Browse > Article
http://dx.doi.org/10.3807/KJOP.2010.21.3.118

A Study on High Power LED Lamp Structures  

Hong, Dae-Woon (Electronics Engineering Department, Chungnam National University)
Lee, Song-Jae (Electronics Engineering Department, Chungnam National University)
Publication Information
Korean Journal of Optics and Photonics / v.21, no.3, 2010 , pp. 118-122 More about this Journal
Abstract
We fabricated a high power LED lamp structure which utilizes the modified COB concept based on an MCPCB with insulation layer partially removed. In the proposed structure, no insulation layer exists between the LED chip and the metal base. As a result, the heat generated in the chip is easily dissipated through the metal base. In actual measurement as well as in thermal simulation, the fabricated LED lamp structure showed superb thermal properties, compared to the SMD LED lamp attached on an MCPCB or the LED lamp based on conventional COB concept.
Keywords
Light-emitting diode(LED); PCB; Solid state Light; COB; Dielectric;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 S. J. Lee, “A study on the photon extraction efficiency in ingan light-emitting diodes depending on chip structure and chip-mount schemes,” Opt. Eng. 45, 014601 (2006).   DOI
2 R. Huber, “Thermal management of golden DRAGON LED,” Application Note, Osram Opto Semiconductors, 1-11 (2008).
3 Y.-B. Yoon and J.-W. Park, “The thermal resistance of solder joints in high brightness light emitting diode (HB LED) packages,” IEEE Transactions on Components and Packaging Technologies 32, 825-831 (2009).   DOI
4 B. Fan, H. Wu, Y. Zhao, Y. Xian, and G. Wang, “Study of phosphor thermal-isolated packaging technologies for high-power white light-emitting diodes,” IEEE Photon. Technol. Lett. 19, 1121-1123 (2007).   DOI   ScienceOn
5 J. H. Lee, W. Chang, and D. Choi, “LED light coupler design for a ultra thin light guide,” J. Opt. Soc. Korea 11, 113-117 (2007).   DOI