• Asian Pacific Journal of Cancer Prevention
• /
• v.15 no.24
• /
• pp.10937-10941
• /
• 2015

Pathogenesis of lung cancer is a complicated biological process including multiple genetic and epigenetic changes. Since cigarette smoking is confirmed as the most main risk factor of non-small cell lung cancer (NSCLC), the aim of this study was to determine whether tobacco exposure plays a role in gene methylation. Methylation of the RAR-${\beta}$ gene were detected using methylation-specific polymerase chain reaction in DNA from 167 newly diagnosed cases with NSCLC and corresponding 105 controls. A significant statistical association was found in the detection rate of the promoter methylation of RAR-${\beta}$ gene between NSCLC and controls ($x^2$=166.01; p<0.01), and hypermethylation of the RAR-${\beta}$ gene was significantly associated with smoking status (p=0.038, p<0.05). No relationship was found between RAR-${\beta}$ gene methylation and pathologic staging including clinical stage, cell type, gender and drinking (p>0.05), and the methylation of RAR-${\beta}$ gene rate of NSCLC was slightly higher in stages III+IV (80.0%) than in I+II (70.8%). Similar results were obtained for methylation of the RAR-${\beta}$ gene between squamous cell carcinoma (77.9%) and other cell type lung cancer (73.9%). These results showed that the frequency of methylation increased gradually with the development of clinical stage in smoking-associated lung cancer patients, and tobacco smoke may be play a potential role in RAR-${\beta}$ gene methylation in the early pathogenesis and process in lung cancer, particularly squamous cell carcinoma. Aberrant promoter methylation is considered to be a promising marker of previous carcinogen exposure and cancer risk.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.3 no.3
• /
• pp.107-113
• /
• 2003

Microelectronics device performance and its reliability are directly related to and controlled by its constituent materials and their microstructure. Specific processes used to form and shape the materials microstructure need to be controlled in order to achieve the ultimate device performance. Examples of front-end and back-end ULSI processes, packaging process, and novel optical storage materials are given to illustrate such process-structure-property-reliability relationship. As more novel materials are introduced to meet the new requirements for device shrinkage, such under-standing is indispensable for future generation process development and reliability assessment.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.2
• /
• pp.55-59
• /
• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.89-98
• /
• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.2
• /
• pp.45-48
• /
• 2002

LTCC system has many kinds of advantages, like low loss, low cost of process, stability of process etc. But it is so hard to adjust the characteristics of passives in ceramic module after fabrication. So the exact prediction of behavior of components in high frequency region upper than GHz must be made. In this procedure, the exact measurement is need. In this study, many kinds of measurement Jigs are compared and optimized, and measurement methods of each parameter are designed.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.3
• /
• pp.53-56
• /
• 2017

Laser cladding is a technique for forming beads by melt-sintering with a laser while directly feeding metal powder onto the base material through nozzles. This technique, which is applied in laser surface treatment technology, is useful for repairing broken or worn parts by allowing selective formation of the surface layer of the base metal material. In this paper, laser cladding process was performed on STS316L powder using high power continuous wave laser with IR wavelength and the cladding characteristics according to process conditions were experimentally analyzed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.101-106
• /
• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.09a
• /
• pp.203-215
• /
• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.1
• /
• pp.59-64
• /
• 2004

The performance of fuel cell electrode depends on the characteristics of the catalyst support material. This paper deals with the use of CNF(carbon nanofibre) and CNT(carbon nanotube) as platinum catalyst support. The CNF and CNT were synthesized with catalyst treated by mechanochemical process and were prepared by chemical vapor deposition (CVD) method. The platinum supported on CNF and CNT for polymer electrolyte membrane fuel cell (PEMFC) application. In result, the best I-V characteristic was verified by the prepared MEA(membrane electrode assembly) from twisted CNF that had a diameter of 65 nm.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.22 no.1
• /
• pp.15-23
• /
• 2016

Gelatin soft capsules, manufactured by the press through package(PTP) process, are widely used in the production of multivitamin dietary supplements and other health functional foods. Gelatin capsules can prevent light and air from having a direct contact with the contents in the capsule, and the nutrients inside the capsules are preserved without any loss. In the present study, on the basis of the results on the safety of gelatin capsules. The parameters investigated included degradation of the capsules before their shelf life, capsule deformation, and changes in specific nutrients. Moisture and heat in the production and storage environments of the capsules caused the gelatin to swell and attach some of the inorganic salts in the vitamin contents. Nutritional component analysis showed that B1, B5, B9, and B12 contents were decreased, while mineral elemental analysis shown calcium, chloride, and zinc compound were found to be infused into the gelatin of the capsule shell.