• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.7 s.238
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• pp.998-1004
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• 2005

A nano-stereolithography (NSL) process has been developed for fabrication of 3D shell structures which can be applied to various nano/micro-fluidic devices. By the process, a complicated 3D shell structure on a scale of several microns can be fabricated using lamination of layers with a resolution of 150 nm in size, so it does not require the use of my sacrificial layer or any supporting structure. A layer was fabricated by means of solidifying liquid-state monomers using two-photon absorption (TPA) induced using a femtosecond laser processing. When the polymerization process is finished, unsolidified liquid state resins can be removed easily by dropping several droplets of ethanol fur developing the fabricated structure. Through this work, some 3D shell structures, which can be applied to various applications such as nano/micro-fluidic devices and MEMS system, were fabricated using the developed process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.448-451
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• 2003

This study describes a new maskless nano-fabrication technique of Si (100) using the combination of nanometer-scale mechanical forming by nano-indenter XP and KOH wet etching. First the surface of a Si (100) specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact, some sample structures were fabricated.

• Transactions on Electrical and Electronic Materials
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• v.10 no.2
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• pp.35-39
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• 2009

A novel Helmholtz coil inductively coupled plasma(H-ICP) etcher is proposed and characterized for deep nano-scale CMOS technology. Various hardware tests are performed while varying key parameters such as distance between the top and bottom coils, the distance between the chamber ceiling and the wafer, and the chamber height in order to determine the optimal design of the chamber and optimal process conditions. The uniformity was significantly improved by applying the optimum conditions. The plasma density obtained with the H-ICP source was about $5{\times}10^{11}/cm^3$, and the electron temperature was about 2-3 eV. The etching selectivity for the poly-silicon gate versus the ultra-thin gate oxide was 482:1 at 10 sccm of $HeO_2$. The proposed H-ICP was successfully applied to form multiple 60-nm poly-silicon gate layers.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.3
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• pp.162-168
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• 2006

To fabricate nanometer scale InGaAs HEMTs, we have successfully developed various novel nano-patterning techniques, including sidewall-gate process and e-beam resist flowing method. The sidewall-gate process was developed to lessen the final line length, by means of the sequential procedure of dielectric re-deposition and etch-back. The e-beam resist flowing was effective to obtain fine line length, simply by applying thermal excitation to the semiconductor so that the achievable final line could be reduced by the dimension of the laterally migrated e-beam resist profile. Applying these methods to the device fabrication, we were able to succeed in making 30nm $In_{0.7}Ga_{0.3}As$ HEMTs with excellent $f_T$ of 426GHz. Based on nanometer scale InGaAs HEMT technology, several high performance millimeter-wave integrated circuits have been successfully fabricated, including 77GHz MMIC chipsets for automotive radar application.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.371-376
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process, simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during Compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10a
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• pp.45-46
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• 2003

A process control system has been developed for measurement and characterization of the nanofiber web qualities. The nano-fiber information system (NAFIS) developed consists of a measurement device and an analysis algorithm, which are a microscope-laser sensor fusion system and a process information system, respectively. It has been found that NAFIS is so successful in detecting irregularities of pore and diameter that the resulting product has been quitely under control even at the high production rate. Pore distribution, fiber diameter and mass uniformity have been readily measured and analyzed by integrating the non-contact measurement technology and the random function-based time domain signal/image processing algorithm. Qualifies of the nano-fiber webs have been revealed in a way that the statistical parameters for the characteristics above are calculated and stored in a certain interval along with the time-specific information. Quality matrix, scale of homogeneity is easily obtained through the easy-to-use GUI information. Finally, ANFIS has been evaluated both for the real-time measurement and analysis, and for the process monitoring.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.365-370
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• 2017

In this article, a 20 kHz Titanium (Ti) ultrasonic waveguide system for a nano-surface reformation process was designed and fabricated. First, finite element analysis using ANSYS software was performed to find the optimal dimensions. The obtained anti-resonance frequency for the Ti transducer with the piezoelectric device was 20.0 kHz, which value agreed well with the experiment result of 20.1 kHz (0.5% error). To test the system, chromium molybdenum steel (SCM) 435 was chosen as a test-piece. The result proved that the reformed depth was $36{\mu}m$. In addition, hardness was measured before and after the process. The value was changed from 14 HRC to 21 HRC, which is 50% increasing rate. Finally, the friction coefficient test result showed that the surface coefficient was reduced from 0.14 to 0.10 (28.6% reduction). Based on the results, the Ti ultrasonic equipment is regarded as a useful device for nano-scale surface reformation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1754-1761
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• 2003

The atomic force microscopy (AFM) based lithographic technique has been used directly to machine material surface and fabricate nano components in MEMS (micro electro mechanical system). In this paper, three-dimensional molecular dynamics (MD) simulations have been conducted to evaluate the characteristic of deformation process at atomistic scale for nano-lithography process. Effects of specific combinations of crystal orientations and cutting directions on the nature of atomistic deformation were investigated. The interatomic force between diamond tool and workpiece of copper material was assumed to be derived from the Morse potential function. The variation of tool geometry and cutting depth was also evaluated and the effect on machinability was investigated. The result of the simulation shows that crystal plane and cutting direction significantly influenced the variation of the cutting forces and the nature of deformation ahead of the tool as well as the surface deformation of the machined surface.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1115-1119
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• 2014

In this article, a 20 kHz ultrasonic waveguide for nano-surface treatment was designed and manufactured. When designing the system, finite element analysis with ANSYS software was performed to find optimal dimensions of the waveguide, which can raise energy efficiency. Consequently an anti-resonance frequency of an Al waveguide with a piezoelectric actuator was 20 kHz, which predicted the experimentally obtained value of 18 kHz well. For the assessment of the performance, Steel Use Stainless (SUS) 304 and chromium molybdenum steel (SCM) 435 specimens were tested. Cross-sectional microscopies of SUS304 were taken and they showed that the treated thickness was $30{\mu}m$. Additionally, hardness tests of SCM435 were done and the hardness before the process was 14.0 Rockwell Hardness-C scale (HRC) and after the process was 20.5 HRC, respectively, which means 46% increase. Considering these results, the developed ultrasonic system is thought to be effective in the nano-surface treatment process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.44-47
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• 2004

Although bulk metallic glasses have many outstanding aspects in their chemical, mechanical or functional properties, some critical problems still hinder their wide application. The most important one is the brittle nature of them, which is the serious problem to structural application. So, to use viscous flow is now the only competent way to form bulk metallic glass. In this study, we investigated the basic nature of viscous flow of Zr-base bulk metallic glass, vitrelloy 1, in terms of process variables. The results were used to design the thermo-mechanical process composed of heating, holding, pressing, and cooling, which have unique influence on the glass transition and crystallization behavior. We adopted small load scale and dies with nano/micro patterns on them. The results were evaluated using several analytical methods.