• Title/Summary/Keyword: MoldFlow

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Design, Fabrication of Electromagnetic Microvalve for Drug Delivery Systems (약물 전달용 전자력 마이크로 밸브의 설계 및 제작)

  • Lim, In-Ho;Lee, Ki-Jung;Yoon, Hyeun-Joong;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1526-1527
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    • 2007
  • This paper presents the design, fabrication and experimental results of an electromagnetic microvalve for drug delivery systems. The microvalve consists of two silicon substrates with a silicone rubber diaphragm and a flow channel, a PDMS layer, and an electromagnetic actuator. Each substrate is fabricated by using the silicon wet etch, SU-8 mold process and $O_2$ plasma bonding.

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Flow Analysis and Evaluation of Injection-Molded Front Panel (백라이트 패널(back light panel)의 유동해석 및 평가)

  • 강성남;허용정
    • Proceedings of the KAIS Fall Conference
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    • 2001.11a
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    • pp.144-146
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    • 2001
  • The synthesis of injection-molded parts has been done empirically, since it requires profound knowledge about injection molding which is not available to designers through current CAD systems. Appropriate U3 programs for mold design analysis to an existing geometric modeler is used to provide designers, at the initial stage, with comprehensive process knowledge for synthesis, performance analysis and feature-based geometric modeling.

Reduction of Wire Sweep during Chip Encapsulation by Runner Balancing and Ram Control (반도체 칩 캡슐화 공정에 있어서 와이어 스윕(wire sweep) 최소화에 관한 연구)

  • Han, S.;Huh, Y.J.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.12
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    • pp.13-21
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    • 1996
  • In this paper, methods to reduce wire sweep during the chip-encapsulation process have been studide. Two methods have been tried for this purpose, namely runner balancing and ram velocity control. Runner balancing has been achieved automatically by using a computer program. Ram-velocity control has been achieved using empirical rules and results from a flow simulation of the encapsulation process. A mold which has 12 cavities for chip has been used as a case study. The simulation results show that the wire sweep obtained from the optimal process condition is about 1/5 of that from initial, unoptimized condition.

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A Study on the PMMA Lens Fabrication for Surgical Light Based on Injection Molding Convergence Process (사출성형 융합공정 기반 수술실 무영등용 PMMA 렌즈 제작에 관한 연구)

  • Kang, Bo-An;Oh, Hyeong-Jong;Jeong, Byeong-Ho;Jeong, Nam-In
    • Journal of the Korea Convergence Society
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    • v.6 no.1
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    • pp.43-48
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    • 2015
  • We studied on the injection molding conditions of defect-free PMMA lens for surgical light. When the heat temperature of mold is low, more imperfect molding or weldlines and flow marks have showed. A defective lens depends on low fluidity of the PMMA resin and its temperature is high, a flexural strain has occurred. The longer cooling time of specimens, the more cracks have occurred due to resin crystallization. In this study, optimal molding conditions for defect-free PMMA lens is as follows. The heat temperature of core mold was 110 [$^{\circ}C$] and also the cooling time was 25 [sec]. PMMA materials can realized low expense to produce plastic optical lens and applications.

Study on the Processing Variables of BSCCO-2212 Superconductor made by Melt Casting Process (용융주조법으로 제조한 BSCCO-2212 초전도체의 공정변수 연구)

  • Kim, Kyu-Tne;Jang, Seok-Hern;Lim, Jun-Hyung;Joo, Jinho;Kim, Chan-Joong;Bong, Gye-Won;Kim, Rye-Lim;Hyun, Ok-Bae
    • Journal of the Korean Ceramic Society
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    • v.42 no.6 s.277
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    • pp.437-442
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    • 2005
  • We fabricated BSCCO-2212 (2212) bulk superconductor by melt casting process, and evaluated the dependence of the critical properties on the temperature and cooling .ate of mold and the pouring methods of melt. It was observed that the critical current (Ic) of 2212 was significantly dependent on the pre-heating temperature of the mold. At the pre-heating temperature of $500^{\circ}C$ followed by air cooling condition, Ic of 48 A at 77 K was obtained which was higher than others processed at different temperatures. In addition, the Ic improved to 132 A when tilt casting method was applied. The improved Ic is probably due to the fact that the tilt casting reduced a turbulent flow of the melt during casting causing less porosity and more homogeneous microsructure. Critical temperature was measured to be 87-89 K after the first heat treatment and it improved to 90-91 K when subsequently heat treated at $650^{\circ}C$ in a nitrogen atmosphere. This improvement was considered to be due to an optimization of the oxygen content in the range of 8.16-8.2.

Optimum design of injection molding cooling system via boundary element method (경계요소법을 이용한 사출성형금형 냉각시스템의 최적설계)

  • Park, Seong-Jin;Kwon, Tai-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.21 no.11
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    • pp.1773-1785
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    • 1997
  • The cooling stage is the very critical and most time consuming stage of the injection molding process, thus it cleary affects both the productivity and the part quality. Even through there are several commercialized package programs available in the injection molding industry to analyze the cooling performance of the injection molding coling stage, optimization of the cooling system has npt yet been accomplished in the literature due to the difficulty in the sensitivity analysis. However, it would be greatly desirable for the mold cooling system designers to have a computer aided design system for the cooling stage. With this in mind, the present study has successfully developed an interated computer aided design system for the injection molding cooling system. The CAD system utilizes the sensitivity analysis via a Boundary Element Method, which we recently developed, and the well-known CONMIN alforuthm as an optimization technique to minimize a weighted combination (objective function) of the temperature non-uniformity over the part surface and the cooling time related to the productivity with side constranits for the design reality. In the proposed objective function , the weighting parameter between the temperature non-uniiformity abd the cooling time can be adjusted according to user's interest. In this cooling system optimization, various design variable are considered as follows : (i) (design variables related to processing conditions) inlet coolant bulk temperature and volumetric flow rate of each cooling channel, and (ii) (design variables related to mold cooling system design) radius and location of each cooling channel. For this optimum design problem, three different radius and location of each cooling channel. For this optimum design problem, three different strategies are suffested based upon the nature of design variables. Three sample problems were successfully solved to demonstrated the efficiency and the usefulness of the CAD system.

Double Side SMT and Molding Process Development for mPossum Package

  • Kim, ByongJin;Cho, EunNaRa;Kim, ChoongHoe;Lee, YoungWoo;Lee, JaeUng;Ryu, DongSu;Jung, GyuIck;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon;Kim, Sun-Joong
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.43-48
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    • 2016
  • 3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

Problems and Solutions for Ultra-compact LED Package Development (극소형 LED 패키지 개발의 문제점과 해결 방안)

  • Lee, Jong Chan
    • Journal of Industrial Convergence
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    • v.17 no.4
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    • pp.9-14
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    • 2019
  • This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

Titanium alloy bolt hot forging process analysis through plastic working analysis (소성 가공 해석을 통한 티타늄 합금 볼트 열간 단조 공정 분석)

  • Choi, Doo-Sun;Kim, Tae-Min;Han, Bong-Seok;Han, Yu-Jin;Ko, Kang-Ho;Park, Jung-Rae;Park, Kyu-Bag;Lee, Jung-Woo;Kim, Do-Un
    • Design & Manufacturing
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    • v.14 no.1
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    • pp.42-48
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    • 2020
  • Titanium alloy has been in the spotlight as a core material in high-tech industries that require high strength and light weight because it has excellent strength and corrosion resistance and strength is higher than that of steel. Therefore, in various industries, existing steel products are intended to be replaced with titanium alloys. Titanium alloys can cause cutting tool breakage during cutting, and heat generated during cutting does not dissipate, accumulates in tools and workpieces, resulting in large wear and tear on thin workpieces. In addition, since titanium alloy is a metal with high chemical activity, the wear of the tool becomes more severe when the cutting speed is high, so machining of titanium bolt through cutting is very disadvantageous in terms of productivity. Therefore, the production of bolts using titanium alloys is being produced through a forging process to improve productivity and product quality. In this paper, hot forging molding analysis was performed on bolts used for fastening automobile parts using Ti-6Al-4V alloy, which is the most commonly used titanium alloy.

Effects of Heat-treatment Temperature on the Critical Current of BSCCO 2212 Tube Prepared by CMP Method (CMP 방법으로 제조한 BSCCO 2212 튜브의 임계전류특성에 미치는 열처리 온도의 영향)

  • Choi, Jung-Suk;Oh, Sung-Young;Jun, Byung-Hyuk;Kim, Hyoung-Seop;Kim, He-Lim;Hyun, Ok-Bae;Kim, Chan-Joong
    • Progress in Superconductivity
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    • v.8 no.1
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    • pp.98-103
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    • 2006
  • [$Bi_2Sr_2Ca_1Cu_2O_x$](BSCCO 2212) tubes were fabricated by centrifugal melting process(CMP). BSCCO 2212 powder was melted in a Pt crucible and solidified in a rotating steel mold. The BSCCO 2212 tube samples separated from steel mold were heat-treated at $800^{\circ}C\;and\;810^{\circ}C$ in oxygen flow. The critical current($I_c$) of the samples was measured by transport measurement at 77K, and the microstructure was investigated by scanning electron microscope. The $J_c$ at 77K of the tubes heated treated at $800^{\circ}C\;and\;810^{\circ}C$ were 197 and 240 $A/cm^2$, respectively. It was observed that the plate like grains in BSCCO 2212 tube was more developed in the sample heat treated at $810^{\circ}C\;and\;800^{\circ}C$ heated tube. It is found that the critical current($I_c$) of the BSCCO 2212 sample was dependent on the heating schedule regarding the growth of the BSCCO 2212 grains.

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