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http://dx.doi.org/10.5762/KAIS.2010.11.3.853

Anodic Alumina Based DRAM Package Substrate  

Kim, Moon-Jung (Division of Electrical Electronics and Control, Kongju National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.11, no.3, 2010 , pp. 853-858 More about this Journal
Abstract
DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.
Keywords
Anodization; Alumina; DRAM; Package Substrate; Transmission Line;
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