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http://dx.doi.org/10.3795/KSME-A.2017.41.5.421

A Study on the Prediction of the Mechanical Properties of Printed Circuit Boards Using Modal Parameters  

Choo, Jeong Hwan (Advanced Center, Mando Corp.)
Jung, Hyun Bum (Reliability & Validation Center, Mando Corp.)
Hong, Sang Ryel (Altair Korea)
Kim, Yong Kap (Advanced Center, Mando Corp.)
Kim, Jae San (Advanced Center, Mando Corp.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.41, no.5, 2017 , pp. 421-426 More about this Journal
Abstract
In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.
Keywords
Transversely Isotropic Property; Copper Clad Laminate; Rules of Mixture; Size Optimization; Multilayer Printed Circuit Board;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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