• 한국진공학회지
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• 제15권4호
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• pp.427-433
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• 2006

자발적인 미세상 분리에 의해 실린더형의 규칙적인 배열을 형성하는 고분자 공중합체와 알루미늄의 양극산화에 의해 실린더형 기공 배열이 형성되는 알루미나 템플레이트를 이용하여 다양한 물질의 나노점 배열을 형성하였다. 펄스형 레이저 기상 증착법을 이용하여 은, 니켈, 산화아연, 실리콘, 코발트 / 백금 나노점 배열을 얻었는데, 나노점의 크기와 배열은 템플레이트의 기공 크기와 배열을 보여주었다. 이러한 템플레이트 기법을 이용하면 나노점의 밀도는 고 분자 공중합체와 알루미나의 경우 각각 $6{\times}10^{11}/cm^2$ 와 $1{\times}10^{10}/cm^2$ 이다. 이중 에르븀이 도핑된 실리콘 나노점과 ZnO 나노점 배열은 PL 측정을 통하여 물질의 광학성질에 관해 알아보았다. 에르븀이 도핑된 실리콘 나노점 배열은 $1.54{\mu}m$에서 강한 빛을 내며 ZnO 나노점 배열은 380 nm 에서 강한 PL 세기를 나타낸다.

• 한국재료학회지
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• 제15권3호
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• pp.155-160
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• 2005

The electrolytic reduction of spent oxide fuel involves the liberation of oxygen in a molten LiCl electrolyte, which results in a chemically aggressive environment that is very corrosive fir typical structural materials. So, it is essential to choose the optimum material f3r the process equipment handling molten salt. In this study, the corrosion behavior of Al-Y coated Haynes 263 in a molten salt of $LiCl-Li_2O$ under oxidation atmosphere was investigated at $650^{\circ}C$ for $72\~168$ hours. The corrosion rate of Al-Y coated Haynes 263 was low while that of bare Haynes 263 was high in a molten salt of $LiCl-Li_2O$. Al-Y coated Haynes 263 improved the corrosion resistance better than bare Haynes 263 alloy. An Al oxide layer acts as a protective film which Prohibits Penetration of oxygen. Corrosion Products were formed $Li(Ni,Co)O_2$ and $LiTiO_2$ on bare Haynes 263, but $LiAlO_2,\;Li_5Fe_5O_8\;and\;LiTiO_2$ on Al-Y coated Haynes 263.

• 한국전기전자재료학회논문지
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• 제22권4호
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• pp.342-349
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• 2009

This study investigated the growth characteristics of carbon nanotubes (CNTs) by changing a period of annealing time and a $C_{2}H_{2}/H_2$ flow ratio at temperature as low as $450^{\circ}C$ with inductively coupled plasma chemical vapor deposition. The 1-nm-thick Fe-Ni-Co alloy thin film served as a catalyst layer for the growth of CNTs, which was thermally evaporated on the 15-nm-thick Al underlayer deposited on the 50-nm-thick Ti diffusion barrier. The annealing at low temperature of $450^{\circ}C$ brought about almost no granulation of the catalyst layer, and the CNT growth was not affected by a period of annealing time. A study of changing the flow rate of $C_{2}H_{2}$ and $H_2$ showed that as the ratio of the $C_{2}H_{2}$ flow rate to the $H_2$ flow rate was lowered, the CNTs were grown to be longer With further decreasing the flow ratio, the length of CNTs reached the maximum and then became shorter. Under the optimized gas flow rates, we successfully synthesized CNTs with a uniform length over a 4-inch Si wafer at $450^{\circ}C$.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.21-27
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• 2007

이방성 전도필름(ACF) 접합에 사용되는 니켈 범프를 무전해 및 전해 도금법으로 제작한 다음, 이 범프들의 기계적 특성과 충격안전성을 압축시험, 범프전단시험, 낙하충격시험을 통하여 연구하였다. Nano indenter를 이용한 압축시험에서 얻은 하중-변형량 데이터를 변환시켜 니켈범프의 응력-변형량 곡선을 구하였다. 전해 니켈 범프는 무전해 니켈 범프에 비해 매우 작은 탄성한계응력과 탄성계수를 나타냈었다. 무전해 니켈 범프의 탄성한계응력과 탄성계수가 각각 600-800MPa, $9.7{\times}10^{-3}MPa/nm$인 반면 전해 니켈 범프의 경우에는 각각 70MPa, $7.8{\times}10^4MPa/nm$이었다. 범프전단 시험에서 무전해 니켈 범프는 소성변형이 거의 일어나지 않고 낮은 전단하중에서 범프가 패드 층에서 튕기듯이 떨어져 나간 반면 전해 니켈 범프는 큰 소성변형을 일으키며 범프가 잘려나갔으며 높은 전단하중을 보여주었다. 낙하충격시험 결과 ACF 플립칩 방법으로 본딩한 무전해 및 전해 범프 모두 높은 충격 신뢰성을 보였다.

• Journal of Advanced Marine Engineering and Technology
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• 제22권5호
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• pp.660-669
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• 1998

In this paper the Hardness and Electro-chemical corrosion of the Nimonic 80A superalloy were studied. It aging heat treatments was carried out at $650^{\circ}C$, $700^{\circ}C$, $750^{\circ}C$,$800^{\circ}C$ and $850^{\circ}C$ with different time of 20min , 30min 1hour, 2hours, 4hours, and 16hours additionally 64hours and 128hours at $650^{\circ}C$. The obtained results were as follows; 1. As aging temperature increased the time for the maximum hardness was reduced from 128hours at $650^{\circ}C$ to 30min at $850^{\circ}C$ whereas the highest hardness was reduced from Hv 381 at $650^{\circ}C$ to Hv 321 at $850^{\circ}C$. 2. In the Electro-chemical corrosion test as a function of aging heat treatment time and tem-perature the corrosion potential was reversely proportional to Hardness which indicated the effects of ${\gamma}/{\gamma}'$ coherency of base material and precipitate. 3. Initiation point of the pitting was observed at grain boundary twin boundary and near${\gamma}'$ pre-cipitates. The results of composition analysis by EDS at this point indicated that sulphur originat-ed from 1N $H_2SO_4$ solution was found in depletion at the grain boundaries and the pit which arouse in the near precipitates were lack of Al Ti and Ni which are the main element of ${\gamma}'$ The depletion of such element was cause breakdown of passive film.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.380.2-380.2
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• 2014

Direct synthesis of graphene using a chemical vapor deposition (CVD) has been considered a facile way to produce large-area and uniform graphene film, which is an accessible method from an application standpoint. Hence, their fundamental understanding is highly required. Unfortunately, the CVD growth mechanism of graphene on Cu remains elusive and controversial. Here, we present the effect of graphene growth parameters on the number of graphene layers were systematically studied and growth mechanism on copper substrate was proposed. Parameters that could affect the thickness of graphene growth include the pressure in the system, gas flow rate, growth pressure, growth temperature, and cooling rate. We hypothesis that the partial pressure of both the carbon sources and hydrogen gas in the growth process, which is set by the total pressure and the mole fraction of the feedstock, could be the factor that controls the thickness of the graphene. The graphene on Cu was grown by the diffusion and precipitation mode not by the surface adsorption mode, because similar results were observed in graphene/Ni system. The carbon-diffused Cu layer was also observed after graphene growth under high CH4 pressure. Our findings may facilitate both the large-area synthesis of well-controlled graphene features and wide range of applications of graphene.

• 한국재료학회지
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• 제20권5호
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• pp.241-245
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• 2010

One of the weak points of the Cr-doped SZO is that until now, it has only been fabricated on perovskite substrates, whereas NiO-ReRAM devices have already been deposited on Si substrates. The fabrication of RAM devices on Si substrates is important for commercialization because conventional electronics are based mainly on silicon materials. Cr-doped ReRAM will find a wide range of applications in embedded systems or conventional memory device manufacturing processes if it can be fabricated on Si substrates. For application of the commercial memory device, Cr-doped $SrZrO_3$ perovskite thin films were deposited on a $SrRuO_3$ bottom electrode/Si(100)substrate using pulsed laser deposition. XRD peaks corresponding to the (112), (004) and (132) planes of both the SZO and SRO were observed with the highest intensity along the (112) direction. The positions of the SZO grains matched those of the SRO grains. A well-controlled interface between the $SrZrO_3$:Cr perovskite and the $SrRuO_3$ bottom electrode were fabricated, so that good resistive switching behavior was observed with an on/off ratio higher than $10^2$. A pulse test showed the switching behavior of the Pt/$SrZrO_3:Cr/SrRuO^3$ device under a pulse of 10 kHz for $10^4$ cycles. The resistive switching memory devices made of the Cr-doped $SrZrO_3$ thin films deposited on Si substrates are expected to be more compatible with conventional Si-based electronics.

• 한국세라믹학회지
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• 제43권5호
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• pp.299-303
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• 2006

In this paper, anode supported SOFC with columnar structured YSZ electrolyte was fabricated via Electron Beam Physical Vapor Deposition (EBPVD) method. Liquid condensation process was employed for the preparation of NiO-YSZ substrate and the high power electron beam deposition method was used for the deposition of YSZ electrolyte film. Double layered cathode with LSM-YSZ and LSM was printed on electrolyte via screen-printing method and fired at $1150^{\circ}C$ in air atmosphere for 3 h. The electrochemical performance and the long-term stability of $5{\times}5cm^2$ single cell were investigated with DC current-voltage characteristics and AC-impedance spectroscopy. According to the investigation, $5{\times}5cm^2$ sized unit cell showed the maximum power density of around $0.76W/cm^2$ at $800^{\circ}C$ and maintained the stable performance over 400 h.

• 한국태양에너지학회 논문집
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• 제32권4호
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• pp.43-50
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• 2012

Metal-metal oxide (M-M oxide) cermet solar selective coatings with a double cermet layer film structure were deposited on the Al-deposited glass substrate by using a directed current (DC) magnetron sputtering technology. M oxide (CrO and ZrO) was used as the ceramic component in the cermets, and Cr and Zr used as the metallic components. In addition, black Cr (Cr-$Cr_2O_3$ cermet) solar selective coatings were deposited on the Ni-plated Cu substrate by using a electroplating method for comparison. The thermal stability tests were carried out for performance evaluation of solar coatings. Reflectance measurements were used to evaluate both solar absorptance(${\alpha}$) and thermal emittance (${\epsilon}$) of the solar coatings before and after thermal testing by using a spectrometer. Optical properties of optimized cermet solar coatings were ${\alpha}{\simeq}0.94-0.96$ and ${\epsilon}{\simeq}0.1$ ($100^{\circ}C$). The results of thermal stability test of M-M oxide solar coatings showed that the Cr-CrO cermet solar selective coatings were more stable than the Zr-ZrO cermet selective coatings at temperature of both $400^{\circ}C$ in air and $450^{\circ}C$ in vacuum. The black Cr solar selective coatings were degraded in air at temperature of $400^{\circ}C$. The main optical degradation modes of these coatings were diffusion of metal atoms, and oxidation.

• Corrosion Science and Technology
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• 제17권4호
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• pp.154-165
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• 2018

During the process of sulfur dioxide removal, flue gas desulfurization equipment provides a serious internal corrosion environment in creating sulfuric acid dew point corrosion. Therefore, the utilities must use the excellent corrosion resistance of steel desulfurization facilities in the atmosphere. Until now, the trend in developing anti-sulfuric acid steels was essentially the addition of Cu, in order to improve the corrosion resistance. The experimental alloy used in this study is Fe-0.03C-1.0Mn-0.3Si-0.15Ni-0.31Cu alloys to which Ru, Zn and Ta were added. In order to investigate the effect of $H_2SO_4$ concentration and the alloying elements, chemical and electrochemical corrosion tests were performed. In a low concentration of $H_2SO_4$ solution, the major factor affecting the corrosion rate of low alloy steels was the exchange current density for $H^+/H_2$ reaction, while in a high concentration of $H_2SO_4$ solution, the major factors were the thin and dense passive film and resulting passivation behavior. The alloying elements reducing the exchange current density in low concentration of $H_2SO_4$, and the alloying elements decreasing the passive current density in high concentration of $H_2SO_4$, together play an important role in determining the corrosion rate of Cu-bearing low alloy steels in a wide range of $H_2SO_4$ solution.