• 월간포장계
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• 통권156호
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• pp.161-181
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• 2006

랩포장업계 친환경 종이톱날 랩 포장 개발/아세아제지(주) 골판지 업황개선 수혜 기대/(주)비트로시스 농춤시스템 및 파우치 포장기 시설갖춰/(주)시에이피사 이언스 위생패드 원팩 시스템 도입/다아라 KOREA PACK 2006 사이버전시 열어/제과업계 블루 마케팅 활기/(주)다이소아성산업 일본 1천만 달러 외자 유치/ 하이트맥주(주) 국내 대표맥주로 입지 굳혀/네이처웍스사 생분해성 PLA 제품설명회 개최/대주산업 CLOEREN DIES FEEDBLOCK 세미나 개최/식품업계 김 치,5대 건강식품 선정/롯데칠성음료(주) 델몬트콜드,냉장유통주스 대표상품/제약업체 낱알포자아 의무화 실시/금호페이퍼텍(주) 아세아페이퍼텍으로 상호변경/대한통운(주) 광양항 3단계 1차 컨테이너부두 계약/골판지업계 배추포장화사업 신규 수요 급증/신무림제지(주) 마케팅팀 YES센터 품질교육 실시/(주) Aimex2006 신제품 5개 기종 선보여

• Journal of Pharmaceutical Investigation
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• 제23권2호
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• pp.97-102
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• 1993

Hospital pharmacy services are divided into dispensing affairs for inpatients and outpatients, pharmaceutical service, stock control, intravenous admixture service, drug information service, pharmacokinetic consultation service, education and research work, etc. But among those affairs, dispensing affair for outpatient is perceived as the most important work in Korea, because it is linked directly with hospital service for patients. Therefore, total computer system for dispensing area was adopted from opening point of hospital in 1989 in Asan Medical Center. Utilization of computer system for outpatient dispensing area is as follows; 1) Order communication system of prescription by Total Hospital Information System, 2) Automatic print-out system of direction for use by sticker connected with on-line net work, 3) Use of automatic tablet counting and packaging machines connected with on-line net work. Those computer system resulted in curtailment of pharmacy manpower and shortening of waiting-time for outpatient.

• 한국포장학회지
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• 제13권1호
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• pp.25-28
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• 2007

Physical damage on fruits and vegetables caused by shock degrades the value of product in the fresh market. In order to design a product/package system to protect the product, the peak acceleration or G force to the product that causes shock damage needs to be determined. Shock cushion packaging is applied to protect goods of all kinds. It can be adapted in their shape to any product to be packed, so that its shock absorbing properties is determined by geometry of the product. The shape of a cushion can be adapted to the expected shock loads. To analyze the response properties of cushion materials for packaging of the pears for optimum packaging design during transportation, shock tests were carried out. Shock acceleration that is happened in pears were appeared very high by $25{\sim}30G$ in the input shock acceleration of 14.1618 G that was measured in transportation road. This means that the pears receive the shock acceleration more than maximum double itself and the damage by this can happen and the shock acceleration increase in case use PE tray cup and PE net in fruits, the use of corrugated fiberboard pad may become one method that it can reduce the damage by the shock in packaging of fruits.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.21-26
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• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.135-142
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• 2024

Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.

• Nuclear Engineering and Technology
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• 제53권5호
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• pp.1491-1510
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• 2021

This work presents an illustration of Nagra's AMAC (Advanced Methodology for Activation Characterization) approach to the South Korean pressurized water reactor Kori-1 decommissioning. The results achieved are supported by the existing experience from the detailed AMAC applications to Swiss NPPs and are used not only for a demonstration of the applicability of AMAC to South Korean NPPs, but also for a first approximation of the activated waste volumes to be expected from Kori-1. A packaging concept based on the above activation characterization is also presented, using the AMAC algorithmic optimization software ALGOPACK leading to the minimum number of waste containers needed given the selected packaging constraints. Nagra's AMAC enables effective planning before and during NPP decommissioning, including recommendations for cutting profiles for diverse reactor components and building structures. Finally, it is expected to lead to significant cost savings by reducing the number of expensive waste containers, by optimizing a potential melting strategy for metallic waste as well as by significantly limiting the number of radiological measurements. All information about Kori-1 used for the purpose of this study was collected from publicly available sources.

• 한국약용작물학회지
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• 제26권4호
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• pp.296-301
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• 2018

Background: The objective of this study was to investigate the effect of packaging material on the growth of rootstock of Liriope platyphylla. Methods and Results: This study examined the effects of two types of packaging material, LDPE (low density polyethylene) and functional film on the growth of the tubers of L. platyphylla, at $5^{\circ}C$. During the 16-weeks of storage period, the ratio of loss and decay of the tubers was examined at intervals of 4, 8, and 16 weeks to detect the quality of the plant. After 16 weeks of storage, the treated tubers were own. Subsequently, plant height and the number of leaves were recorded. The results revealed that functional film at $5^{\circ}C$ was the ideal material for the storage of L. platyphylla tubers. The rate of loss was the highest (57.42%) with a onion net and the lowest (22.12%) with a functional film. Similarly, the rate of tuber decay was highest (8.20%) using onion net and the least (4.60%) when the functional film was used. Conclusions: Thus, the use of the functional film proved to be the most effective in the storage of L. platyphylla tubers when compared with the LDPE.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• 한국포장학회지
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• 제27권2호
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• pp.109-114
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• 2021

The characteristics of vibrational stress (shock and vibration) during transport and the possibility of damage to the packaged pears by functional PLA tray were investigated. And this study was conducted to analyze how environmental conditions by simulated transport environment affect quality factors such as weight loss (%) and soluble solid content (SSC, %), and firmness (bioyield strength, kPa) of packaged pears by PLA tray and Expanded PET foam pad (Group 1), EPE cushion cup pad and net (Group 2) for exporting. Pears with or without vibration stress were stored for 30 days at low temperatures (5 ± 0.8℃, 80 ± 5% relative humidity). There was the statistically significant difference (p ≤ 0.05) between pears with and without vibration stress for weight loss, soluble solid content, and firmness (bioyield strength) after 30 days storage. Vibration stress accelerated pear quality deterioration during storage, resulting in increased weight loss, soluble solids content, and reduced hardness. The firmness (bioyield strength) and weight changes of pears with PLA trays were smaller than those of conventional packaging box systems. It was determined that the firmness of agricultural products was a quality factor closely related to the storage period and that PLA could be applied.