• Title/Summary/Keyword: Micro-grid pattern

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Carbon Black Containing Micro-Grid Patterned Piezocapacitive Pressure Sensor (탄소분말이 함유된 마이크로 그리드패턴 전기용량형 압력센서)

  • Ma, Sung-Young;Chang, Seung-Hwan
    • Composites Research
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    • v.32 no.5
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    • pp.237-242
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    • 2019
  • In this research, a capacitive pressure sensor (Piezocapacitive Sensor) was fabricated using carbon black powder containing poly-dimethylsiloxane (PDMS) with micro-grid patterned surface. To investigate the effect of carbon black powder and micro-grid pattern on the sensor's performance, various sensors were fabricated with different carbon black powder concentration and grid pattern density. The performances of the developed sensors were compared in terms of operating range and sensitivity.

Research on Tribology Characteristics Using DLC Thin Film and Lithography Processes (DLC 박막 및 리소그래피 공정을 적용한 트라이볼러지 특성 연구)

  • T.H. Jang;J.H. Park;T.G. Kim
    • Journal of the Korean Society for Heat Treatment
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    • v.36 no.6
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    • pp.412-421
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    • 2023
  • As the demand for mechatronic systems and high performance increases in the machinery industry, the importance of improving friction characteristics is emphasized. During relative movement of objects, friction and wear occur on two surfaces in contact, and various methods are being designed to increase the lifespan and energy efficiency of machines. The energy increase effect using lubricants is a well-known method. In this study, a micro-sized rectangular grid pattern was produced by applying a precise micro-pattern photo lithography process. Rectangular grid patterns of the same shape and friction behavior according to the size of the pattern were produced in convex and concave shapes, and the tribological characteristics of each were analyzed.

A Study on Mobility Loads and the Deployment Patterns for the Development of Smart Place Load Model (스마트 플레이스 부하모델 개발을 위한 이동성 부하 및 보급패턴에 관한 연구)

  • Hwang, Sung-Wook;Song, Il-Keun;Kim, Jung-Hoon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.2
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    • pp.217-223
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    • 2014
  • Recently, various researches and projects about electric vehicles are in progress vigorously and continuously and it is expected to penetrate rapidly with the next a few years. This deployment will cause the change of load composition rate affecting on power system planning and operations. Therefore, a new load model should be developed integrating with electric vehicle loads. In this paper, the load composition rate of residential sectors is analyzed considering the deployment of this mobility load such as electric vehicles and a new diffusion model is proposed based on the classification of the replacement patterns. Additionally, electric vehicle charging loads are basically modeled by some individual load experiments to develop new load models for smart place and some new conceptual power systems such as micro grids.

Machining of Micro Structure using Elliptical Vibration Grooving Machine (타원궤적 진동절삭 가공기를 이용한 미세 형상 가공)

  • Kim, Gi-Dae;Loh, Byoung-Gook
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.11
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    • pp.45-51
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    • 2008
  • Successive micro-scale V-grooves and a grid of pyramids were machined by elliptical vibration tufting (EVC) to investigate feasibility of using EVC as an alternative method of creating micro-molds to photo-lithography and electroforming, which have been commonly employed. An elliptical vibration grooving machine was developed which consists of two orthogonally-arranged piezoelectric actuators, a diamond cutting tool, and a motorized xyz stage. The micro-scale features were machined on materials of copper, duralumin, nickel, and hastelloy and it was found that EVC significantly reduces cutting resistance and prohibits generation of side burrs and rollover burrs, thus resulting in improving machining qualify of micro-molds in ail experimented workpiece materials.

Fabrication Technology of the Focusing Grating Coupler using Single-step Electron Beam Lithography

  • Kim, Tae-Youb;Kim, Yark-Yeon;Han, Gee-Pyeong;Paek, Mun-Cheol;Kim, Hae-Sung;Lim, Byeong-Ok;Kim, Sung-Chan;Shin, Dong-Hoon;Rhee, Jin-Koo
    • Transactions on Electrical and Electronic Materials
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    • v.3 no.1
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    • pp.30-37
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    • 2002
  • A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control'writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm). To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and 0.5 $\times$ 0.5 mm$^2$area, respectively. This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

Three-dimensional Machine Vision System based on moire Interferometry for the Ball Shape Inspection of Micro BGA Packages (마이크로 BGA 패키지의 볼 형상 시각검사를 위한 모아레 간섭계 기반 3차원 머신 비젼 시스템)

  • Kim, Min-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.81-87
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    • 2012
  • This paper focuses on three-dimensional measurement system of micro balls on micro Ball-Grid-Array(BGA) packages in-line. Most of visual inspection system still suffers from sophisticate reflection characteristics of micro balls. For accurate shape measurement of them, a specially designed visual sensor system is proposed under the sensing principle of phase shifting moire interferometry. The system consists of a pattern projection system with four projection subsystems and an imaging system. In the projection system, four subsystems have spatially different projection directions to make target objects experience the pattern illuminations with different incident directions. For the phase shifting, each grating pattern of subsystem is regularly moved by PZT actuator. To remove specular noise and shadow area of BGA balls efficiently, a compact multiple-pattern projection and imaging system is implemented and tested. Especially, a sensor fusion algorithm to integrate four information sets, acquired from multiple projections, into one is proposed with the basis of Bayesian sensor fusion theory. To see how the proposed system works, a series of experiments is performed and the results are analyzed in detail.

3D Surface Model Generation of Micro Structure by Self Calibration of The SEM Image (SEM 영상의 자체검정에 의한 미세구조물의 3차원 표면모델 생성)

  • 이효성;박형동
    • Proceedings of the Korean Society of Surveying, Geodesy, Photogrammetry, and Cartography Conference
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    • 2003.04a
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    • pp.151-159
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    • 2003
  • This study presents method for self-calibration of the SEM(Scanning Electron Microscope) stereo image using the standard microprobe with same grid pattern and using parallel and central perspective projection equation. Result showed that parallel projection method is more suitable for standard microprobe. The maximum error of 3D coordinates acquired by this method did not exceed 5 $\mu\textrm{m}$, and DSM(Digital Surface Model) for three dimensional measurement of the rock sample was generated by the digital photogrammetry. This result can be used for quantification of micro scale change of shape and analysis of the micro morphology of rock due to weathering.

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Energy Performance Evaluation of Building Micro-grid System Including Micro-turbine in Hospital Buildings (마이크로터빈이 포함된 빌딩마이크로그리드시스템의 병원건물의 에너지성능평가)

  • Kim, Byoung-Soo;Hong, Won-Pyo
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.10a
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    • pp.279-283
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    • 2009
  • Distributed generation(DG) of combined cooling, heat. and power(CCHP)has been gaining momentum in recent year as efficient, secure alternative for meeting increasing energy demands. This paper presents the energy performance of microturbine CCHP system equipped with an absorption chiller by modelling it in hospital building. The orders of study were as following. 1)The list and schedule of energy consumption equipment in hospital were examined such as heating and cooling machine, light etc. 2) Annual report of energy usage and monitoring data were examined as heating, cooling, DHW, lighting, etc. 3) The weather data in 2007 was used for simulation and was arranged by meteorological office data in Daejeon. 4) Reference simulation model was built by comparison of real energy consumption and simulation result by TRNSYS and ESP-r. The energy consumption pattern of building were analyzed by simulation model and energy reduction rate were calculated over the cogeneration. As a result of this study, power generation efficiency of turbine was about 30% after installing micro gas turbine and lighting energy as well as total electricity consumption can be reduced by 40%. If electricity energy and waste heat in turbine are used, 56% of heating energy and 67% of cooling energy can be reduced respectively, and total system efficiency can be increased up to 70%.

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The Optimization of FCBGA thermal Design by Micro Pattern Structure (마이크로 패턴 구조를 이용한 플립칩 패키지 BGA의 최적 열설계)

  • Lee, Tae-Kyoung;Kim, Dong-Min;Jun, Ho-In;Ha, Sang-Won;Jeong, Myung-Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.3
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    • pp.59-65
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    • 2011
  • According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.