DOI QR코드

DOI QR Code

Effects of Surfactant and Preplate Process on Electroless Copper Plating on Carbon Nano-fiber

탄소나노섬유 표면 구리 무전해 도금에 미치는 분산제와 도금 전처리의 영향

  • Han, Jun-Hyun (Advanced Functional Materials Research Center, Korea Institute of Science & Technology) ;
  • Seok, Hyun-Kwang (Advanced Functional Materials Research Center, Korea Institute of Science & Technology) ;
  • Lee, Sang-Soo (Hybrid Materials Research Center, Korea Institute of Science & Technology) ;
  • Jee, Kwang-Koo (Advanced Functional Materials Research Center, Korea Institute of Science & Technology)
  • 한준현 (한국과학기술연구원 기능금속 연구센터) ;
  • 석현광 (한국과학기술연구원 기능금속 연구센터) ;
  • 이상수 (한국과학기술연구원 하이브리드재료 연구센타) ;
  • 지광구 (한국과학기술연구원 기능금속 연구센터)
  • Published : 2009.04.28

Abstract

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

Keywords

References

  1. S. B. Lee, K. Matsunaga, Y. Ikuhara and S.-K. Lee: Mater. Sci. Eng. A, 449-451 (2007) 778 https://doi.org/10.1016/j.msea.2006.02.377
  2. M. Y. Chen, Z. Bai, S. C. Tan and M. R. Unroe: Wear, 252 (2002) 624 https://doi.org/10.1016/S0043-1648(02)00021-2
  3. Y. K. Choi, K. I. Sugimoto, S. M. Song and M. Endo: Mater. Lett., 59 (2005) 3514 https://doi.org/10.1016/j.matlet.2005.05.082
  4. Y. Zhou, F. Pervin, S. Jeelani and P. K. Mallick: J. Mater. Proce. Tech., 198 (2008) 445 https://doi.org/10.1016/j.jmatprotec.2007.07.028
  5. S. Maensiri, P. Laokul, J. Klinkaewnarong and V. Amornkitbamrung: Mater. Sci. Eng. A, 447 (2007) 44 https://doi.org/10.1016/j.msea.2006.08.009
  6. J. Niedziolka, M. A. Murphy, F. Marken and M. Opallo: Electrochimica Acta, 51 (2006) 5897 https://doi.org/10.1016/j.electacta.2006.03.028
  7. A. Rohatgi, J. P. Thomas, J. N. Baucom, W. R. Pogue III, L. B. Cerully, D. M. Ebenstein and K. J. Wahl: Scrip. Mater., 58 (2008) 25 https://doi.org/10.1016/j.scriptamat.2007.09.008
  8. R. Sadeghian, S. Gangireddy, B. Minaie and K.-T. Hsiao: Compo. Part A, Appl. Sci. Manufac., 37 (2006) 1787 https://doi.org/10.1016/j.compositesa.2005.09.010
  9. F. Dalmas, J.-Y. Cavaille, C. Gauthier, L. Chazeau and R. Dendievel: Compo. Sci. Tech., 67 (2007) 829 https://doi.org/10.1016/j.compscitech.2006.01.030
  10. T.-H. Hou, C.-H. Su and W.-L. Liu: Powder Tech., 173 (2007) 153 https://doi.org/10.1016/j.powtec.2006.11.019
  11. S.-H. Yoon, S. Lim, S.-H. Hong, I. Mochida, B. An and K. Yokogaw: Carbon, 42 (2004) 3087 https://doi.org/10.1016/j.carbon.2004.07.022
  12. G. G. Tibbetts, M. L. Lake, K. L. Strong and B. P. Rice: Compo. Sci. Tech., 67 (2007) 1709 https://doi.org/10.1016/j.compscitech.2006.06.015