• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.2 s.120
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• pp.68-77
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• 2007

It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

• Proceedings of the Korea Society of Design Studies Conference
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• 2002.05b
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• pp.202-203
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• 2002

• Journal of the Ergonomics Society of Korea
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• v.18 no.2
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• pp.57-69
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• 1999

The primary objective of this research was to suggest the design dimensions of automotive seating package that has an important effect upon seating package design. To conduct the research, a set of manikin dimensions that are representative for Korean was determined by using a statistical scheme. With these dimensions, we generated nine manikins for male and female, respectively. Also, the preferred driving posture was investigated using the experimental setup. To find each joint angle for subjects, a driving monitoring system was developed and a three dimensional motion analysis system was employed. The joint angle for the subject was established and compared with related literature. With the generated manikins and each joint angle, the driving posture was simulated by using SAFEWORK that is a program to generate manikins. The positions and adjustable ranges from the accelerator heel point to the hip point and the steering wheel center point that are important variables in order to design seating package were suggested. Further research is needed to determine the seating package dimensions three dimensionally.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.47-58
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• 2012

The purpose of this study is to provide how various elements of package design affect on consumer response. Those consumers who is living at Sung-nam district and who is using or have used herbal shampoo were selected as respondents for this research. For testing hypotheses. frequency analysis, reliability analysis, and multi regression analysis were utilized with SPSS 12. All elements of package design influenced on brand attitude and purchasing intention. Typography is the most effective element influencing on brand attitude, while illustration is on purchasing intention. This result could be a useful reference for package designer and brand manager to trigger positive brand attitude and purchasing intention.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.853-858
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• 2010

DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.

• Design Convergence Study
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• v.18 no.1
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• pp.49-60
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• 2019

While one person household and nuclear family have been increasing, supermarkets began to launch home meal replacement(HMR) promotion. Each brand competes over various types of HMR such as box lunch. In particular, the sales of HMR have been increasing due to one-person households. Experts predicted HMR market will be increased in the future as well. This study presents design evaluation with regards to HMR package design for elders. The methods of this study are: First, research literature review on senior society and analyse the design for both domestic and foreign HMR products. Second, survey on product design for evaluation was conducted. Third, user's evaluation survey was conducted on elders. As a result, containers mostly came in cup or box shaped package designs. The package provided both still and illustration image of food. The HMR design for elders are recommended as follows: first, HMR should be service designed for users. Second, the design should be for elders as well. Third, the design should be empathetic and abundant. For user-interface, the packaging material shall not be slippery and the shape of grip should be considered thoroughly for the elder's design.

• Archives of design research
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• v.11 no.2
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• pp.179-188
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• 1998

One of the characteristics in the modem society is the overflow of the communication. The invention of various merchandise and the development of information and comunication changed the society of verbal characterization into that of visible environments. To establish the effective communication in these changes, the package has to understand, specify, and deliver the needs of the consumers by the thorough analysis of the marketing plans and the marketing strategies. In this thesis we considered the conception of the marketing and the change of the marketing environments, studied the close relationship between the marketing and the package and, furthermore, introduced the package process as one of the effective communication methods. The purpose of this thesis is to introduce the marketing strategies. to develope the theoretical processes of the package design as a communication method which can cope with the change of the marketing environments caused by that of the consumer's favorites.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.149-158
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• 1995

This paper describes the development of a software tool LCD FRAME that may guide the analyzing process for the electrical characteristics and the design procedure for constructing the thin film transistor liquid crystal display(TFT/LCD) packages. LCD FRAME can analyze its electrical characteristics from the TFT/LCD system package configuration, and provide the design variables to meet the user's requirements. These analysis and design procedure can be done in real time according to the model at simplified package level of TFT/LCD. LCD_FRAME is an object-oriented expert system which considers package elements as objects. With this LCD_FRAME software tool, we analyzed the I-V characteristics of a-Si TFT and its signal distortion which has maximum 1.58 $\mu$s delay along the panel scan line of the package containing 480 ${\times}$ 240 pixels. We designed the package structure of maximum 6.35 $\mu$s signal delays and 3360 ${\times}$ 780 pixels, and as a result we showed that the proper structure of 20 $\mu$m scan line width, 60$\mu$m panel TFT gate width and 8 $\mu$m gate length. This LCD_FRAME software tool provides results of the analysis and the design in the form of input files of the SPICE program, text data files, and graphic charts.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.2
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.4
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• pp.1347-1355
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• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.