• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.92-98
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• 2010

The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.209-212
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• 2018

Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Korean Journal of Optics and Photonics
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• v.26 no.5
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• pp.261-264
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• 2015

In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.3
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• pp.500-506
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• 2015

In this paper, we designed and fabricated the EM wave absorber consisted of Sendust for suppressing EM wave noise PCB in ISM (Industrial, Scientific and Medical) band of 2.4 GHz. We fabricated several samples with different composition ratios of some kinds of Sendust to CPE (Chlorinated Ploy-ethylene) as a binder, and it was confirmed that the optimum composition ratio of absorbing materials was Flaked Sendust : CPE = 72.5 : 27.5 wt.%.. The absorbing abilities were simulated by changing the thickness and the measured material constants of EM wave absorber. The measured absorption abilities were analyzed and compared with the simulated ones. As a result, the simulated results agree well with the measured ones, and the developed EM wave absorber with extremely thin thickness of 0.6 mm has absorption ability of 5.4 dB at 2.4 GHz is excellent one. The thin type EM wave absorber can be applied for suppressing and absorbing electromagnetic noises from information and communication equipments.