• Proceedings of the Korean Society of Computer Information Conference
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• 2014.01a
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• pp.9-13
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• 2014

The performance of large scale software applications has been automatically increasing for last few decades under the influence of Moore's law - the number of transistors on a microprocessor roughly doubled every eighteen months. However, on-chip transistors limitations and heating issues led to the emergence of multicore processors. The energy efficient ARM based System-on-Chip (SoC) processors are being considered for future high performance computing systems. In this paper, we present a case study of two widely used parallel programming models i.e. MPI and MapReduce on distributed memory cluster of ARM SoC development boards. The case study application, Black-Scholes option pricing equation, was parallelized and evaluated in terms of power consumption and throughput. The results show that the Hadoop implementation has low instantaneous power consumption that of MPI, but MPI outperforms Hadoop implementation by a factor of 1.46 in terms of total power consumption to execution time ratio.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.85-95
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• 2004

As the design complexity increases, it is a major problem that the size of test pattern is large and power consumption is high in scan, especially system-on-a-chip(SoC), with the automatic test equipment(ATE). Because static compaction of test patterns heads to higher power for testing, it is very hard to reduce the test pattern volume for low power testing. This paper proposes an efficient compression/decompression algorithm based on run-length coding for reducing the amount of test data for low power testing that must be stored on a tester and be transferred to SoC. The experimental results show that the new algorithm is very efficient by reducing the memory space for test patterns and the hardware overhead for the decoder.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.245-252
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• 2003

We designed a silicon pressure sensor interface circuit with digital calibration capability. The interface circuit is composed of an analog section and a digital section. The analog section amplifies the weak signal from the sensor and the digital section handles the calibration function and communication function between the chip and outside microcontroller that controls the calibration. The digital section is composed of I2C serial interface, memory, trimming register and controller. The I2C serial interface is optimized to suit the need of on-chip silicon microsensor in terms of number of IO pins and silicon area. The major part of the design is to build a controller circuit that implements the optimized I2C protocol. The designed chip was fabricated through IDEC's MPW. We also made a test board and the test result showed that the chip performs the digital calibration function very well as expected.

• Journal of the Korean Institute of Intelligent Systems
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• v.14 no.4
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• pp.424-430
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• 2004

This paper explains the construction of the filesystems which could be utilized in embedded systems as an implementation of ubiquitous computing. It includes the formal architecture of filesystem hierarchy for the DOC (Disk-On-Chip) filesystem and the flash filesystem based on the MTD (Memory Technology Devices). For DOC, the root filesystem and the user filesystem are constructed by the TrueFFS supported by the M-Systems. For MTD filesystem, the root filesystem is implemented in the fast RAM disk, and the user filesystem is implemented in the JFFS2 that supports large capacity. In order to support the GUI filesystem, the porting process of Qt/E is also included in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Journal of IKEEE
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• v.21 no.3
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• pp.260-263
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• 2017

Based on several CPU cores, an SoC including ADCs, DC-DC converter and 2M-byte SRAM is proposed in this paper. The CPU core consists of a 12-bit MENSA, a 32-bit Symmetric multi-core processor, as well as 16-bit CDSP. To eliminate the external SDRAM memory, internal 2M-byte SRAM is implemented. Because the SRAM normally occupies huge area, the parasitic components reduce the speed of SoC. In this work, the SRAM blocks are divided into small pieces to reduce the parasitic components. The proposed SoC is developed in a standard 55nm CMOS process and the speed of SoC is 200MHz.

• The KIPS Transactions:PartC
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• v.9C no.2
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• pp.173-180
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• 2002

Smartcard is highlighted as infrastructure that has an excellent security for executing functions such as user authentication, access control, information storage and control, and its market is expanding rapidly. But possibilities of forgery and alteration by hacking are increasing as well. This Paper makes cut off of Smartcard forgery and alteration that use angular multiplexing and private key multiplexing hologram on holographic security Encryption, and proposes system capable verfication of forgery and alteration impossible on existing smartrard by adopting smartcard chip and holographic memory chip.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.11
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• pp.527-539
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• 2008

This paper presents a performance estimation technique based on queuing analysis for on-chip bus matrix architectures of Multi-Processor System-on-Chips(MPSoCs). Previous works relying on time-consuming simulation are not able to explore the vast design space to cope with increasing time-to-market pressure. The proposed technique gives accurate estimation results while achieving faster estimation time than cycle -accurate simulation by order of magnitude. We consider the followings for the modeling of practical memory subsystem: (1) the service time with the general distribution instead of the exponential distribution and (2) multiple-outstanding transactions to achieve high performance. The experimental results show that the proposed analysis technique has the accuracy of 94% on average and much shorter runtime ($10^5$ times faster at least) compared to simulation for the various examples: the synthetic traces and real-time application, 4-channel DVR.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.16 no.1
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• pp.46-56
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• 1991

In this paper, 16word X 8bit Content Addressable and Reentrant Memory(CARM) is described. This device has 4 operation modes(read, write, match, reentrant). The read and write operation of CARM is like that of static RAM, CARM has the reentrant mode operation where the on chip garbage collection is accomplished conditionally. Thus function can be used for high speed matching unit of dynamic data flow computer. And CARM also can encode matching address sequentially according to therir priority. CARM consists of 8 blocks(CAM cell, Sequential Address Encoder(S.A.E). Reentrant operation. Read/Write control circuit, Data/Mask Register, Sense Amplifier, Encoder. Decoder). Designed DARM can be used in data flow computer, pattern, inspection, table look-up, image processing. The simulation is performed using the QUICKSIM logic simulator and Pspice circuit simulator. Having hierarchical structure, the layout was done using the 3{\;}\mu\textrm{m} n well CMOS technology of the ETRI design rule.

• Journal of Broadcast Engineering
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• v.21 no.6
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• pp.944-956
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• 2016

In this paper, we propose a new hardware architecture to generate computer-generated holograms based on the block based calculation method and implement a VLSI (very large scaled integrated circuit) in ASIC (application specific integrated circuit) environment. The proposed hardware has a structure that can produce a part of a hologram in the unit of a block in parallel. After calculating a block of a hologram by using an object point, the calculation is repeated to all object points and intermediate results from them are accumulated to produce a final block of a hologram. Through this structure, we can make various size of holograms with the optimized memory access in real-time operation. The proposed hardware was implemented in the Hynix 0.18um CMOS technology of Magna chip Inc. and has 876,608 gate counts. It can generate complex holograms unlike the previous researches and stably operate in the clock frequency of 200MHz.