• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.264-265
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• 2008

While the reliability of bulk insulation has become important particularly in multilayer boards and embedded boards, electronics are to be used under various environments such as at high temperature and in high humidity. We observed internal space charge behavior for two types of epoxy composites under dc electric fields to investigate the influence of water at high temperature. In the case of glass/epoxy specimen, homocharge is observed at water-treated specimen, and spatial oscillations become clearer in the water-treated specimens. Electric field in the vicinity of the electrodes shows the injection of homocharge. In aramid/epoxy specimens, heterocharge is observed at water-treated specimens, i.e. negative charge accumulates near the anode, while positive charge accumulates near the cathode. Electric field is enhanced just before each electrode. In order to further examine the mechanism of space charge formation, we have developed a new system that allows in situ space charge observation during ion migration tests at high temperature and high humidity. Using this in situ system.

• ETRI Journal
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• v.33 no.3
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• pp.335-343
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• 2011

The pad pitch of modern radio frequency integrated circuits is in the order of few tens of micrometers. Connecting a large number of high-speed I/Os to the outside world with good signal fidelity at low cost is an extremely challenging task. To cope with this requirement, we need reflection-free transmission lines from an on-chip pad to on-board SMA connectors. Such a transmission line is very hard to design due to the difference in on-chip and on-board feature size and the requirement for extremely large bandwidth. In this paper, we propose the use of narrow tracks close to chip and wide tracks away from the chip. This narrow-to-wide transition in width results in impedance discontinuity. A step change in substrate thickness is utilized to cancel the effect of the width discontinuity, thus achieving a reflection-free microstrip. To verify the concept, several microstrips were designed on multilayer FR4 PCB without any additional manufacturing steps. The TDR measurements reveal that the impedance variation is less than 3 ${\Omega}$ for a 50 ${\Omega}$ microstrip and S11 better than -9 dB for the frequency range 1 GHz to 6 GHz when the width changes from 165 ${\mu}m$ to 940 ${\mu}m$, and substrate thickness changes from 100 ${\mu}m$ to 500 ${\mu}m$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.5
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• pp.421-426
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• 2017

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.173-175
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• 2005

The effects of PCB Board on the filter characteristics such as insertion loss and transmission characteristics were investigated for the measurement of 5GHz LC filter. Insertion loss measured with PCB Board of Teflon is 0.3 dB lower in comparion with FR-4. The filter characteristics measured in the passband were different from the calculated results. In comparison with the calculated value, the measured value shows that center frequency is 20MHz lower, passband is narrower and insertion loss is larger. The difference of Insertion loss between Teflon and FR-4 increases with increasing measurement frequency.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.1
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• pp.73-80
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• 2004

In this paper, the implementation and embedding method of the existing air-filled waveguide-filters at millimeter-wave on general PCB substrate is introduced by systematically inserting the vias inside waveguide and mathematically manipulating the simple equations obtained ken the classical circular-post waveguide filter design. All the metal structures placed vertically such as side wall fur perfect ground plane and circular-post for signal control in the air-filled WR-22 waveguide are replaced with several types of via for constructing the bandpass-filter. Side wall and poles inside waveguide are realized by placing a series array of via and tuning the via diameter. The lengths of x, y, z axis are reduced in proportion to root square of employed substrate dielectric constant and especially the length of z axis can be more reduced due to the characteristics of the wave propagation. Because the mass production on PCB is possible without fabricating a large-scaled metal waveguide of WR-22 as input/output ports at millimeter-wave regime, the manufacturing cost is reduced considerably. Finally, when using multilayer process like LTCC for small-sized module, it is one of advantages to use only one layer f3r the filter fabrication. To evaluate the validity of this novel technique, order-3 Chebyshev BPF(Bandpass-Filter) centered at 40 GHz-band with a 2.5 ％ FBW (Fractional Bandwidth) were used. The employed substrate has relative dielectric constant of 2.2 and thickness of 10 mil of Rogers RT/Duroid 5880. Accroding to design and measurement results, a good performance of insertion loss of 2 ㏈ and return loss of -30 ㏈ is achieved at full input/output ports.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.9-17
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• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.7A
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• pp.935-942
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• 2000

In this paper, miniature voltage-controlled oscillator(VCO) for 1.6GHz PCS band is designed and implemented. Colpitts type LC resonating oscillator is designed with multilayer PCB and circuit parameters are optimized using the circuit simulator. Using the optimized design parameters, miniature VCO with 6X6X1.8mm3 (0.065cc)dimensions is fabricated and experimented. Developed VCO has -1.67dBm $\pm$0.5dBm output power level in52.5MHz tunung range, and has -99.33dBc/Hz phase noise performance at 10 KHz frequency offset.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.