• Design & Manufacturing
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• 제17권2호
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• pp.55-61
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• 2023

With femtosecond (fs) laser pulse irradiation on metals, various types of nano- and micro-scale structures can be naturally induced at the surface through laser-matter interaction. Two notable structures are laser-induced periodic surface structures (LIPSSs) and cone/spike structures, which are known to significantly modify the optical and physical properties of metal surfaces. In this work, we irradiate fs laser pulses onto various types of metals, cold-rolled steel, pickled & oiled steel, Fe-18Cr-8Ni alloy, Zn-Mg-Al alloy coated steel, and pure Cu which can be useful for precise molding and imprinting processes, and adjust the morphological profiles of LIPSSs and cone/spike structures for clear structural coloration and a larger range of surface wettability control, respectively, by changing the fluence of laser and the speed of raster scan. The periods of LIPSSs on metals used in our experiments are nearly independent of laser fluence. Accordingly, the structural coloration of the surface with LIPSSs can be optimized with the morphological profile of LIPSSs, controlled only by the speed of the raster scan once the laser fluence is determined for each metal sample. However, different from LIPSSs, we demonstrate that the morphological profiles of the cone/spike structures, including their size, shape, and density, can be manipulated with both the laser fluence and the raster scan speed to increase a change in the contact angle. By injection molding and imprinting processes, it is expected that fs laser-induced surface structures on metals can be replicated to the plastic surfaces and potentially beneficial to control the optical and wetting properties of the surface of injection molded and imprinted products.

• 열처리공학회지
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• 제31권6호
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• pp.290-299
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• 2018

The microstructure of a newly developed alloy tool steel (KV1) for casting cold-work press dies was analyzed using advanced scanning electron microscopy. Its mechanical properties and durability in use as piercing inserts were tested. It contained a continuous network structure which originated from the micro-segregation during solidification and was composed of retained austenite and primary carbides. However, after quenching and tempering, its continuity was destroyed due to the decomposition of austenite. The discontinuous spatial distribution and the smaller amount of primary carbide in the network presented KV1 enhanced ductility compared to the common alloy (HK700). The reduced C and Cr, the addition of V resulted in a small amount of primary carbides which primarily consisted of MC, as well as fine and uniform dispersion of precipitates. Owing to these features, KV1 exhibited delayed initiation of chipping when used for piercing inserts.

• 한국정밀공학회지
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• 제25권10호
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• pp.115-121
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• 2008

This paper presents bisymmetric dual iron core lineal motor stage for heavy-duty high precision applications such as large area micro-grooving machines or high precision roll die machines. In this stage, two iron core linear motors are installed in laterally symmetric way to cancel out the attractive forces. Main focus was given to analyzing the effect of cogging force and moment for two different layouts, which are symmetric and half-pitch shifted ones. Experimental results showed that the symmetric layout is more adequate for high precision applications because of its clear moment cancellation effect. It was also verified that the effect of the residual cogging moment can be suppressed further by increasing the bearing stiffness. One problem of the symmetric layout is added cogging force which hinders smooth motion, but its effect was relatively small compared with that of moment cancellation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.499-502
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1373-1378
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• 2007

Metal forming ins the process changing shapes and mechanical properties of the workpiece without initial material reduction through plastic deformation. Above all, because of hot working carried out above recrystallization temperature can be generated large deformation with one blow, it can produce with forging complicated parts or heat resisting super alloy such as Inconel 718 has the worst forgeability. In this paper, we established optimal variation of hot heading precess of the Inconel 718 used in heat resisting component and evaluated mechanical properties hot worked produce. Die material is SKD61 and initial temperature is $300^{\circ}C$. Initial billet temperature and punch velocity changed, relatively. Friction coefficient is 0.3 as lubricated condition of hot working. CAE is carried out suing DEFORM software before making the tryout part, and it is manufactured 150 ton screw press with optimal condition. It is known that forming load was decreased according to decreasing punch velocity.

• 한국분말재료학회지
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• 제21권1호
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• pp.39-43
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• 2014

Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.

• 대한치과보철학회지
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• 제40권1호
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• pp.30-41
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• 2002

This study was to evaluate the fabrication method and marginal adaptation of the conical inner crown fabricated with CAD/CAM. The informations on abutment teeth were transferred to a computer with a micro contact digitizer, which had a $50{\mu}m$ accuracy on the master die. A conical inner crown was designed on a computer and a real crown was machined based on this design using CAM. The marginal fit of a computer-machined conical inner crown was assessed using electron microscopy Measurement of the marginal gap between the conical inner crown and the abutment was performed on four different locations (mesial, distal, buccal, and lingual surfaces) of the finish line. The evaluation was based on 10 test specimens. The results were as follow. 1 The mean marginal gap between the conical inner crown and abutment tooth was $83.2{\pm}43{\mu}m$, 28.9% of the specimen showed marginal gap over $100{\mu}m$. 2. The fabrication method using CATRS and CAM provided clinically acceptable marginal fitness compared to conventional casting method (P<0.05).

• ETRI Journal
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• 제29권4호
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• pp.421-429
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• 2007

This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

• 한국주조공학회지
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• 제40권3호
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• pp.61-65
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• 2020

Rheo-diecasting with stirring has been used in many material industries. As the 4th Industrial Revolution approaches the world, eco-friendly high-strength and light-weight materials become more important. Casting methods have been studied and used for aluminum-alloy automobile parts. This study carried out the effect analysis of the micro-structure and mechanical properties, such as yield/ultimate tensile strength, elongation, and hardness, of A356 using the 6-pole EMS (electro-magnetic stirring) casting process with a high electromagnetic force. As a result, the hardness and elongation of the A356 after T6 heat-treatment show a significant improvement, respectively, by 20% and 50%.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.