• 제목/요약/키워드: Molecular Beam Epitaxy

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Growth of Nanocrystalline Graphite on Sapphire by Solid Carbon Source Molecular Beam Epitaxy

  • Jerng, S.K.;Yu, D.S.;Kim, Y.S.;Ryou, Jung-A;Hong, Suk-Lyun;Kim, C.;Yoon, S.;Efetov, D.K.;Kim, P.;Chun, S.H.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.51-51
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    • 2011
  • We have grown nanocrystalline graphite on sapphire substrate by using solid carbon source molecular beam epitaxy. Changes of structure from amorphous carbon to nanocrystalline graphite controlled by the growth temperature have been investigated by Raman spectroscopy. Raman spectra show D, G, and 2D peaks, whose intensities vary on the growth temperature. Atomic force microscopy reveals that the surface is very flat. Sapphire substrates of different cutting direction produce similar results. Simulations suggest that the interaction between carbon and oxygen causes disorders. Electrical transport measurements exhibit a Dirac-like peak, including a carrier type change by an external gate voltage bias.

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Si-O 초격자 다이오드의 전기적 특성 (Electrical Characteristics of Si-O Superlattice Diode)

  • 박성우;서용진;정소영;박창준;김기욱;김상용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.175-177
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    • 2002
  • Electrical characteristics of the Si-O superlattice diode as a function of annealing conditions have been studied. The nanocrystalline silicon/adsorbed oxygen superlattice formed by molecular beam epitaxy (MBE) system. Consequently, the experimental results of superlattice diode with multilayer Si-O structure showed the stable and good insulating behavior with high breakdown voltage. This is very useful promise for Si-based optoelectronic and quantum device as well as for the replacement of silicon-on-insulator (SOI) in ultra high speed and lower power CMOS devices in the future, and it can be readily integrated with silicon ULSI processing.

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Si-O 초격자 구조의 포토루미네슨스 특성 (Photoluminescence Characteristics of Si-O Superlattice Structure)

  • 정소영;서용진;박성우;이경진;김철복;김상용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.202-205
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    • 2002
  • The photoluminescence (PL) characteristics of the silicon-oxygen(Si-O) superlattice formed by molecular beam epitaxy (MBE) were studied. To confirm the presence of the nanocrystalline Si structure, Raman scattering measurement was performed. The blue shift was observed in the PL peak of the oxygen-annealed sample, compared to the hydrogen-annealed sample, which is due to a contribution of smaller crystallites. Our results determine the right direction for the fabrication of silicon-based optoelectronic and quantum devices as well as for the replacement of silicon-on-insulator (SOI) in high-speed and low-power silicon MOSFET devices in the future.

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고상원 분자선 단결정 성장법을 이용한 다결정 실리콘 에미터, 자기정렬 실리콘 게르마늄 이종접합 쌍극자 트랜지스터 (Polysilicon-emitter, self-aligned SiGe base HBT using solid source molecular beam epitaxy)

  • 이수민;염병렬;조덕호;한태현;이성현;강진영;강상원
    • 전자공학회논문지A
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    • 제32A권2호
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    • pp.66-72
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    • 1995
  • Using the Si/SiGe layer grown by solid source molecular beam epitaxy(SSMBE) on the LOCOS-patterned wafers, an emitter-base self-aligned hterojunction biplar transistor(HBT) with the polysilicon-emitter and the silicon germanium(SiGe) base has been fabricated. Trech isolation process, planarization process using a chemical-mechanical poliching, and the selectively implanted collector(SIC) process were performed. A titanium disilicide (TiSi$_{2}$), as a base electrode, was used to reduce an extrinsic base resistance. To prevent the strain relaxation of the SiGe epitaxial layer, low temperature (820${^\circ}C$) annealing process was applied for the emitter-base junction formation and the dopant activation in the arsenic-implanted polysilicon. For the self-aligned Si/SiGe HBT of 0.9${\times}3.8{\mu}m^{2}$ emitter size, a cut-off requency (f$_{T}$) of 17GHz, a maximum oscillation frequency (f$_{max}$) of 10GHz, a current gian (h$_{FE}$) of 140, and an emitter-collector breakdown voltage (BV$_{CEO}$) of 3.2V have been typically achieved.

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Electroreflectance 측정에 의한 Si이 첨가된 $Al_{0.32}Ga_{0.68}As$에서의 $E_1$ 전이에 대한 연구 (A Study on $E_1$Transition in Si-Doped $Al_{0.32}Ga_{0.68}As$by Electroreflectance Measurement)

  • 김동렬;손정식;김근형;이철욱;배인호
    • 한국전기전자재료학회논문지
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    • 제11권9호
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    • pp.687-692
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    • 1998
  • Silicon doped $Al_{0.32}Ga_{0.68}As$ were growth by molecular beam epitaxy. Electroreflectance(ER) spectra of the $E_1$ transition of Schottky barrier Au/n-$Al_{0.32}Ga_{0.68}As$ have been measured at various modulation voltage($V_{ac}$) and dc bias voltage($V_{bias}$). from the $E_1$peak, band gap energy of the $Al_{0.32}Ga_{0.68}As$ is 1.883 eV which corresponds to an Al composition of 32%. As modulation voltage($V_{bias}$) is changed, a line shape at the $E_1$transition does not change, but its amplitude varies linearly. The amplitude of $E_1$signal decrease with increasing the forward dc bias voltage($V_{bias}$), but the line shape does not change. It suggests that the low field theory rather than Franz-Keldysh oscillation is Required to interpret spectra. Also, spectra at the $E_1$transition were broadened with increasing the reverse dc bias voltage($V_{bias}$) which suggests the presence of Field-induced broadening.

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Si이 첨가된 $In_{0.1}Ga_{0.9}As$ 에피층의 Sit셀 온도에 따른 표면특성 연구 (Surface characteristics of Si-doped $In_{0.1}Ga_{0.9}As$ epilayers due to Si-cell temperature)

  • 김동렬;이동율;배인호
    • 한국전기전자재료학회논문지
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    • 제13권7호
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    • pp.551-556
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    • 2000
  • We have investigated the effect of surface In composition with Si cell temperature on the In$_{0.1}$/Ga$_{0.9}$/As epilayers grown on GaAs substrates. The epilayers were grown by molecular beam epitaxy(MBE) method and were characterized by the pthotoreflectance(PR) measurements. The E$_{o}$ bandgap energies of In$_{0.1}$/Ga$_{0.9}$/As epilayers were observed at around 1.28 eV at room temperature, and the additional shoulder peaks appeared at the higher energies than E$_{o}$ with increase of Si doping concentrations. The intensity of the additional shoulder peak was decreased with lowering the measurement temperature and the peak disappeared with the increase of surface etching time. This results hows that In composition at surface of InGaAs epilayer is decreased with the increase of the doping cell temperature. We consider that the reason of the decrease of In composition at the surface should be due to In re-evaporation from the surface by radiation heat of Si doping cell.ell.ell.ell.

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R-면 사파이어 기판 위에 플라즈마 분자선 에피탁시법을 이용한 산화아연 박막의 성장 및 특성평가 (Growth and characterization of ZnO thin films on r-plane sapphire substrates by plasma-assisted molecular beam epitaxy)

  • 한석규;홍순구;이재욱;이정용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.155-156
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    • 2006
  • Single crystalline ZnO fims were successfully grown on r-plane sapphire substrate by plasma-assisted molecular beam epitaxy. Epitaxial relationship between the ZnO film and the-r-plane sapphire was determined to be [-1101]$Al_2O_3\;{\parallel}$ [0001]ZnO, [11-20]$Al_2O_3\;{\parallel}$ [-1100]ZnO based on the in-situ RHEED analysis and confirmed again by HRXRD measurements. Grown (11-20) ZnO films showed faceted structure along the <0001> direction and the RMS roughness was about 4 nm.

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선택적 분자선 에피택시 방법에 의한 1D-2DEG 혼성 나노선 FET의 구현 (Realization of 1D-2DEG Composite Nanowire FET by Selective Area Molecular Beam Epitaxy)

  • 김윤주;김은홍;서유정;김동호;한철구;;김태근
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.167-168
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    • 2006
  • High quality 3D-heterostructures were constructed by selective area (SA) molecular beam epitaxy (MBE) using a specially patterned GaAs (001) substrate. MBE growth parameters such as substrate temperature, V/III ratio, growth ratio, group V sources ($As_2$, $As_4$) were varied to calibrate the selective area growth conditions. Scanning micro-photoluminescence ($\mu$-PL) measurements and following analysis revealed that the gradually (adiabatically) coupled 2DEG-1D-1DEG field effect transistor (FET) system was realized. This 3D-heterostructure is very promising for the realization of the meso-scopic electronic devices and circuits since it makes it possible to form direct ohmic contact to the (quasi) 1DEG.

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Excitonic transitions and dynamics in front and back surfaces of ZnO films grown by plasma-assisted molecular beam epitaxy

  • 이선균;고항주;;조용훈
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.119-119
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    • 2010
  • We report strong exciton transition and exciton-phonon couplings in photoluminescence (PL) of ZnO thin films grown on MgO/sapphire (buffer/substrate) by plasma-assisted molecular beam epitaxy. The PL spectra at 10 K showed the intensity of the dominant emission, donor-bound exciton transition of front surface (top surface, the latter part in growth) is found to be about 100 times higher than that of back surface (in-depth bottom area, the initial part), while the room temperature PL spectra showed dominant contributions from the free exciton emissions and phonon-replicas of free excitons for front surface and back surface, respectively, It could be attributed to the strong contributions of exciton-phonon coupling. Time resolved PL spectra reveal that the life time of exciton recombination from the front surface are longer than those from back surface. This is most probably due to the fact that reduction of non-radiative recombination in the front surface. This investigation indicates that the existence of native defects or trap centers which can be reduced by the proper initial condition in growth and the exciton-phonon interaction couplings play an important role in optical properties and crystal quality of ZnO thin films.

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MBE 장치에 의한 에피 성장 두께 균일도 계산 (Calculations of Thickness Uniformity in Molecular Beam Epitaxial Growth)

  • 윤경식;김은규;민석기
    • 전자공학회논문지A
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    • 제30A권8호
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    • pp.81-87
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    • 1993
  • The growth thickness uniformity of epitaxial layers deposited using a moiecular beam epitaxy system is calculated from the arrangement of molecular beam source and the substrate and the geometric dimensions of the crucible in order to predict the optimum design conditions of the prototype MBE system. The thickness uniformity better than 5% over a 3-inch wafer can be obtained by keeping the distance between the substrate and the crucible's orifice longer than 20cm, the tapering angle of the crucible larger than 6$^{\circ}$, and the angle between the normal to the substrate at the center and the crucible axis as larger as possible. In addition, the growth yield decreases to below 51% as the distance between the substrate and the orifice becomes longer than 25cm.

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