Browse > Article

Characterization of AFM machining mode and Acoustic Emission monitoring  

Ahn, Byoung-Woon (Department of Mechanical Engineering, hanyang Univ.)
Lee, Seoung-Hwan (Department of Mechanical design & Mechatronics System, hanyang Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.25, no.10, 2008 , pp. 41-47 More about this Journal
Abstract
This study aims to obtain machining characteristics during AFM (Atomic force Microscope) machining of silicon wafers and to monitor the machining states using acoustic emission. As in micro scale machining, two distinct regimes of deformation, i. e. ploughing regime and cutting regime were observed. First, the transition between the two regimes are investigated by analyzing the "pile-up" during machining. As far as in process monitoring is concerned, in the ploughing repime, no chips have been formed and related AE RMS values are relatively low, In the mean time, in the cutting regime, the RMS values are significantly higher than the ploughing regime, with apparent chip formation. From the results, we found out that the proposed scheme can be used for the monitoring of nanomachining, especially for the characterization of nanocutting mode transition.
Keywords
Atomic Force Microscope; Nano Machining; Acoustic Emission; Machining Mode;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Nakazawa, H., "Principles of precision engineering," Oxfordscience publications, 1994
2 Komanduri, R., Chandrasekaran, N. and Raff, L. M., "MD Simulation of nanometric cutting of single crystal aluminum effect of crystal orientation and direction of cutting," wear, Vol. 242, Issue 1-2, pp. 60-88, 2000   DOI   ScienceOn
3 Kim, C. I., Yang, S. H. and Kim, Y. S., "Computer simulation of nano material behavior using molecular dynamics," Transactions of Materials Processing, Vol. 12, No. 3, pp. 171-178, 2003   DOI
4 Mulliah, D., Kenny, S. D., McGee, E., Smith, R. and Wolf, B., "Atomistic modeling of ploughing friction in silver, iron and silicon," Nanotechnology, Vol. 17, No. 8, pp. 1807-1818, 2006   DOI   ScienceOn
5 Koshimizu, S. and Otsuka, J., "Detection of ductile to brittle transition in micro indentation and micro scratching of single crystal silicon using acoustic emission," Journal of machining science and technology, Vol. 5, Issue 3, pp. 101-114, 2001   DOI   ScienceOn
6 Rabinowicz , E., "Friction and wear of materials," 2nd edn., John Wiley & Sons, 1995
7 Ngoi, B. K. and Sreejith, P. S., "Ductile regime finish machining-A review," International journal of Adv. Manuf. Technology, Vol. 16, No. 8, pp. 547-550, 2000   DOI
8 Yan, Y. D., Sun, T., Dong, S., Luo, X. C. and Liang,Y. C., "Molecular dynamics simulation of process-ing using AFM pin tool," Applied surface science, Vol. 252, Issue 20, pp. 7523-7531, 2006   DOI   ScienceOn
9 Xuemei, C., "Monitoring and Analysis of Ultra-Precision Machining Processes Using Acoustic Emission," Ph. D. thesis, Department of Mechanical Engineering, University of California, 1998
10 Bhushan, B., "Principles and Applications of Tribology," Wiley, pp. 350-450, 1999
11 Taniguchi, N., "Fundamentals and applications of nano technology," Kogyo Chosakai, 1988
12 Hokkirigawa, K., Kato, K. and Li, Z., "the effect of hardness on the transition of abrasive wear mechan-ism of steels," Wear, Vol. 123, Issue 2, pp. 241-251, 1988   DOI   ScienceOn
13 Faulkner, L. L., "Micromachining of engineering materials," Joseph McGeough, 1999
14 Bai, M., "Scratch-wear resistance of nanoscale super thin carbon nitride overcoat evaluated by AFM with a diamond tip," Surface and Coatings Technology Vol. 126, No. 2, pp. 181-194, 2000   DOI   ScienceOn
15 Blackley, W. S. and Scattergood, R. O.,'Ductile-regime grinding : A new technology for machining brittle materials,' Journal of precision engineering, Vol. 13, No. 2, pp. 95-103, 1991   DOI   ScienceOn
16 Sundararajan, S. and Bhushan, B., "Micro/nanotribo-logy of ultra-thin hard amorphous carbon coatings using atomic/ friction force microscopy," Wear, Vol. 225-229, Part 1, pp. 678-689, 1999   DOI   ScienceOn