한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Sn-Cu-Ni계를 이용한 Pb-free wave Soldering의 공정 적용 및 신뢰성에 관한 연구

A study on the implementation of wave soldering process and the solder joint reliability of it using Sn-Cu-Ni lead-free solder

  • 유충식 (삼성전기(주) 종합연구소 재료연구(Pb-Free Soldering)) ;
  • 정종만 (삼성전기(주) 종합연구소 재료연구(Pb-Free Soldering)) ;
  • 김진수 (삼성전기(주) 종합연구소 재료연구(Pb-Free Soldering)) ;
  • 김미진 (삼성전기(주) 종합연구소 재료연구(Pb-Free Soldering))
  • 발행 : 2001.11.01
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초록

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

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