• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.2
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• pp.105-108
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• 2005

The Pb(Zr,Ti)O$_3$ thin films were fabricated with Pb(La,Ti)O$_3$ buffers in-situ onto Pt/Ti/SiO$_2$/Si substrates by pulsed laser deposition method. We have observed the increase of the remanent polarization using PLT buffers. The remanent polarization value of 33.4 $\mu$C/$\textrm{cm}^2$ and the coercive field value of 66.4 kV/cm were obtained when the PLT tufter was deposited for 15 seconds. Enhancement of the polarization is resulted from the enhanced orientation of PZT thin film because of the PLT buffet layer.

• Journal of the Korean Ceramic Society
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• v.34 no.10
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• pp.1060-1066
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• 1997

In this paper, the effects of La addition of PLZT thin film prepared by sol-gel method on the capacitor characteristics are investigated for gigabit generation DRAM applications. The addition of La on the PLZT capacitor results in a trade-off between charge storage density(Qc') and leakage current density(Jl). As La content increases, Qc' and permeability(εr) at 0V are reduced while Jl is significantly decreased. It is demonstrated that 5% La doping of PZT can substantially reduce Jl and also improve resistance to fatigue while incurring only minimal degradation of Qc'. Very low leakage current density (5×10-7 A/㎠ even at 125℃) and high charge storage density (100fC/㎛2) under VDD/2=1V conditions are achieved using 5% La doped PZT thin films for gigabit DRAM capacitor dielectrics. In addition, the fatigue and TDDB measurements indicate good reliability of the PLZT capacitors.

• Proceedings of the KIEE Conference
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• 2008.05a
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• pp.169-170
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• 2008

The heterolayered PZT/PT thick films were fabricated by two different methods - thick films of the PZT by screen printing method on alumina substrates electrodes with Pt, thin films of $PbTiO_3$ by the spin coating method on the PZT thick films and once more thick films of the PZT by the screen printing method on the $BaTiO_3$ layer The structural and the dielectric properties were investigated for effect of various stacking sequence of sol-gel prepared $PbTiO_3$ coating solution at interface of the PZT thick films. The insertion of $PbTiO_3$ interlayer yielded the PZT thick films with homogeneous and dense grain structure with the number of $PbTiO_3$ layers. The leakage current density of the PZT/$PbTiO_3-1$ film is less that $4.41{\times}10^{-9}\;A/cm^2$ at 5 V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.9
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• pp.1717-1723
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• 2007

In this study , quasi-MFISFET (Metal-Ferroelectric-Insulator-Semiconductor FET) devices are fabricated using PLZT(10/30/70), PLT(10), PZT(30/70) thin film and their drain current properties are investigated. It is found that the drain current of quasi-MFISFET is directly influenced by the polarization strength of ferroelectric thin fan. Also, when the gate voltages are ${\pm}5\;and\;{\pm}10V$, the memory windows are 0.5 and 1.3V, respectively. It means that the memory window is changed with the variation of coercive voltage generated by the voltage applied on ferroelectric thin film. The electric field and the leakage current with time delay of PLZT(10/30/70) thin lam are measured to investigate the retention property of MFISFET device. Some material parameters such as current density constant, $J_{ETO}$, electric field dependent factor K and time dependent factor m are obtained. The variation of charge density with time is quantitatively analyzed by using the material parameters.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.172-172
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• 2005

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1553-1555
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• 1999

Recently, $SrBi_2Ta_2O_9$(SBT) and $Pb(ZrTi)O_3$(PZT) were much attracted as materials of capacitor for ferroelectric random access memory(FRAM) showing higher read/write speed, lower power consumption and nonvolartility. Bi-layered SBT thin film has appeared as the most prominent fatigue free and low operation voltage for use in nonvolatile memory. To highly integrate FRAM, SBT thin film should be etched. A lot of papers on SBT thin film and its characteristics have been studied. However, there are few reports about SBT thin film due to difficulty of etching. In order to investigate properties of etching of SBT thin film, SBT thin film was etched in $CF_4$/Ar gas plasma using magnetically enhanced inductively coupled plasma (MEICP) system. When $CF_4/(CF_4+Ar)$ is 0.1, etch rate of SBT thin film was $3300{\AA}/min$, and etch rate of Pt was $2495{\AA}/min$. Selectivities of SBT to Pt. $SiO_2$ and photoresist(PR) were 1.35, 0.6 and 0.89, respectively. With increasing $CF_4$ gas, etch rate of SBT thin film and $P_t$ decreased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.126-129
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• 1999

Dielectric and piezoelectric properties of perovskite materials such as La modified $Pb(Zr,Ti)O_3$ ceramics and $Pb(Zn_{1/3}Nb_{2/3})O_3-PbTiO_3$ single crystals were investigated for cryogenic capacitor and actuator applications. Enhanced extrinsic contributions resulted in piezoelectric coefficient (d33) as high as 250 pC/N at 30 K, superior to that of PZT ($d_{33}$ ~ 100 pC/N). This cryogenic property enhancement was associated with retuning the MPB (or cryogenic temperatures. PZN-PT single crystals exhibited dramatic property improvements such as $d_{33}$ > 500 pC/N at 30 K as a result of an engineered domain state.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.66-69
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• 1989

After reviewing previous work done on two piezoelectric thin films(PZT, ZnO), ZnO thin piezofim of 1-3UM is fabricated by sputtering on the different substrates(i. e., P+Si/N-Si, SiO2/P+Si/ N-Si, Al/SiO2/ P+Si/ N+Si). The result shows that ZnO piezofilm on the Al has the best c-axis orientation. One of applications for the ZnO piezofilm as an microvalve to control liquid flow is introduced, and which can be controlled electrically and remotely.

• Journal of the Korean Ceramic Society
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• v.39 no.4
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• pp.341-345
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• 2002

The effect of the Pt electrode and the $Pt-IrO_2$ hybrid electrode on the performance of ferroelectric device was investigated. The modified Pt thin films with non-columnar structure significantly reduced the oxidation of TiN diffusion barrier layer, which rendered it possible to incorporate the simple stacked structure of Pt/TiN/poly-Si plug. When a $Pt-IrO_2$ hybrid electrode is applied, PZT thin film properties are influenced by the thickness and the partial coverage of the electrode layers. The optimized $Pt-IrO_2$ hybrid electrode significantly enhanced the fatigue properties with minimal leakage current.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.125-125
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• 2003

PZT(Pb(Zr,Ti)O3)는 우수한 강유전 특성을 가지기 때문에 FRAM (Ferroelectric Random Access Memory) 소자에 응용하기 위해 많은 연구가 진행되고 있다. 스퍼터에 의해 증착된 PZT는 처음에 pyrochlore상으로 존재하다가 후 열처리를 통해 이력 특성을 나타내는 perovskite상으로 천이된다. 일반적인 furnace열처리 방법은 고온에서의 장시간 열처리가 요구되고 Pb-loss현상이나 TiO2와 같은 이차상의 생성 그리고 하부 Pt전극의 roughness증가 및 crack과 같은 문제점이 있다. 최근 들어 후 열처리를 RTA로 이용하는 연구가 진행되고 있는데 이는 열처리 시간이 짧기 때문에 위와 같은 문제점을 개선할 수 있었다. 하지만 RTA방법 또한 어느 정도의 thermal budget이 존재하고 추가적 장비가 필요하며 기판의 전체적 가열공정이므로 다른 CMOS공정과 compatibility가 떨어진다. 따라서 본 실험에서는 위와 같은 문제를 해결하고자 노력을 집중하였고 이를 위한 새로운 열처리 방법을 개발하였다. 즉 Pt 하부전극에 전압(전류)을 인가하여 순간적으로 고온으로 결정화시키는 새로운 공정을 모색하였는데 이와 같은 방법은 열처리를 위한 추가적인 장비가 필요없고 국부적으로 순간적인 가열이기 때문에 glass기판에도 적합하며 RTA보다 승온시간 및 열처리 시간이 짧기 때문에 thermal budget도 줄일 수 있었다.