• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Journal of Korea Multimedia Society
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• v.21 no.12
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• pp.1379-1386
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• 2018

In this paper, we proposed eyeglass type periorbital wrinkle treatment device for reducing and improving periorbital wrinkles using near infrared LED of 850nm wavelength and galvanic current. The proposed periorbital wrinkle treatment device is equipped with a control system based on F-PCB. It consists of eight near-infrared LEDs and four indicator LEDs for treatment of right and left periorbital wrinkles. The eyeglass frame is coated with conductive material, so galvanic current can flow to the skin of periorbital wrinkle contacted to it. One male adult in the mid-40s was allowed to use the device for 10 minutes every day for 4 weeks. After 4 weeks, image analysis using optical equipment for measuring wrinkles indicated that wrinkle indexes were reduced.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Korean Journal of Optics and Photonics
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• v.23 no.1
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• pp.12-16
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• 2012

In the paper, we fabricated a Ni master with $45^{\circ}$-mirror structures for flexible waveguide fabrication. The flexible waveguide films with embedded $45^{\circ}$-angled mirrors at the waveguide ends were successfully fabricated using a UV-imprint process. Next, in order to enhance the reflectivity of the mirrors, Ni(3 nm)-Au(200 nm) bilayers were evaporated on the $45^{\circ}$-angled facets through a locally opened thin mask using an electron beam evaporator. We measured propagation loss, bending loss, mirror loss and bending reliability of the fabricated waveguide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.273-274
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• 2009

현재 가로등의 93.3[%]를 차지하고 있는 나트륨램프는 색상이 적황색이며, 시력에 장애와 피로감을 주어 인체에 해로우므로 고효율 램프로 교체되고 있으며 백열전구는 전력을 많이 소모하고 잦은 고장으로 빈번한 대체와 유지보수를 필요로 하므로 LED를 선택하면, 유지보수 비용과 안전성, 에너지 효율성면에서 큰 강점을 갖는다. 본 연구에서는 에너지 효율이 높은 LED 가로등 제작을 위한 모듈을 제작하여, 열적, 광학적 분석을 하였다. 동작 150분 후, LED Module의 PCB기판 6 Point에서 Thermal Grease와 Thermal Pad의 처리에 의한 열적 변화를 측정하였으며, Thermal Grease 처리는 Thermal Pad 보다 평균 3 $[^{\circ}C]$ 정도 낮은 35 $[^{\circ}C]$결과를 얻었으며, 제작된 LED Module의 광학적평가의 결과는 10 [m] 높이에서 $20\times20\;[m^2]$ 면적에 조사된 조도의 최대,최소값은 10.9~0.6 [lx]이고, 주로 10~5 [lx] 값이 조도의 면적을 차지하였으며, 곡선은 옆으로 넓게 펼쳐진 곡선을 나타내었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.204.1-204.1
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• 2014

스마트폰과 같은 통신기기 및 각종 전자제품에 있어 크기의 축소와 간소화 추세에 따라 인쇄회로기판(PCB)의 초미세회로설계 기술이 요구됨에 따라, 인쇄회로기판과 첨단 전자부품 사이의 접합 신뢰성을 향상시키기 위해 무전해 니켈 도금이 널리 사용되고 있다. 일반적으로, 무전해 Ni도금은 강산, 강염기성 용액을 이용하여 수행되고 있다. 따라서, 공정과정 중에 기판의 손상을 초래하기도 할뿐만 아니라, 환경적으로도 문제시 되고 있다. 본 연구에서는 친환경적 도금공정의 개발을 위해 중성에서 N-(B)무전해 도금을 시행하였다. 중성의 무전해 도금공정은 어떠한 기판을 사용하여도 기판의 손상없이 도금이 가능하다는 장점을 가지고 있고, Boron(B)은 Ni을 비정질화 시키는 물질로 알려져 있다. B가 첨가된 무전해 Ni도금 박막에 있어 B의 영향을 알아보기 위하여 중성조건에서 B를 포함한 DMAB의 첨가량을 조절하였다. Ni-(B) 무전해 도금 시 도금조의 온도는 $40^{\circ}C$로 하였고, 무전해 도금액의 pH는 7(중성)로 유지하였다. Cu Foil기판을 사용하여 DMAB의 양에 따라 성장된 Ni-B무전해 도금 박막의 특성을 분석하기 위해 X-ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FE-SEM), Optical microscope (OM), X-ray Photoelectron Spectroscopy (XPS), X-ray Absorption Spectroscopy (XAS)을 이용하였다.

• ETRI Journal
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• v.31 no.6
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• pp.749-754
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• 2009

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heterojunction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cut-off frequency ($f_T$) of 129 GHz and a maximum oscillation frequency ($f_{max}$) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 $dB{\Omega}$. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.

• Korean Journal of Optics and Photonics
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• v.21 no.3
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• pp.118-122
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• 2010

We fabricated a high power LED lamp structure which utilizes the modified COB concept based on an MCPCB with insulation layer partially removed. In the proposed structure, no insulation layer exists between the LED chip and the metal base. As a result, the heat generated in the chip is easily dissipated through the metal base. In actual measurement as well as in thermal simulation, the fabricated LED lamp structure showed superb thermal properties, compared to the SMD LED lamp attached on an MCPCB or the LED lamp based on conventional COB concept.