• Laser Solutions
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• v.14 no.2
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• pp.17-23
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• 2011

Active thin films are ubiquitous in the manufacture of all forms of flat panel display (FPD). One of the most widely employed thin films is indium tin oxide (ITO) and metal films used electrically conductive materials in display industries. ITO is widely used for fabrication of LCD, OLED device, and many kinds of optical applications because of transparency in visible range and its high conductivity and metal films are also widely employed as electrodes in various electric and display industries. It is important that removing specific area of layer, such as ITO or metal film on substrate, to fabricate and repair electrode in display industries. In this work, we demonstrate efficient selective ablation process to ITO and aluminum film on glass using a femtosecond laser (${\lambda}p=1025nm$) respectively. The femtosecond laser with wavelength of 1025nm, pulse duration of 400fs, and the repetition rate of 100kHz was used for selectively removing ITO and Al on glass in the air. We can successfully remove the ITO and Al films with various pulse energies using a femtosecond laser.

• Journal of Powder Materials
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• v.20 no.5
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• pp.355-358
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• 2013

Micro trench structures are applied in gratings, security films, wave guides, and micro fluidics. These micro trench structures have commonly been fabricated by micro electro mechanical system (MEMS) process. However, if the micro trench structures are machined using a diamond tool on large area plate, the resulting process is the most effective manufacturing method for products with high quality surfaces and outstanding optical characteristics. A nonferrous metal has been used as a workpiece; recently, and hybrid materials, including polymer materials, have been applied to mold for display fields. Thus, the machining characteristics of polymer materials should be analyzed. In this study, machining characteristics were compared between nonferrous metals and polymer materials using single crystal diamond (SCD) tools; the use of such materials is increasing in machining applications. The experiment was conducted using a square type diamond tool and a shaper machine tool with cutting depths of 2, 4, 6 and 10 ${\mu}m$ and a cutting speed of 200 mm/s. The machined surfaces, chip, and cutting force were compared through the experiment.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.2
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• pp.5-11
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• 2005

Among the micro machining techniques, micro EDM is generally used for machining micro holes, pockets, and micro structures on difficult-cut-materials. Micro EDM parameters such as applied voltage, capacitance, peak current, pulse width, duration time are very important to fabricate the tool electrode and produce the micro structures. Developed micro EDM machine is composed of a 3-axis driving system and RC circuit equipped with pulse generator. In this paper, using micro EDM machine, the characteristics of micro EDM process are investigated and it is applied to micro holes, slots, and pockets machining. Through experiments, relations between machined surface and voltages and between MRR and feedrate are investigated. Also the trends of tool wear are investigated in case of hole and slot machining.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.7-14
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• 2008

• Journal of the Optical Society of Korea
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• v.7 no.3
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• pp.160-164
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• 2003

Materials processing by ultrashort pulsed laser is actively being applied to micromachining technology due to its advantages with regard to non-thermal machining. In this study, materials processing with ultrashort pulses was studied by using the high repetition rate of a 800 nm Ti:sapphire regenerative amplifier. This revealed that the highly precise micromachining of metallic thin film and bulk glass with a minimal heat affected zone (HAZ) could be obtained by using near damage threshold energy. Grooves with diffraction limited sub-micrometer width were obtained with widths of 620 nm on Cr thin film and 800 nm on a soda-lime glass substrate. The machined patterns were investigated through SEM images. We also phenomenologically examined the influence of variations of parameters and proposed the optimal process conditions for microfabrication.

• Design & Manufacturing
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• v.14 no.2
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• pp.56-61
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• 2020

Recently, research for machining next-generation micro semiconductor processes and micro patterns has been actively conducted. In particular, it is applied to various industrial fields depending on the machining method in the case of FIB (Focused ion beam) milling. In this study, intends to deal with FIB milling machining technology for ultra-precision diamond tool fabrication technology. Ultra-precision diamond tools require nano-scale precision, and FIB milling is a useful method for nano-scale precision machining. However, FIB milling has a problem of Gaussian characteristics that are differently formed according to the beam current due to the input of an ion beam source, and there are process conditions to be considered, such as a side clearance angle problem of a diamond tool that is differently formed according to the tilting angle. A series of process steps for fabrication a ultra-precision diamond tool were studied and analyzed for each process. It was confirmed that the effect on the fabrication process was large depending on the spot size of the beam and the current of the beam as a result of the experimental analysis.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.10
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• pp.41-47
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• 2008

This study aims to obtain machining characteristics during AFM (Atomic force Microscope) machining of silicon wafers and to monitor the machining states using acoustic emission. As in micro scale machining, two distinct regimes of deformation, i. e. ploughing regime and cutting regime were observed. First, the transition between the two regimes are investigated by analyzing the "pile-up" during machining. As far as in process monitoring is concerned, in the ploughing repime, no chips have been formed and related AE RMS values are relatively low, In the mean time, in the cutting regime, the RMS values are significantly higher than the ploughing regime, with apparent chip formation. From the results, we found out that the proposed scheme can be used for the monitoring of nanomachining, especially for the characterization of nanocutting mode transition.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.8
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• pp.84-90
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• 2010

In focused ion beam (FIB) fabrication processes the ion beam intensity with Gaussian profile has a drawback for high resolution machining. In this paper, the fabrication method to modify the beam profile at substrate using silt mask is proposed to increase the machining resolution at high current. Slit mask is utilized to block the part of beam and transmit only high intensity portion. A nano manipulator is utilized to handle the silt mask. Geometrical analysis on fabricated profile through silt mask was conducted. By utilizing proposed method, improvement of machining resolution was achieved.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.6
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• pp.638-643
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• 2013

Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.19-20
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• 2006