[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.3807/JOSK.2003.7.3.160

Micromachining of Cr Thin Film and Glass Using an Ultrashort Pulsed Laser

Choi, Ji-Yeon (Nano process group, Korea Institute of Machinery and Materials)
Kim, Jae-Gu (Nano process group, Korea Institute of Machinery and Materials)
Shin, Bo-Sung (Nano process group, Korea Institute of Machinery and Materials)
Whang, Kyung-Hyun (Nano process group, Korea Institute of Machinery and Materials)

Publication Information

Journal of the Optical Society of Korea / v.7, no.3, 2003 , pp. 160-164 More about this Journal

Abstract

Materials processing by ultrashort pulsed laser is actively being applied to micromachining technology due to its advantages with regard to non-thermal machining. In this study, materials processing with ultrashort pulses was studied by using the high repetition rate of a 800 nm Ti:sapphire regenerative amplifier. This revealed that the highly precise micromachining of metallic thin film and bulk glass with a minimal heat affected zone (HAZ) could be obtained by using near damage threshold energy. Grooves with diffraction limited sub-micrometer width were obtained with widths of 620 nm on Cr thin film and 800 nm on a soda-lime glass substrate. The machined patterns were investigated through SEM images. We also phenomenologically examined the influence of variations of parameters and proposed the optimal process conditions for microfabrication.

Keywords

Citations & Related Records

Reference

1	T. Q. Qiu and C. L. Tien, “Heat transfer mechanisms during short-pulse laser heating of metals,” J. of Heat Transfer, vol. 115, pp. 835-841, 1993. DOI ScienceOn
2	S. Valette, R. Le Harzie, E. Audouard, N. Hout, and R. Fortunier, “Modeling thermal effects produced by nanosecond and femtosecond laser pulses applied to metals,” in ICALEO Proc. '02, 2002.
3	B. N. Chichkov, F. Korte, J. Koch, and S. Nolte, “Femtosecond laser ablation and nanostructuring,” High Power Laser Ablation IV, Proc. SPIE, vol. 4760, pp. 19-24, 2002. DOI
4	S. Nolte, C. Momma, G. Kamlage, A. Ostendorf, C. Fallnich, F. von Alvensleben, and H. Welling, “Polarization effects in ultrashort-pulse laser drilling,” Appl. Phys. A, vol. 68, pp. 563-567, 1998. DOI
5	C. B. Schaffer, Interaction of femtosecond laser pulses with transparent materials, (Ph.D. thesis, Harvard University, USA, 2001).
6	S Ameer-Beg, W. Perrie, S. Rathbone, J. Wright, W. Weaver, and H. Champoux, “Femtosecond laser micromachining of materials,” Applied Surface Science, vol. 127-129, pp. 875-880, 1998. DOI ScienceOn
7	A. Rosenfeld, M. Lorenz, R. Stoian, and D. Ashkenasi, “Ultrashort-laser-pulse damage threshold of transparent materials and the role of incubation,” Appl. Phys. A, vol. 69, pp. 373-276, 1999. DOI
8	D. Strickland and G. Mourou, “Compression of amplified chirped optical pulses,” Opt. Comm., vol. 56, pp. 219-222, 1985. DOI ScienceOn
9	C. B. Schaffer and E. Mazur, “Micromachining using ultrashort pulses from a laser oscillator,” Optics and Photonics news, vol. April, pp. 20-24, 2001.
10	L. A. Walker II, R. L. Maynard, and W. Clark, “Atmospheric affects on ultrashort-pulsed materials processing,” in ICALEO Proc. '02, 2002.