• Journal of Korean Society on Water Environment
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• v.18 no.4
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• pp.401-409
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• 2002

In this study, to evaluate the applicability of ORP and pH as process control parameters for an intermittent aeration process, a 200L/d bench-scale plant was installed and operated for 90 days. It was fed with synthetic wastewater which contained $COD_{Cr}$ : 400mg/L, TN : 40mg/L and TP : 7mg/L. ORP & pH were measured on-line and compared with the variation of nutrient concentrations. As the results, both of the ORP and pH were able to monitor successfully nitrification and denitrification. Bending-points on the ORP curve and peak points on the pH curve corresponded to the termination of nitrification and denitrification. For P uptake and release, pH was the best indicator for performance evaluation. The aerobic pH apex was appeared when P uptake was accomplished and there was a relationship between the P release and pH variation. But the pH curve needed filtering because there were many noises on it. In this study, the shape of the ORP & pH curves were varied as the operating conditions such as aeration rates and organic loads were changed. It allowed the operating states of biological systems to be effectively evaluated. If it is properly managed to show the bending points and peak points clearly, the on-line monitoring of ORP & pH will be a reliable and effective technique for process control of intermittent aeration processes.

• Communications of the Korean Mathematical Society
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• v.21 no.3
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• pp.533-541
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• 2006

We consider a autoregressive moving average process of order p and q with Markov switching coefficients and find sufficient conditions for irreducibility of the process. Identifying small sets is also examined.

• Journal of Environmental Science International
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• v.30 no.1
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• pp.69-76
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• 2021

The purposes of this study were to evaluate the removal characteristics of COD, Ni, and P and to derive appropriate operating conditions for the plating wastewater according to NaOCl reaction time and pH operating conditions in the BPC unit process during the plating wastewater treatment process. As a results of evaluating the removal characteristics for raw wastewater by each BPC unit process, the removal efficiencies of COD, Ni and P in BPC 1-1 unit process were 72.8%, 99.1%, and 100.0%. Therefore, the proper reaction time of NaOCl was derived as 21.1 minutes. In order to maintain the +800 mV ORP and the reaction time of 20 minutes, the temporary injection and continuous injection of NaOCl in the BPC unit process were 13.7 mL and 18.7 mL, respectively. It was found that the temporary injection method of NaOCl reduced the chemical cost by 36.5% compared to the continuous injection method. Also, Ni showed the highest removal efficiency of 97.8% at pH 10.5. On the other hand, P showed a removal efficiency of 57.4% at pH 10.0.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• Journal of Korean Society for Quality Management
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• v.30 no.4
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• pp.44-57
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• 2002

In this paper we study two vector-valued process capability indices $C_{p}$＝($C_{px}$, $C_{py}$ ) and $C_{pk}$＝( $C_{pkx}$, $C_{pky}$) considering process capability indices $C_{p}$ and $C_{pk}$. First, we derive two asymptotic distributions of plug-in estimators (equation omitted) and (equation omitted) under. some proper. conditions. Second, we examine the performance of asymptotic confidence regions of our process capability indices $C_{p}$＝( $C_{px}$ , $C_{py}$ ) and $C_{pk}$＝( $C_{pkx}$, $C_{pky}$) under BN($\mu$$_{x}$, $\mu$$_{y}$, $\sigma$$^2$$_{x}$, $\sigma$$^2$$_{y}$,$\rho$)$\rho$)EX>)EX>)EX>)

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.22 no.1
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• pp.128-136
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• 1992

This study was undertakened to investigate the change of image characteristics on dental films according to the process of using time of processing solution in automatic processor. Base + fog density, film density and subject contrast were measured with the digital densitometer, the pH of developing and fixing solution were measured with Digital pH / ION Meter. The following results were obtained: 1. Base + fog density was increased with the process of using time of the processing solution and was over the maximum permissible base + fog density 0.25 from the 3rd day. 2. Film density was increased with the process of using time of the processing solution. 3. Subject contrast was decreased with the process of using time of the processing solution. 4. The pH of the developing solution was decreased with the process of using time, the pH of the fixing solution was increased.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.153-154
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• 2000

Large size poly-Si TFT-LCDs have been fabricated using p-channel thin film transistors for notebook PC application. We have designed and implemented the data sampling circuit and gate drivers that operate with low power consumption and high reliability. The gate driver has a redundant structure. We have realized the uniform and excellent display quality comparable to that of CMOS module. The reliability of panel is investigated and discussed by measuring the bias stability of transistors.

• Nuclear Engineering and Technology
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• v.32 no.6
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• pp.595-604
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• 2000

Flow-Accelerated Corrosion Behavior of SA106 Gr.C steel in room temperature alkaline solution simulating the CANDU primary water condition was studied using Rotating Cylinder Electrode. Systems of RCE were set up and electrochemical parameters were applied at various rotating speeds. Corrosion current density decreased up to pH 10.4 then it increased rapidly at higher pH. This is due to the increasing tendency of cathodic and anodic exchange half-cell current. Corrosion potential shifted slightly upward with rotating velocity. Passive film was formed from pH 9.8 by the mechanism of step oxidation and the subsequent precipitation of ferrous species into hydroxyl compound. Above pH 10.4, the film formation process was active and the film became stable. Corrosion current density showed increment in pH 6.98 with the rotating velocity, while it soon saturated from 1000 rpm above pH 9.8. This seems that activation process which represents formation of passive film on the bare metal surface controls the entire corrosion process