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A Study on Evaluation of Shear Strength for Pb-free Solder Joint with Ni-P/Au UBM  

Cho, Seong-Keun (전북대학교 대학원 정밀기계공학과)
Yang, Sung-Mo (전북대학교 기계시스템공학부)
Yu, Hyo-Sun (전북대학교 기계시스템공학부)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.20, no.2, 2011 , pp. 187-192 More about this Journal
Abstract
UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.
Keywords
Pb-free Solder Joint; Under Bump Metallurgy(UBM); Micro Shear-Punch Test; Shear Strength; Intermetallic Compound;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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