• Journal of the Korean Magnetics Society
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• v.5 no.1
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• pp.42-47
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• 1995

FeN thin films for inductive recording heads were sputter deposited using RF diode sputtering mehtod from a pure iron target onto 7059 glass substrates, and their magnetic properties were measured. The magnetic properties were greatly affected by film thickness, gas pressure, sputter power and flow ratio of $N_{2}$ to Ar. Single layer FeN films with their thickness varied from $1,000\;{\AA}$ to $6,000\;{\AA}$ were doposited. 800 W sputter power, 3 mT gas pressure, $N_{2}$ to Ar flow ratio of 6.6 : 100 were the sputtering conditions. Up to 7 layers of FeN films having total thickness of $6,000\;{\AA}$ were deposited using $SiO_{2}$ of $30\;{\AA}$ thickness as intermediate layers and their coercivity and saturation magnetization were measured. The sputtering conditions were the same as those in the single layer films. Easy axis coercivity of the single layer FeN films gradually decreased as their thickness was increased, but for the films with their thicknesses above $3,000\;{\AA}$, the coercivity changed very little. As the number of the FeN layers were increased, the coercivity decreased We estimated the grain size of FeN films from the FWHM (Full Width at Half Maximum) of X-ray diffraction peaks. The grain size steadily decreased from about $200\;{\AA}$ to $120\;{\AA}$ as the number of layers were increased. Minimum hard axis coercivity of 0.4 Oe was obtained when the number of layers was four. Maximum relative permeability was 2,900 when the number of layers was three. The cut off frequeocy of the multilayer films were above 100 MHz.

• Carbon letters
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• v.21
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• pp.68-73
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• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

• Macromolecular Research
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• v.16 no.4
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• pp.373-378
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• 2008

A simple chemical fixation method for the fabrication of layer-by-layer (LbL) polyelectrolyte multilayer (PEM) has been developed to create a large area, highly uniform film for various applications. PEM of weak poly-electrolytes, i.e., polyallylamine hydrogen chloride (PAH) and poly(acrylic acid)(PAA), was assembled on polymer substrates such as poly(methyl methacrylate)(PMMA) and polycarbonate (PC). In the case of a weak polyelectrolyte, the fabricated thin film thickness of the polyelectrolyte multilayers was strongly dependent on the pH of the processing solution, which enabled the film thickness or optical properties to be controlled. On the other hand, the environmental stability for device application was poor. In this study, we utilized the chemical fixation method using glutaraldehyde (GA)-amine reaction in order to stabilize the polyelectrolyte multilayers. By simple treatment of GA on the PEM film, the inherent morphology was fixed and the adhesion and mechanical strength were improved. Both surface tension and FT-IR measurements supported the chemical cross-linking reaction. The surface property of the polyelectrolyte films was altered and converted from hydrophilic to hydrophobic by chemical modification. The possible application to antireflection coating on PMMA and PC was demonstrated.

• Composites Research
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• v.20 no.2
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• pp.27-31
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• 2007

"Structural surface becomes an antenna." This term, CAS, indicates antenna embedding in structural surfaces. The CAS is composed of several composite laminates and Nomex honeycombs, and microstrip antenna elements are inserted between layers with designed configurations. Constituent materials are selected considering electrical contributions as well as mechanical performances. Antenna design with adhesive films are impossible because of their thin and rough distributions between honeycomb and substrate. Therefore, adhesive effects on antenna performances in CAS are experimentally investigated, CAS with targeted impedance and radiation characteristics are designed considering adhesive effects. multilayer

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.147-147
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• 2015

The multilayer structure of the organic light emitting diode has merits of improving interfacial characteristics and helping carriers inject into emission layer and transport easier. There are many reports to control hole injection from anode electrode by using transition metal oxide as an anode buffer layer, such as V2O5, MoO3, NiO, and Fe3O4. In this study, we apply thin films of LiF which is usually inserted as a thin buffer layer between electron transport layer(ETL) and cathode, as an anode buffer layer to reduce the hole injection barrier height from ITO. The thickness of LiF as an anode buffer layer is tested from 0 nm to 1.0 nm. As shown in the figure 1 and 2, the luminous efficiency versus current density is improved by LiF anode buffer layer, and the threshold voltage is reduced when LiF buffer layer is increased up to 0.6 nm then the device does not work when LiF thickness is close to 1.0 nm As a result, we can confirm that the thin layer of LiF, about 0.6 nm, as an anode buffer reduces the hole injection barrier height from ITO, and this results the improved luminous efficiency. This study shows that LiF can be used as an anode buffer layer for improved hole injection as well as cathode buffer layer.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.113-117
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• 2023

As sputter equipment becomes more complex, it becomes increasingly difficult to understand the parameters that affect the thickness uniformity of thin metal film deposited by sputter. To address this issue, we verified a deep learning model that can predict complex relationships. Specifically, we trained the model to predict the height of 36 magnets based on the thickness of the material, using Support Vector Machine (SVM), Multilayer Perceptron (MLP), 1D-Convolutional Neural Network (1D-CNN), and 2D-Convolutional Neural Network (2D-CNN) algorithms. After evaluating each model, we found that the MLP model exhibited the best performance, especially when the dataset was constructed regardless of the thin film material. In conclusion, our study suggests that it is possible to predict the sputter equipment source using film thickness data through a deep learning model, which makes it easier to understand the relationship between film thickness and sputter equipment.

• Journal of the Korean Magnetics Society
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• v.8 no.5
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• pp.282-287
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• 1998

Dependence of magnetoresistance on base pressure and deposition rates of each Fe, Co, Cu layers in the $Fe(50{\AA}/[Co(17{\AA})/Cu(24{\AA})]_20$ multilayer thin films, prepared by dc magnetron sputtering on Corning glass, were investigated. AFM analysis, X-ray diffraction analysis, vibrating sample magnetometer analysis, and magnetoresustance measurement (4-probe method) were performed. The multilayer films deposited under low base pressure increases magnetoresistance ratio by preventing oxidation. Annealing for the samples at a moderate temperature allowed larger textured grain with no loss in the periodicity. Magnetoresistance ratio of the annealed multilayers was increased due to the increase antiferromagnetically coupled fraction of the film after annealing. Optimization of deposition rate was greater than 1 $\AA$/s for Fe, and 2.8 $\AA$/s for Cu. Deposition rate of Co showed a tendency of increasing of magnetoresistance ratio due to the formation of flat magnetic layer in case of high deposition rate of Co.

• Journal of the Korean Magnetics Society
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• v.21 no.5
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• pp.185-192
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• 2011

The technique of producing thin film plays a crucial role in modern science and technology as well as in industrial purposes. Numerous efforts have been made to get high quality thin film through surface treatment of materials. PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two of the most popular deposition techniques used in both scientific study and industrial use. It is well known that the film deposited by PVD and CVD commonly possesses a columnar microstructure which affects many film properties. In recent years, various types of deposition sources which feature high material uses and excellent film properties have been developed. Electromagnetic levitation source appeared as an alternative deposition source to realize high deposition rate for industrial use. Complex film structures such as nano multilayer and multi-components have been prepared to achieve better film properties. Glancing angle deposition (GLAD) has also been developed as a technique to engineer the columnar structure of thin films on the micro- and nanoscale. In this paper, the trends and major issues of thin film technology based on PVD and CVD have been discussed together with the prospect of thin film technology.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.450-455
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• 2004

NiCr thin films were fabricated by thermal evaporation method using NiCr alloy as evaporating source. NiCr thin films were annealed at various temperatures in air atmosphere in order to investigate effects of annealing conditions on phase change, composition, and microstructures of NiCr films. Typical multilayer was formed after annealing in air atmosphere. This results from the diffusion and oxidation of Cr toward surface during annealing. In the case of annealing at 700$^{\circ}C$, large columnar grains of NiO were formed on Cr-oxide layer through the diffusion and oxidation of Ni over Cr-oxide layer. Especially, NiO layer was formed additionally on surface, sustaining the underlayer structure with the formation of porous Ni layer.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.