Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP |
Bae, Jae-Hyun
(Graduate School of Mechanical Engineering, Pusan National University)
Lee, Hyun-Seop (Graduate School of Mechanical Engineering, Pusan National University) Park, Jae-Hong (Nitta Hass Incorporation) Nishizawa, Hideaki (Nitta Hass Incorporation) Kinoshita, Masaharu (Nitta Hass Incorporation) Jeong, Hae-Do (School of Mechanical Engineering, Pusan National University) |
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