• Journal of the Korean Society for Precision Engineering
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• v.13 no.12
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• pp.30-37
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• 1996

On-line process control equipment for CO$_{2}$ laser cutting is not available for industrial applications. The major part of the industrial laser cutting machines are adjusted off-line by highly educated engineers. The quality inspection of the sample is visual and referred to different quality scales. Due to the lack of automation the potential laser users hesitate to implement the cutting method. The first step toward an automation of the process is the development of a process monitoring system and the research is cincentrated on the area of on-line quality monitoring during CO$_{2}$ laser cutting. The method is based on the detection of the emitted light from the cutting front by photo diode. The developed monitoring system consists of the OP Amplifier, A/D convertor, power supply and PC. The signal from the photo diode has been undertaken from Fourier analysis and statistical analysis with real time. The photograph of striation pattern was taken by metallurgical microscope. As a result, it is possible to predict the striation pattern according to the beam traveling speed.

• Journal of the Korean Data and Information Science Society
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• v.18 no.3
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• pp.773-782
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• 2007

The statistical process control charts are very extensively used for monitoring of process mean, deviation, defect rate or reject rate. In this paper we consider a control chart to monitor the process reject rate in the high yield process, which is based on the observed cumulative probability of the number of items inspected until r defective items are observed. We first propose selection of the optimal value of r in the CPC-r charts, and also consider the usefulness of the chart in high yield process such as semiconductor or TFT-LCD manufacturing process.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.387-390
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• 1997

Grinding process takes a long time that grinding machine is setted properly. It is difficult for user to judge correctly the abnormal states generated in grinding process. Air grinding has to be reduced for the improvement of productivity. In addition, it is important to monitor the dressing and the grinding process so that the grinding working maintains optimal grinding conditions. In this study, the monitoring system using the acoustic emission is developed to monitor these processes continuously. This system was able to reduce the preparation as well as the machine setting time in grinding operation.

• Proceedings of the Korean Geotechical Society Conference
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• 2003.03a
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• pp.781-788
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• 2003

It is an essential process to predict behaviors of ground and structure to seek economical efficiency and stability on the given environment. Predictions are conducted through analysis process of ground and structure. For these analyses, exact and quick acquisition of measuring data is required. But we face many difficulties in data acquisition stages due to the conditions of construction site. Therefore development of a powerful and effective monitoring system that can manage the integration of database and the implementation of measuring process in real time is strongly desired. This article shows an actual example of application of internet based monitoring system compared with the conventional monitoring system.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.1386-1390
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• 2007

This paper presents the equipment condition monitoring technology for the process or the equipment using statistical techniques. The equipment condition monitoring system consists of an empirical model to estimate the expected sensor values of process variables and a diagnose model to detect the abnormal condition and to identify the root source of the problem. The empirical model is constructed by the analysis of historic data. The diagnose model uses the sequential probability ratio test (SPRT) technique. The monitoring system was tested with real operating data acquired from the Reactor Coolant Pump Seal in the Nuclear Power Plant. It can detect the system degradation or failure at the early stage since it is able to catch the subtle deviation of process variables from normal condition.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.142-147
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• 2012

Machining tool conditions directly affect to quality of product and productivity of manufacturing. Many researches performed for tool condition monitoring in machining process to improve quality and productivity. Conventional methods use characteristics of signal for cutting force, motor current consumption, vibration of machine tools and machining sound. Recently, diameter of machining tool is become smaller for minimizing of mechanical parts. Tool condition monitoring using conventional methods are relatively difficult because micro machining using small diameter tool has low machining load and high cutting speed. These days, the direct monitoring for tool conditions using vision system is performed actively. But, vision system is affected by external conditions such as back ground of image and illumination. In this study, minimizing technology of external conditions using distribution analysis of image data are developed in micro machining using small diameter drill and tap. The image data is gathered from vision system. Several sets of experiment results are performed to verify the characteristics of the proposed machining technology.

• Journal of information and communication convergence engineering
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• v.3 no.4
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• pp.187-190
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• 2005

High aspect ratio via-hole etching process has emerged as one of the most crucial means to increase component density for ULSI devices. Because of charge accumulation in via-hole, this sophisticated and important process still hold several problems, such as etching stop and loading effects during fabrication of integrated circuits. Indeed, the concern actually depends on accumulated charge. For monitoring accumulated charge during plasma etching process, charge-up monitoring sensor was fabricated and tested under some plasma conditions. This paper presents a neural network-based technique for analyzing and modeling several electrical performance of plasma charge-up monitoring sensor.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.303-306
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• 2005

High aspect ration via-hole etching process has emerged as one of the most crucial means to increase component density for ULSI devices. Because of charge accumulation in via hole, this sophisticated and important process still hold several problems, such as etching stop, loading effects during fabrication of integrated circuits. Indeed, the concern actually depends on accumulated charge. For monitoring accumulated charge during plasma etching process, charge-up monitoring sensor was fabricated and tested under some plasma conditions. This paper presents a neural network-based technique for analyzing and modeling several electrical performance of plasma charge-up monitoring sensor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.397-401
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• 2008

Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.27-31
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• 2021

VI probe, which is one of various in-situ plasma monitoring sensor, is frequently used for in-situ process monitoring in mass production environment. In this paper, we correlated the plasma etch results with VI probe data with the small amount of gas flow rate changes to propose usefulness of the VI probe in real-time process monitoring. Several different sized contact holes were employed for the etch experiment, and the etched profiles were measured by scanning electron microscope (SEM). Although the shape of etched hole did not show satisfactory relationship with VI probe data, the chamber status changed along the incremental/decremental modification of the amount of gas flow was successfully observed in terms of impedance monitoring.