• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• Transactions of the Korean hydrogen and new energy society
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• v.28 no.6
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• pp.635-641
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• 2017

In this study, the components of packaged hydrogen filling station were analyzed and risk factors were examined. Risk scenarios were constructed and quantitative risk assessments were conducted through a general risk assessment program (phast/safeti 7.2). Through the risk assessment, the range of damage according to accident scenarios and the ranking that affects the damage according to the risk factors are listed, and scope of damage and countermeasures for risk reduction are provided. The quantitative risk assessment result of the packaged hydrogen filling station through this task will be used as the basic data for improving the safety of the packaged filling system and preparing safety standards.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Food Science and Preservation
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• v.5 no.4
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• pp.392-395
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• 1998

This study was to reveal consumer attitudes about open shelf-life dating method of the packaged foods. Consumers consider that open shelf-life dating to the packaged foods gives good information to choose the products to buy, but also confusion with unclear open shelf-life dating marked on the package. For the perishable foods, consumers tended to get more attention to the open shelf-life dates. Consumers prefer the dating method of edible periods better than sellable periods to the packaged foods. The female consumers consider that open shelf-life dating is more important to buy the packaged foods than male consumers do.

• Journal of the Korean Society of Food Culture
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• v.30 no.6
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• pp.766-772
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• 2015

This research was conducted to investigate the effect of essential oil (EO) from Artemisia Princeps Pampanini on quality of tomato during storage. EO was extracted by steam distillation and diluted by 1 and 2%. Total phenolic contents and antioxidative activities of EO were analyzed. Tomato was packaged corrugated box covered with polypropylene (PP) film containing EO (1 and 2%) and then stored at room temperature for 10 days. During storage, appearance, weight loss rate, soluble solid contents, pH and a (redness) value were measured for tomato. Total phenolic contents of EO increased in a dose-dependence. The DPPH and ABTS radical scavenging activities also showed a concentration-dependent increase. The weight loss rate was lowest using the film packaged in 1% EO. During the storage period, soluble solid contents and pH increased in all treatments. The a value increased regardless of EO concentration in films. Especially, tomato packaged with EO film showed a lower a value than non EO-packaged ones. This result suggests that application of EO to film is effective for tomato quality preservation.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.237-244
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• 2022

Onions are a significant crop in Korea, and cultivation is increasing every year along with high demand. Onions are planted in the fall and mainly harvested in June, the rainy season, therefore, physiological changes in onion bulbs during long-term storage might have happened. Onions are stored in cold room and at adequate relative humidity to avoid quality loss. In this study, bio-yield stress and weight loss were measured as the quality parameters of net packaged onions during 10 weeks of storage, and the storage environmental conditions are monitored using sensor networks systems. Quality estimation of net packaged onion during storage was performed using the storage environmental condition data through machine learning approaches. Among the suggested estimation models, support vector regression method showed the best accuracy for the quality estimation of net packaged onions.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.4
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• pp.275-280
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• 1999

The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.13 no.2
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• pp.59-65
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• 2007

Packaged food products often undergo retort processing, a thermal processing in a pressurized vessel called a retort, to ensure their microbiological safety or shelf-stability under normal non-refrigerated conditions of storage and distribution. Retort processing is generally aimed to accomplish commercial sterility of packaged foods with acceptable nutritional and sensorial qualities. Fundamental principles on retort processing, such as thermal resistance kinetics of target microorganism, heat penetration theory, and methods for evaluating process sterility and food quality loss, were reviewed. Factors affecting process severity, heat transfer mechanism, and heat penetration efficiency were summarized. General features of retortable packaging formats including metal cans, glass jars, and plastic packages were also briefly reviewed.

• Korean journal of food and cookery science
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• v.20 no.3
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• pp.292-298
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• 2004

This study researched the microbial change of quality according to various phases of product flow of Dongtae-Jeon (a pan-fried dish) and rolled egg in packaged meals. In order to carry out the study, the time required, temperature, water activity and microbial quality were measured at various phases of production flow of Dongtae-Jeon and rolled egg in packaged meals, and the effects of these factors on microbial multiplication was analyzed. According to the phases in product flow of Dongtae-Jeon, it was shown that the time required is 12.5hrs and water activity is distributed 0.932-0.980. These conditions were suitable for microbial multiplication. According to the phases in product flow of rolled egg, it was shown that the time required is 3.3hrs. In addition, qualitative analysis of pathogenic microorganisms (Salmonella spp., Vibrio parahaemolyticus, Staphylococcus aureus) detected no such microorganisms in any of the samples.