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M. J. Yim, R. Strode, R. Adimula, J. J. Zhang and C. Yoo, "Ultra Thin Top Package using Compression Mold: Its Warpage Control", Proc. Proc. 61st Electronic Components and Technology Conference (ECTC), Lake Buena Vista, 1141, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2011).
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