한국금형공학회:학술대회논문집

Korean Society of Die & Mold Engineering (한국금형공학회)
권호 표지

A method for estimating residual stress development of PCB during thermo-compression bonding process

PCB 열 압착 공정에서 잔류응력 계산을 위한 방법

  • Lee, Sang-Hyuk (Department of Nano IT Engineering, Seoul National University of Technology) ;
  • Kim, Sun-Kyung (Department of Die & Mold Design, Seoul National University of Technology)
  • 이상혁 (서울산업대학교 나노아이티공학과) ;
  • 김선경 (서울산업대학교 금형설계학과)
  • Published : 2008.06.24
Download PDF
⟨ Previous Next ⟩

Abstract

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

Keywords