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http://dx.doi.org/10.6117/kmeps.2011.18.1.007

Optical PCB and Packaging Technology  

Ryu, Jin-Hwa (부산대학교 나노융합기술학과)
Kim, Dong-Min (부산대학교 차세대전자기판회로학과)
Kim, Eung-Soo (부산외국어대학교 디지털미디어학부)
Jeong, Myung-Yung (부산대학교 WCU 인지메카트로닉스공학과)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.1, 2011 , pp. 7-13 More about this Journal
Abstract
According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.
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Times Cited By KSCI : 4  (Citation Analysis)
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