• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.115-120
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• 2003

We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM$\sub$00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 $\mu\textrm{m}$.

• Journal of Information Display
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• v.8 no.2
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• pp.5-9
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• 2007

We demonstrate novel soft-lithographic techniques for preparing patterned liquid crystal (LC) orientations at an alignment layer. By controlling patterning conditions such as wetting property and operating temperature depending on polymeric materials, multi-directional or modified LC alignment conditions can be simply achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.583-584
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• 2006

Printing technology has begun to get into the spotlight in many ways due to the low cost effectiveness to existent semi-conductor process. It also has very useful application areas, not only paper printing but also patterning for LCD color tilter, Photovoltaic patterning, RFID antenna, OLED, and so on. In this study, an apparatus of gravure offset printing was developed for fine line width printing. The pattern was composed of $20{\mu}m$ size of continuous lines of which pitch size was $40{\mu}m$. The printed pattern shows that it is possible to make around $20{\mu}m$ line-width printing pattern. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. For testing of multi-layer printing, the system was designed to be capable of printing two different materials from each printing unit using gravure-offset printing method and have a function of alignment of two printed materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.615-620
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• 2006

We demonstrate novel soft-lithographic techniques for preparing patterned liquid crystal (LC) orientations at an alignment layer. By controlling patterning conditions such as wetting property and operating temperature depending on polymeric materials, multi-directional or modified LC alignment conditions can be simply achieved.

• Environmental Analysis Health and Toxicology
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• v.23 no.4
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• pp.231-245
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• 2008

Various methods for detecting changes in response behaviors of indicator specimens are presented for monitoring effects of toxic treatments. The movement patterns of individuals are quantitatively characterized by statistical (i.e., ANOVA, multivariate analysis) and computational (i.e., fractal dimension, Fourier transform) methods. Extraction of information in complex behavioral data is further illustrated by techniques in ecological informatics. Multi-Layer Perceptron and Self-Organizing Map are applied for detection and patterning of response behaviors of indicator specimens. The recent techniques of Wavelet analysis and line detection by Recurrent Self-Organizing Map are additionally discussed as an efficient tool for checking time-series movement data. Behavioral monitoring could be established as new methodology in integrative ecological assessment, tilling the gap between large-scale (e.g., community structure) and small-scale (e.g., molecular response) measurements.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.425-427
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• 1996

New fabrication technique was developed to make three dimensional silicon microstructure with five fold vertical steps through entire wafer thickness. Each step is pre-defined on multiply stacked thermal oxide and silicon nitride (O/N) layers by photolithographies. Multi-stepped silicon microstructure is formed by anisotropic etch in aqueous KOH solution with the patterned nitride film as masking layer. Fabricated microstructure consists of four $16{\mu}m$ thick flexural spring beams, $290{\mu}m$ thick proof mass, mesas for overrange stop with $10{\mu}m$ height from the surface of the proof mass, and the other mesas and V grooves used for assembling this structure to the packaging frame of pendulous servo accelerometer. Using the numerical finite element method (FEM) simulator: ABAQUS, mechanical characteristics of the fabricated microstructure by the developed technique was compared with those of the same structure processed by one step silicon bulk etch followed by oxidation and patterning the etched region.

• Current Photovoltaic Research
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• v.2 no.3
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• pp.95-102
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• 2014

Light trapping techniques can change the propagation direction of incident light and keep the light longer in the absorption layers of solar cells to enhance the power conversion efficiency. In thin film silicon (Si) solar cells, the thickness of absorption layer is generally not enough to absorb entire available photons because of short carrier life time, and light induced degradation effect, which can be compensated by the light trapping techniques. These techniques have been adopted as textured transparent conduction oxide (TCO) layers randomly or periodically textured, intermediate reflection layers of tandem and triple junction, and glass substrates etched by various patterning methods. We reviewed the light trapping techniques for thin film Si solar cells and mainly focused on the commercially available techniques applicable to textured TCO on patterned glass substrates. We described the characterization methods representing the light trapping effects, texturing of TCO and showed the results of multi-scale textured TCO on etched glass substrates. These methods can be used tandem and triple thin film Si solar cells to enhance photo-current and power conversion efficiency of long term stability.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Journal of the Korean Vacuum Society
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• v.13 no.1
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• pp.39-45
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• 2004

Ultraviolet-nanoimprint lithography (UV-NIL) is a promising method for cost-effectively defining nanoscale structures at room temperature and low pressure. A 5${\times}$5${\times}$0.09 in. quartz stamp is fabricated using the etch process in which a Cr film was employed as a hard mask for transferring nanostructures onto the quartz plate. FAS(Fluoroalkanesilane) is used as a material for anti-adhesion surface treatment on the stamp and a thin organic film to improve adhesion on a wafer is formed by spin-coating. The low viscosity resin droplets with a nanometer scale volume are dispensed on the whole area of the coated wafer. The UV-NIL experiments have been performed using the EVG620-NIL. 370 nm - 1 m features on the stamp have been transferred to the thin resin layer on the wafer using the multi-dispensing method and UV-NIL process. We have measured the imprinted patterns and residual layer using SEM and AFM to evaluate the potential of the process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.168-174
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• 2016

A conductive oxide-based sapphire glass indium tin oxide/metal electrode and the optical coating, through patterning process was studied in excellent optical properties and integrated touch panel has a high strength. Indium tin oxide conductive oxides of the sapphire glass to 0.3 A at DC magnetron sputtering method of 10 min, gas flow Ar 10 Sccm Ar, $O_2$ 1.0 Sccm the formation conditions of the thin film after annealing at $550^{\circ}C$ for 30min was achieved through a 86% transmittance. In addition, the coating 130 nm hollow silica sol-gel was to improve the optical transmittance of the indium tin oxide to 91%. For the measurement by the modeling hollow silica sol by Macleod simulation and calculated the average values of silica part to the presence or absence in analogy to actual. Refractive index value and the actual value of the material on the simulation the transmittance difference is it does not completely match the air region similar to the actual value (transmission) could be confirmed that the measurement is set to a value of between 5 nm and 10 nm.