• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.221-221
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• 2006

The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• Korean Management Science Review
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• v.15 no.2
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• pp.59-70
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• 1998

According to the Gartner Group, the market for ERP software in Korea is growing rapidly. However, the number of successful ERP implementations is quite few. Standard(unmodified) ERP's are built based on best practices. Improvements expected from successful implementation are based on best practices built into the software. Many improvements are lost through modification to "standard" software. Even minor changes in software can significantly reduce benefits. Both implementation time and risk factors are increased with modifications. We introduce a methodology, called package Enable Re-engineering (PER) and the main components of change management program by Ernst & Young. "To-Be" model could be developed through the software capabilities. And change management processes such as continuous education and self-developments are required. The philosophy of the change management processes is to let the software package drive the re-engineering practices and avoid moving the software toward the "As-IS" process. Extensive top management involvement, major focus on speed, extensive communication program, and "clear" picture of the future are essential components of change management. We are sure that the complied experiences and model have implications for practice and for academicians for their endeavors in their fields.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.751-755
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• 1995

It become more difficult to anticipate the performance of fluid power systems as the number of components increases because of nonlinearrities inherent in hydraulic components. In this situation, the computer simulation technique can be an effective tool in the analysis and design of fluid power systems. In this paper, simulation results are presented for dynamic characteriatics of a knuckle crane. Simple models for hydraulic components and relatively detailed motion equations for attachments are used. the simulation reaults are very close to those of experiments. The simulation is performed using a simulation package developed with object-oriented method. This package provides the encironment that user can construct desirct desired circuits form the component library, checks the continuity and compatibility conditions automatically and executes simulation

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• The Transactions of the Korea Information Processing Society
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• v.7 no.9
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• pp.2783-2796
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• 2000

In electronic commerce systems, for the purchase of package goods to be processed in realtime, the stock of their components has to be

• Journal of Korea Multimedia Society
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• v.6 no.4
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• pp.668-675
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• 2003

Now a days many industries and bigger organisation (Indian Railways, Bharat Heavy Electricals Ltd.) are facing difficulties in implementing the new technology because of non-availability of fully trained staff. Also for the employed technical and other staff lot of resistance management has to face to get them trained for adoption of new technology. There are also very less organisations who can design effective training programmes and at the same time develop course material specially multimedia packages and computer base training (CBT) which can satisfy the need of different target groups of industries. Indian Railways was also facing similar situation while implementing the Air Brake System technology In Indian Railways. TTTI Bhopal took that challenge and designed, developed and trained Indian Railways trainer for implementation of the package on different target group. The present paper offers a case study on the same.

• Proceedings of the KIPE Conference
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• 2004.07a
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• pp.321-324
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• 2004

This paper presents a package IC containing some components of DC/DC converter block for mobile phone's sub OLED(Organic Light Emitting Display). Package IC contains a load switch, a control IC, a diode, a switch for on/off operation, and a switch for changing output voltage. It operates with switching frequency of 100kHz, within the range of input voltage, $3.2V\~5.5V$. Duty ratio can be changed up to $93\%$, and maximum power efficiency is $85\%$. This package IC is loaded onto three model of 1.2W mobile phone's sub-OLED.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.55 no.10
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• pp.418-425
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• 2006

This paper describes a simulation package for a power system using objected-oriented programming. The package includes four parts which are a power flow, a short circuit calculation, a transient simulation program, and an economic dispatch. The graphical user interface(GUI) is designed as a common platform which allows the user to create one-line diagrams of systems, specify components of power systems as well as simulation parameters, and view the output produced by the chosen application. The paper presents the data structure of the functional modules such as the draw module, power system data module, the power system simulation module, and the utility module using the object oriented programming. This package may be useful for educational and research purposes.