• 제목/요약/키워드: Modulus Measurement

검색결과 347건 처리시간 0.033초

수정진동자를 사용한 점탄성 유체의 점성계수와 전단 탄성계수 측정에 관한 이론해석 (Theoretical Analysis for the Measurement of Viscosity and Shear Modulus of Viscoelastic Fluids by Using a Quartz Crystal Oscillator)

  • 서용권;김영한
    • 대한기계학회논문집B
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    • 제32권7호
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    • pp.487-496
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    • 2008
  • Quartz crystal oscillator is frequently used in measuring a very small amount of mass attached to or adsorbed on the surface of an electrode on the quartz plate. The physical principle is that the resonance frequency of the shear vibration of the quartz caused by an applied electric field is a function of the mass. Recently, effort has been tried to measure physical properties of viscoelastic fluids, such as viscosity and shear modulus. This paper presents useful formula that can be used in estimating the properties of viscoelastic fluids. Important finding in this analysis is that the formula can produce multiple values for the physical properties of the viscoelastic materials.

Ge2Sb2Te5 박막의 상변화에 의한 기계적 물성 변화 (Phase Transformation Effect on Mechanical Properties of Ge2Sb2Te5 Thin Film)

  • 홍성덕;정성민;김성순;이홍림
    • 한국세라믹학회지
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    • 제42권5호
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    • pp.326-332
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    • 2005
  • Phase transformation effects on mechanical properties of $Ge_2Sb_2Te_5$, which is a promising candidate material for Phase Change Random Access Memory (PRAM), were studied. $Ge_2Sb_2Te_5$ thin films, which was thermally annealed with different conditions, were analyzed using XRD, AFM, 4-point probe method and reflectance measurement. As the temperature and the dwelling time increased, crystallity and grain size increased, which enhanced elastic modulus and hardness. Furthermore, N2 doping, which was used for better electrical properties, was proved to decrease elastic modulus and hardness of $Ge_2Sb_2Te_5$.

지반공학 분야에서의 전단파속도의 활용 (Applications of Shear Wave Velocity in Geotechnical Engineering)

  • 김동수
    • 한국지구물리탐사학회:학술대회논문집
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    • 한국지구물리탐사학회 2007년도 공동학술대회 논문집
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    • pp.7-23
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    • 2007
  • The shear wave velocity is directly related to the deformation characteristic of soils which is an engineering property represented by the shear modulus. This feature presents an opportunity of advantageous utilization of the shear wave velocity for deformation analysis in geotechnical engineering applications, since the deformation modulus is determined on strong theoretical basis, whereas penetration resistances such as N by SPT or qc by CPT rely on empirical relations. Furthermore, it is an engineering property that can be evaluated by performing the same basic measurement in the laboratory and field, and various problems in geotechnical engineering can be dealt with economically and reliably when the field and laboratory methods are combined effectively. In this article, assessment of nonlinear deformation characteristic of soils based on synergic use of the field and laboratory test results is described, and representative case histories of geotechnical applications of the shear wave velocity are illustrated.

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균열이 발생된 콘크리트의 특성 및 보수.보강(구조 및 재료 \circled2) (Properties and Repair-Reinforcement of Concrete Introduced Crack)

  • 김영익;윤준노;민정기;김경태;박필우;성찬용
    • 한국농공학회:학술대회논문집
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    • 한국농공학회 2000년도 학술발표회 발표논문집
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    • pp.284-289
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    • 2000
  • This study is performed to evaluate an the crack properties and repair-reinforcement of concrete introduced crack. Materials used are portland cement, coarse aggregate, fine aggregate, unsaturated polyester resin and fly ash. Specimen is used beam of 76${\times}$76${\times}$412mm for measurement of pulse velocity, dynamic modulus of elasticity and bending strength and is introduced crack artificially. The following conclusions are drawn; Pulse velocity, dynamic modulus of elasticity and bending strength of concrete introduced crack is shown the lower 1.24∼11.91%, 3.42∼17.21% and 38.17∼61.0% than that of the control concrete, respectively. Pulse velocity, dynamic modulus of elasticity and bending strength of concrete repaired and reinforced crack is shown the higher 0.5∼2.60%, 1.57∼3.07% and 28.17∼47.25% than that of the concrete introduced crack and the lower than that of the control concrete, respectively.

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p+ 실리콘의 강성계수 및 잔류응력 측정 (A Measurement of the Residual Stress and Young's Modulus of p+ Silicon)

  • 김상철;정옥찬;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 G
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    • pp.2524-2526
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    • 1998
  • In this paper, the residual stress and young's modulus of the p+ thin film have been estimated by using the electrostatic resonators. The electrostatic plate resonator with four corrugated bridges and another with four flat ones have been fabricated. The deflection of the plate has been calculated under the induced tension and the residual stress and compared with the dynamic test results. When the young's modulus of the p+ silicon is 125 GPa. The estimated residual stresses of the flat and the corrugated bridges are about 15 MPa and less than 5 MPa, respectively. It has been confirmed that the corrugated structure releases the residual tensile stress resulted from the heavy boron diffusion process.

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CNN기반의 딥러닝 모델을 활용한 잔골재 조립률 예측에 관한 기초적 연구 (A Fundamental Study on the Measurement of Fineness Modulus Using CNN-based Deep Learning Model)

  • 임성규;윤종완;박태준;이한승
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2021년도 가을 학술논문 발표대회
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    • pp.50-51
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    • 2021
  • Recently, as concrete is used in many construction works in Korea, the use of aggregates is also increasing. However, the depletion of aggregate resources is making it difficult to supply and demand high-quality aggregates, and the use of defective aggregates is causing problems such as poor performance such as the liquidity and strength of concrete pouring out in the field. As a result, quality tests such as sieve analysis test is conducted on their own, but this study was conducted to improve time and manpower by using the CNN-based Deep Learning Model for the fineness modulus.

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광중합 복합레진의 중합초기 동적 점탄성의 변화 (THE CHANGE OF THE INITIAL DYNAMIC VISCO-ELASTIC MODULUS OF COMPOSITE RESINS DURING LIGHT POLYMERIZATION)

  • 김민호;이인복
    • Restorative Dentistry and Endodontics
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    • 제34권5호
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    • pp.450-459
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    • 2009
  • 본 연구의 목적은 새로 개발한 점탄성 측정기를 사용하여 수종의 광중합 복합레진의 초기 동적 점탄성 변화를측정하는 것이다. 본 연구에 사용된 점탄성 측정기는 세 부분으로 구성되었다. 첫째, 시편이 놓여지는 parallel plates; 둘째, DC 모터와 크랭크로 이루어진 회전진동전단변형 (Oscillatory shear strain)을 발생시키는 부분; 셋째, 전자기적 토크센서를 이용한 응력 측정 부분으로 구성되었다. 본 점탄성 측정기는 최대 2 Ncm의 토크를 측정할 수 있으며, 광중합기의 스위치는 컴퓨터와 연동하여 데이터 획득을 시작할 때 동시에 켜지도록 하였다. 본 연구에서는 시판 중인 6종의 광중합 복합레진 [Z-100 (Z1), Z-250 (Z2), Z-350 (Z3), DenFil (DF), Tetric Ceram (TC), Clearfil AP-X (CF)]을 사용하였다. 점탄성 측정기를 사용하여 동적 회전전단실험을 시행하였다. 직경 3 mm인 유리막대로 구성된 parallel plates 사이에 $14.2\;mm^3$의 복합레진을 적용시켰으며, 6 Hz의 진동수와 0.00579 rad의 진폭으로 변형을 가하고 발생된 응력을 측정하였다. 광중합이 시작됨과 동시에 측정이 시작되었으며, 광중합 후 10초 동안 점탄성의 변화를 관찰하였다. 각 복합레진에 대해 5 회 반복하여 측정하였고, 실험은 $25{\pm}0.5^{\circ}C$에서 진행되었다. 측정된 변형-응력 곡선으로부터 복소전단탄성계수 G*, 저장전단탄성 계수 G', 손실전단탄성 계수 G"를 구하였고 G*가 10 MPa에 이르는 시간을 구하였다. 각 재료의 복소전단탄성계수 G*와 10 MPa에 이르는 시간에 대해 일원분산분석 (One-way ANOVA)과 사후검정 (Tukey 검정)을 시행하였다 (${\alpha}$= 0.05). 결과는 다음과 같다. 1.본 연구를 위해 제작한 점탄성 측정기는 광중합 복합레진의 중합 초기 10초 동안의 동적 점탄성 변화를 신뢰성 있게 측정 할 수 있었다. 2. 모든 복합레진은 광조사 개시 후 $1{\sim}2$초의 불응기를 지난 다음 급격한 전단탄성계수의 증가를 보였다. 3. 모든 복합레진은 광중합 10 초간 손실전단탄성계수보다 저장전단탄성계수의 높은 증가를 보였다. 4. 광중합 초기 10초 후 복소전단탄성계수 값은 $150.3{\sim}563.7\;MPa$로, Z-100이 가장 높았고, 그 다음 Clearfil, Z-250, Z-350, Tetric Ceram, DenFil의 순이었다. 5. 복소전단탄성계수가 10 MPa에 이르는 시간은 Z-100이 2.55초로 가장 빨랐고, DenFil이 4.06초로 가장 느렸다.

사파이어 의료용 나이프의 연삭가공에서 지그의 탄성계수가 날 부 형상에 미치는 영향 (Effect of the Elasticity Modulus of Jig Material on Blade Edge Shape in Grinding Process of Sapphire Medical Knife)

  • 신건휘;이득우;곽태수
    • 한국기계가공학회지
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    • 제16권2호
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    • pp.102-107
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    • 2017
  • This study focuses on the effect of the elasticity modulus of jig material on blade edge shape in the grinding process of a sapphire medical knife. The ELID grinding process was applied as the edge-grinding method for sapphire material. Carbon steel and copper have been selected as the hard and soft jig materials, respectively. The blade edge created by ELID grinding was measured by a surface roughness tester and optical microscope. The shape of the ground edge and surface roughness were compared using the measurement results. As a result, it was found that chipping in the blade edge of the sapphire knife occurred more than in the case of jig material with a high-elasticity modulus because of the high normal force in the grinding process. Moreover, the maximum height surface roughness, $R_{max}$,of the ground surface was higher in the case of the jig material with a high-elasticity modulus due to the difference in elasticelongation. It was considered to lead to chipping from the notch effect.

박막의 기계적 물성 측정을 위한 벌지 시험 시스템 개발: 전해 동 박의 탄성 계수 (Development of Bulge Testing System for Mechanical Properties Measurement of Thin Films : Elastic Modulus of Electrolytic Copper Film)

  • 김동일;허용학;김동진;기창두
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1807-1812
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    • 2007
  • A bulge testing system was developed to measure mechanical properties of thin film materials. A bulge pressure test system for pressurizing the bulge window of the film and a micro out-of-plane ESPI(Electronic Speckle Pattern Interferometric) system for measuring deflection of the film were included in the testing system developed. For the out-of-plane ESPI system, whole field speckle fringe pattern, corresponding to the out-of-plane deflection of the bulged film, was 3-dimensionally visualized using 4-bucket phase shifting algorithm and least square phase unwrapping algorithm. The bulge pressure for loading and unloading was controlled at a constant rate. From the pressure-deflection curve measured by this testing system, ain-plane stress-strain curve could be determined. In this study, elastic modulus of an electrolytic copper film 18 ${\mu}m$ was determined. The modulus was calculated from determining the plain-strain biaxial elastic modulus at the respective unloading slopes of the stress-strain curve and for the Poisson's ratio of 0.34.

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산화막 CMP에서 패드 두께가 연마율과 연마 불균일도에 미치는 영향 (Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP)

  • 배재현;이현섭;박재홍;니시자와 히데키;키노시타 마사하루;정해도
    • 한국전기전자재료학회논문지
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    • 제23권5호
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    • pp.358-363
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    • 2010
  • The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.