• Journal of Information Display
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• v.2 no.4
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• pp.34-38
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• 2001

We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1821-1824
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• 2008

A novel in-mold packaging process has been developed to manufacture devices with closed channels. In this unified process, fabrication of open channels and forming the rigid cover on top of them are sequentially integrated in the same mold. The entire process is comprised of two phases. In the first phase, the open channels are fabricated under an exquisitely controlled temperature and pressure using the conventional micro injection molding technology. In the second phase, the closed channels are fabricated by conducting the injection molding process using the molded structure with the open channels as a mold insert. As a result, the in-mold technology can eliminate the bonding processes such as heating, ultrasonic or chemical processes for cohesion between the channel and the cover, which have been required in conventional methods.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.7 no.1
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• pp.25-30
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• 2001

The purpose of this study was to examine how can we keep the freshness of peeled chestnuts in distribution process. The 30 minutes impregnation treatment at the preservation solution of 0.3% consistency showed a good result. The solution treatment prevented from surface yellowing and quality degradation of peeled chestnuts. And, in vaccum packaging after treating chemicals surface drying was faster than the other packaging from 7th day. A vitamin C treatment was no effective to restrain the growth of microbials.

• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.213-215
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• 2009

Using the object recognition processing on the captured images, we can inspect whether a packaging process is performed correctly in real time. So we realized the functions that acquire an image of each state of the packaging process using a camera, extract each object in the image, and inspect the packaging process using the extracted object data. In case an object shape is solid, for object search, a shape-based matching algorithm was used which searches the object utilizing the informations on the shape. In case an object shape is not solid, and Is flexible, gray-level difference of the pixels in the limited image region including the object was used to recognize the object.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.4
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• pp.275-280
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• 1999

The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.1
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• pp.11-16
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• 2019

This study analyzed various packaging materials and types for frozen foods and the effects of packaging materials on temperature changes during frozen process. Pouches with different film thickness were prepared and placed in an IQF freezer, then the temperature inside pouches measured using a deep thermometer. The most common types of primary packaging for frozen foods in the market was plastic pouches with polyethylene or polyamide/polyethylene multilayer materials. The temperature change inside of packaging was delayed with film thickness increased. As the size of packaged food increased, the temperature change inside the food was slowed down. In addition, the pouches with air inside took more time to reach $-30^{\circ}C$ compared to pouches with less air during frozen process. This study provides information on packaging materials and types for frozen foods and preliminary data of temperature change by different types of packaging.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.32-38
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• 2002

In order to improve the transportability and safety of fishery products during distribution process, we developed new containers made of polyethylene polypropylene copolymers. Two types are developed; two color type and bar type. As the result, the stacking efficiency improved by 27.6% while providing great transportability and decreasing sanitation problems.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.7-13
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• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.