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http://dx.doi.org/10.6117/kmeps.2013.20.3.063

Warpage Characteristics of Bottom Packages for Package-on-Package(PoP) with Different Chip Mounting Processes  

Jung, D.M. (Department of Materials Science and Engineering, Hongik University)
Kim, M.Y. (Department of Materials Science and Engineering, Hongik University)
Oh, T.S. (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.3, 2013 , pp. 63-69 More about this Journal
Abstract
The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.
Keywords
Package on package; warpage; flip chip; die attach film;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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