• The Korean Journal of Emergency Medical Services
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• v.9 no.2
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• pp.207-221
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• 2005

Purpose: The purpose of this study was to develop and apply a simulation-problem based learning(S-PBL) package in basic life support(BLS). Methods: This study was used to developed BLS' S-PBL package throughout 12 steps of PBL package development model. Then, BLS' S-PBL methodology was implemented in second year student in the undergraduate emergency medical technology, and survey was done. Results: 1. S-PBL package model was presented based on conceptual model II of PBL ; PEL for professional action. 2. Quantitative analysis of survey was to the effectiveness of learning, 3.59 points ; 4.15 of BLS and 3.84 of integration and practical use of knowledge. 3. As to the satisfaction of student, S-PBL package management, tutor and self-satisfaction' score was 3.59, 3.82, 3.39 respectively. Conclusion: This study was suggested that S-PBL education would be necessary with improved tutor skill and achieved advantage of simulation and PBL.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• The Korean Journal of Emergency Medical Services
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• v.14 no.2
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• pp.25-40
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• 2010

Purpose : The purpose of this study was to develop and apply a Core Skill-TLP(Core Skill-Tutorial, Laboratory, Practicum) package in Patient Management and to effect of core skill-TLP education. Methods : This study was used to developed Patient Management' Core Skill-TLP package throughout 14 steps of Core Skill-TLP package development model. Then, Core Skill-TLP Learning methodology was implemented in first year student in the undergraduate emergency medical technology, and survey was done. Results : 1. Core Skill-TLP package model was presented based on conceptual model of PBL(S-PBL). 2, The student in OSCE did significantly better in clinical patient management core skills performance. 3. As to the satisfaction of Core Skill-TLP package management, student, tutor and self-satisfaction score was 3.21, 3.42, 3.38 respectively. Conclusion : This study was suggested that Core Skill-TLP education would be necessary with well-structured package and achieved advantage of simulation and PBL.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.97.2-97
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.63-69
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• 2013

The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.

• Asian-Australasian Journal of Animal Sciences
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• v.16 no.11
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• pp.1695-1700
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• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.

• Journal of Digital Convergence
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• v.10 no.6
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• pp.61-69
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• 2012

The SW market has greatly growing up according as rapid progressing of the smart fusion, nowadays. But, the portion of Korea in the global SW market is no more than 2.2%. Especially, the portion of Korea's package SW is very much fragile than it of the global companies and lower than it of embedded SW in Korea. It is caused by weak competitiveness of Korea's package SW and the politic support of government is fainter than it of other SW kinds. So, this article will grasp the actual state of domestic package SW industry through data and case study, drew the improving problems of the package SW policy, and propose the cultivating policies of the package SW.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.1
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• pp.13-16
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• 2018

Powdered infant formula is susceptible to oxidation in the presence of oxygen. Even though the product is usually packaged in nitrogen atmosphere, the oxygen ingress through the package layer may occur in case of flexible pouches and affects the oxidation of the product. $O_2$ barrier of the package is thus important variable to protect the product from oxidative deterioration. $O_2$ barrier property was investigated for aluminum-laminated small pillow packs of $3.5{\times}17.5cm$. Storage temperature and combination of primary and secondary packages were evaluated as variables affecting the barrier for conditions of empty pouch flushed with nitrogen. Apparent oxygen transmission rate of the primary package exposed to air was $2.32{\times}10^{-3}mL\;(STP)\;atm^{-1}\;d^{-1}$ at $30^{\circ}C$ and its temperature dependence could be explained by activation energy of $28.5kJ\;mol^{-1}$ in Arrhenius relationship. The additional secondary package of nylon/PE film containing 20 primary packages was ineffective in modulating package $O_2$ transmission and was only marginally helpful when combined with oxygen scavenger. The same was true in suppressing the product oxidation when the primary package was filled with 14 g of the formula.