• Journal of Powder Materials
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• v.10 no.6
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.

• Korean Journal of Materials Research
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• v.30 no.3
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• pp.149-154
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• 2020

A powder-in-sheath rolling method is applied to the fabrication of a carbon nano tube (CNT) reinforced copper composite. A copper tube with outer diameter of 30 mm and wall thickness of 2 mm is used as sheath material. A mixture of pure copper powder and CNTs with a volume content of 3 % is filled in a tube by tap filling and then processed to an 93.3 % reduction using multi-pass rolling after heating for 0.5 h at 400 ℃. The specimen is then sintered for 1h at 500 ℃. The relative density of the 3 vol%CNT/Cu composite fabricated using powder in sheath rolling is 98 %, while that of the Cu powder compact is 99 %. The microstructure is somewhat heterogeneous in width direction in the composite, but is relatively homogeneous in the Cu powder compact. The hardness distribution is also ununiform in the width direction for the composite. The average hardness of the composites is higher by 8Hv than that of Cu powder compact. The tensile strength of the composite is 280 MPa, which is 20 MPa higher than that of the Cu powder compact. It is concluded that the powder in sheath rolling method is an effective process for fabrication of sound CNT reinforced Cu matrix composites.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.57-62
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• 2008

The aim of this investigation was to extract the fatigue properties at the designated fatigue life of copper foil and observe the mean stress and stress amplitude effects on both the fatigue life and the corresponding surface morphology. Tensile tests were performed to determine the baseline monotonic material properties of the proportional limit and ultimate tensile strength. Constant amplitude fatigue tests were carried out using a feedback-controlled fatigue testing machine. The mean stress and the stress amplitude were changed to obtain the complete nominal stress-life curves. An atomic force microscope was utilized to observe the relationship between the fatigue damage and the corresponding changes in surface morphology. A Basquin's exponent of-0.071 was obtained through the fatigue tests. An endurance limit of 122 MPa was inferred from a Haigh diagram. The specimen surface became rougher as the number of fatigue cycles increased, and there was a close relationship between the fatigue damage and the surface roughness evolution.

• Journal of Powder Materials
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• v.10 no.2
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• pp.136-141
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• 2003

In the present study, $TiO_2$ imbedded copper matrix powders have been successfully prepared from the ($CuSO_4+TiO_2+Zn$) composite salt solution. The composite $Cu/TiO_2$ powders were formed by drying the solution at $200{\sim}~400^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting TOC (total organic carbon) amount with TOC analyzer (model 5000A Shimadzu Co). Phase analysis of $Cu/TiO_2$ composite powders was carried out by XRD, DSC and powder size was measured with TEM. The mean particle size of composite powders was about 100 nm and a few zinc and copper oxide phases was included. The reduction ratio of TOC amount was 60% by the composite $Cu/TiO_2$ powders under the UV irradiation for 8 hours.

• Journal of Environmental Science International
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• v.21 no.11
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• pp.1333-1338
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• 2012

In order to measure the minute amount of Cu(II) in our environment, cyclic voltammetry (CV) and square-wave stripping voltammetry (SWSV) were performed for a trace copper assay using bismuth immobilized on a carbon nanotube paste electrode. An analytical working range of 30 to $240{\mu}g/L$ Cu(II) was obtained for CV and SWSV. The SWSV precision obtained was 0.47 % (n = 15) RSD in $30.0{\mu}g/L$ Cu(II). The detection limit obtained was 3.1 ng/L Cu(II) using SWSV, while the CV yielded the nano-range detection limit through the pre-concentration step. By using this research method, Cu(II) value could be determined in the urine of human sample and in the brain of fish sample. This research can be effectively applied to other cases of measuring minute amount of Cu(II) in living organisms.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Bulletin of the Korean Chemical Society
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• v.31 no.1
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• pp.100-103
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• 2010

In this study, NO reduction behaviors of copper-loaded mesoporous molecular sieves (Cu/MCM-41) have been investigated. The Cu loading on MCM-41 surfaces was accomplished by a chemical reduction method with different Cu contents (5, 10, 20, and 40%). $N_2/77$ K adsorption isotherm characteristics, including the specific surface area and pore volume, were studied by BET's equation. NO reduction behaviors were confirmed by a gas chromatography. From the experimental results, the Cu loading amount on MCM-41 led to the increase of NO reduction efficiency in spite of decreasing the specific surface area of catalysts. This result indicates that highly ordered porous structure in the MCM-41 and the presence of active metal particles lead the synergistical NO reduction reactions due to the increase in adsorption energy of MCM-41 surfaces by the Cu particles.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.397-401
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• 2008

Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.4
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• pp.49-54
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• 2005

In this paper, micro structuring technique using localized electrochemical deposition (LECD) with ultra short pulses was investigated. Electric field in electrochemical cell was localized near the tool tip end region by applying pulses of a few hundreds of nano second duration, Pt-Ir tip was used as a counter electrode and copper was deposited on the copper substrate in mixed electrolyte of 0.5 M $CuSO_4$ and 0.5 M $H_2SO_4$, The effectiveness of this technique was verified by comparison with ECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration were investigated. The proper condition was selected based on the results of the various experiments. Micro columns less than $10{\mu}m$ in diameter were fabricated using this technique. The real 3D micro structures such as micro spring and micro pattern were made by the presented method.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.27-30
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• 2005

A nanoelectromechanical (NEM) switching device based on carbon nanotube (CNT) was investigated using atomistic simulations. The model schematics for a CNT based three-terminal NEM switching device fabrication were presented. for the CNT-based three-terminal NEM switch, the interactions between the CNT-lever and the drain electrode or the substrate were very important. When the electrostatic force applied to the CNT-lever was the critical point, the CNT-lever was rapidly bent because of the attractive foroe between the CNT-lever and the drain. The energy curves for the pull-in and the pull-out processes showed the hysteresis loop that was induced by the adhesion of the CNT on the copper, which was the interatomic interaction between the CNT and the copper.