• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• Journal of Powder Materials
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• v.16 no.2
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• pp.131-137
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• 2009

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.441-446
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• 2005

The copper oxide nano powders were synthesized by levitational gas condensation (LGC) method, and were applied to catalyst to fabricate 3,4-dihydropyrimidin-2-(1H)-one. Processes of adsorption of Biginelli reaction reagents on the copper nanooxide surface $Cu_2O{\circ}CuO$ were studied by IR-spectroscopy. It was shown that benzaldehyde coordination, acetoacetic ether on the oxide surface is carried out with participation of carbonyl fragments, urea by N-H bonds which affects positively on the reagents reactivity.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.4
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• pp.514-521
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• 2008

Many research works for improving a boundary lubrication performance have been executed by using solid lubricants, and been tried to apply an engine lubrication. However those general lubricants have not been applied on engines due to the extreme conditions such as very high temperature and pressure during combustion process in a cylinder. In this study a lubricant containing copper alloy nano-powder is applied on a diesel engine driven by an electric motor. Torques and shaft vibrations are measured, then an engine friction loss and rotating stability are assessed. The results show that the frequency of the vibration is about the same as that of a general lubricant, but the amplitudes in the both X and Y direction are reduced as well as the friction loss is reduced.

• Journal of Powder Materials
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• v.18 no.6
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• pp.546-551
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• 2011

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

• Journal of Powder Materials
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• v.15 no.3
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• pp.227-233
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• 2008

Dynamic plastic deformation behavior of copper particles occurred during the cold spray processing was numerically analyzed using the finite element method. The study was to investigate the impact as well as the heat transfer phenomena, happened due to collision of the copper particle of $20{\mu}m$ in diameter with various initial velocities of $300{\sim}600m/s$ into the copper matrix. Effective strain, temperature and their distribution were investigated for adiabatic strain and the accompanying adiabatic shear localization at the particle/substrate interface.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.04a
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• pp.26-26
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• 2003

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

• Journal of Powder Materials
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• v.21 no.1
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• pp.39-43
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• 2014

Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.