• Journal of Welding and Joining
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• 제26권3호
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• 한국재료학회지
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• 제16권12호
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• pp.777-781
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• 2006

Recently, there are a lot of study to alternate polycarbonate which is being used as storage material in CD, DVD. In this study, we alternated polycarbonate with glass. We observed the change of shape in a surface of the glass which was focused by Nd:YAG Laser. The change of shape and property was studied by thermal mechanical analysis (TMA), UV-Vis spectrometer, AFM and SEM. According to Laser power and quantity of additives, the Bump's size and shape are showed differently. In high energy, the Bump will be transformed into Pit. And also according to CTE, $T_d$ and absorption ratio of glass, difference between Bump and Pit is confirmed. From these investigation, we could control that the minimum size of bump which is more useful shape than pit's is about 1.3 $\mu$m, H 70 nm, and it is near same the spot size.

• 한국재료학회지
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• 제19권3호
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.59-64
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• 2013

3차원 적층 패키지를 위한 Cu/Ni/Au/Sn-Ag/Cu 미세 범프의 열처리에 따른 금속간 화합물 성장 거동을 분석하기 위하여 in-situ SEM에서 $135^{\circ}C$, $150^{\circ}C$, $170^{\circ}C$의 온도에서 실시간 열처리 실험을 진행하였다. 실험 결과 금속간 화합물의 성장 거동은 열처리시간이 경과함에 따라 시간의 제곱근에 직선 형태로 증가하였고, 확산에 의한 성장이 지배적인 것을 확인 할 수 있었다. Ni/Au 층의 존재로 인해 Au의 확산으로 복잡한 구조의 금속간 화합물이 생성 된 것을 확인할 수 있다. 활성화 에너지는 $Cu_3Sn$의 경우 0.69eV, $(Cu,Ni,Au)_6Sn_5$경우 0.84 eV로 Ni이 포함된 금속간 화합물이 더 높은 것을 확인 하였으며, 확산 방지층 역할을 하는 Ni층에 의해 금속간 화합물 성장이 억제됨에 따라 신뢰성이 향상 될 것으로 사료된다.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.55-61
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• 2010

탄탈륨실리사이드 히터가 내장된 소자를 Ag 페이스트와 Au SBB(Stud Bump Bonding)를 이용하여 Au가 코팅 된 기판에 각각 접합 하였다. 전단 테스트와 전류를 흐르면서 열 성능을 측정하였다. Au 스터드 범프 본딩의 최적 플립칩 접합조건은 전단 후 파괴면 관찰하여 설정하였으며, 기판 온도를 $350^{\circ}C$, 소자 온도를 $250^{\circ}C$에서 하중을 300 g/bump 로 하여 접합하는 경우가 최적 조건이였다. 히터에 5 W 인가시 소자의 온도는 Ag 페이스트를 이용한 접합의 경우 최대 온도는 약 $50^{\circ}C$이었으며, Au 금속층을 갖고 있는 실리콘 기판에 Au 스터드 본딩으로 접합된 인 경우 약 $64^{\circ}C$를 나타내었다. 기판과의 접촉면적이 와이어본딩과 Au 스터드 범프 본딩 가 약 300배가 차이가 나는 경우 약 $14^{\circ}C$ 차이를 나타내었고, 전사모사를 통하여 접합면의 접촉저항이 중요한 이유임을 알 수 있었다.

• Journal of Welding and Joining
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• 제29권1호
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• pp.29-32
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• 2011

• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Tribology and Lubricants
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• 제19권2호
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• pp.102-108
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• 2003

The height of laser bumps has been considered as the limit of the minimum flying height in the contact start-stop (CSS) of hard disk drives. In this paper, tribological interactions at flying height under laser bumps are investigated in a spin stand for development of ultra-low flying head-disk interface. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps and, then, head-disk interactions are investigated using AE and stiction/friction signals. During seek tests and 20000 cycle-sweep tests, AE and stiction/friction signals are not significantly changed and there are no catastrophic failures of head-disk interface. Bearing analysis and AFM analysis show that there are signs of wear and plastic deformation on the disks. It is suggested that flying height could be as low as and, sometimes, lower than laser bump height.

• 대한기계학회논문집B
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• 제30권4호
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• pp.314-319
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• 2006

To analyze in-vivo blood flow characteristics in a chicken embryo, in-vivo experiment was carried out using micro-PIV technique. Because endothelial cells in blood vessels are subject to shear stress of blood flow, it is important to get velocity field information of the placental blood flow. Instantaneous velocity fields of an extraembryonic blood vessel using a high-speed camera and intravital microscope. The flow images of RBCs were obtained with a spatial resolution of $20\times20{\mu}m$ in the whole blood vessels. The mean velocity field data confirm that the blood flow does show non-Newtonian fluid characteristic. The blood in a branched vessel merged smoothly without any flow separation into the main blood vessel with the presence of a slight bump. This in-vivo micro-PIV measurement technique can be used as a powerful tool in various blood flow researches.