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http://dx.doi.org/10.6117/kmeps.2011.18.3.059

The Optimization of FCBGA thermal Design by Micro Pattern Structure  

Lee, Tae-Kyoung (Education program for samsung advanced integrated circuit, Pusan National University)
Kim, Dong-Min (Education program for samsung advanced integrated circuit, Pusan National University)
Jun, Ho-In (Education program for samsung advanced integrated circuit, Pusan National University)
Ha, Sang-Won (SEMCO ACI Division)
Jeong, Myung-Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.3, 2011 , pp. 59-65 More about this Journal
Abstract
According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.
Keywords
flip chip; thermal resistance; heat spreader; micro pattern;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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