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Preparation and Evaluation of Poly(vinyl pyridine) Copolymers for Organic Solderability Preservatives  

Im, Jeong-Hyuk (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Lee, Hyun-Jun (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Huh, Kang-Moo (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Kim, Chang-Hyeon (Daedeok Research Institute, Honam Petrochemical Co.)
Lee, Hyo-Soo (Nano Material Team, Advanced Material Center, Korea Instiutte of Industrial Technology)
Lee, Chang-Soo (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Choi, Ho-Suk (School of Applied Chemistry and Biological Engineering, Chungnam National University)
Publication Information
Polymer(Korea) / v.30, no.6, 2006 , pp. 519-524 More about this Journal
Abstract
Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.
Keywords
organic solderability preservatives; poly(vinyl pyridine); allylamine; thermal stability; solubility;
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