장예측모델 개발에 널리 사용되어 그 적용성이 검토된 Gompertz model과 Polynomial model equation을 이용하여 훈제연어의 L. monocytogenes 최대성장속도(SGR) 및 유도기(LT)에 관한 예측모텔을 개발하였다. 개발된 모델의 적합성 평가를 위해 $B_f$와 $A_f$ factor를 산출하였고 최대성장속도(SGR)의 경우 0.98, 1.06, 유도기(LT)의 경우 1.60, 1.63으로 나타나 유도기의 적합성이 최대성장속도에 비하여 떨어지는 것으로 확인되었다. 본 연구에서 개발된 훈제연어에서의 L. monocytogenes 성장속도에 관한 모텔은, 수산업, 특히 훈제연어 생산, 가공, 보관 및 판매업에 다양한 방면으로 활용 가능할 것으로 판단되며, 더욱 정확한 예측모텔 개발을 위해서는 다양한 변수에 따른 미생물의 성장패턴 변화 등에 관한 연구가 추가적으로 시행되어야 할 것으로 생각되어 진다.

• 폴리머
• /
• 제34권3호
• /
• pp.226-236
• /
• 2010

UV조사에 의한 공중합반응을 통해 PDP의 방열패드용 무용제형 아크릴계 점착제를 제조하고 이때 도입되는 공단량체의 곁사슬의 화학적 구조와 가교제의 종류에 따른 점착제의 젖음성을 온도별로 조사하였다. 또한, 동일 조건에서 점착제의 초기 접착력 및 박리강도와 주파수 변화에 따른 점착제의 점탄성 거동 간의 상관관계를 확인하였다. 공단량체의 곁사슬의 길이가 짧을수록 넓은 온도범위에서 우수한 젖음성과 점착 물성을 보였으며 경화제로는 di(ethylene glycol) dimethylacrylate(DEGDMA)를 사용한 계가 우수한 박리 에너지를 보였는데, 이것은 유리전이온도와 점탄성거동의 차이에 기인하는 것으로 판단된다.