• Journal of the Korean Ceramic Society
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• v.49 no.5
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.410-410
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• 2012

The continuous monolayer graphene was synthesized on electro-polished copper foil. Electro-polishing sticks off the coating layer of copper foil, which prevents the continuous graphene growth. The quality of continuous graphene is dependent on roughness of copper foil. Copper foil roughness could be controlled by changing polishing condition. The effects of working voltage (4-6 V) and time (30-70 sec) for electro-polishing were systematically examined. The change of surface roughness was checked with AFM.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.434-434
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• 2011

Electrochemical method have been employed in this work to modify the chemical vapour deposited nitrogen doped hydrogen amorphous diamond-like carbon (N-DLC) film to fabricate nickel and copper nano particle modified N-DLC electrodes. The electrochemical behaviour of the metal nano particle modified N-DLC electrodes have been characterized at the presence of glucose in electrolyte. Meanwhile, the N-DLC film structure and the morphology of metal nano particles on the N-DLC surface have been investigated using micro-Raman spectroscopy, X-ray photoelectron spectroscopy and atomic force microscopy. The nickel nano particle modified N-DLC electrode exhibits a high catalytic activity and low background current, while the advantage of copper modified N-DLC electrode is drawn back by copper oxidizations at anodic potentials. The results show that metal nano particle modification of N-DLC surface could be a promising method for controlling the electrochemical properties of N-DLC electrodes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• Korean Journal of Materials Research
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• v.15 no.6
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.

• Bulletin of the Korean Chemical Society
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• v.29 no.5
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• pp.1033-1037
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• 2008

A copper cyclam-type complex was successfully immobilized onto mesoporous silica SBA-16. Characterization by NIR spectroscopy and TGA analysis confirmed that copper cyclam complex is immobilized onto mesoporous SBA-16. The Cu(II)-Cyclam-SBA-16 was proven to be a good catalyst for oxidation reaction of cyclohexene with conversion up to 77.8% after 13 h reaction and providing a high selectivity to cyclohexenol and 3-hydroperoxycyclohex-1-ene. The results suggest that the copper species play a major role as catalyst via reversible redox cycles as proven by cyclic voltammetry analysis.

• Journal of Powder Materials
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• v.16 no.2
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• pp.131-137
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• 2009

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.441-446
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• 2005

The copper oxide nano powders were synthesized by levitational gas condensation (LGC) method, and were applied to catalyst to fabricate 3,4-dihydropyrimidin-2-(1H)-one. Processes of adsorption of Biginelli reaction reagents on the copper nanooxide surface $Cu_2O{\circ}CuO$ were studied by IR-spectroscopy. It was shown that benzaldehyde coordination, acetoacetic ether on the oxide surface is carried out with participation of carbonyl fragments, urea by N-H bonds which affects positively on the reagents reactivity.