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http://dx.doi.org/10.3740/MRSK.2009.19.3.151

Characteristics of Plated Bump on Multi-layer Build up PCB by Pulse-reverse Electroplating  

Seo, Min-Hye (Plant Engineering Center, Institute for Advanced Engineering)
Kong, Man-Sik (Plant Engineering Center, Institute for Advanced Engineering)
Hong, Hyun-Seon (Plant Engineering Center, Institute for Advanced Engineering)
Sun, Jee-Wan (Research and Development Team, Hojinplatech)
Kong, Ki-Oh (Research and Development Team, Hojinplatech)
Kang, Kae-Myung (Department of Materials Engineering, Seoul National University of Technology)
Publication Information
Korean Journal of Materials Research / v.19, no.3, 2009 , pp. 151-155 More about this Journal
Abstract
Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.
Keywords
build-up PCB; pulse-reverse plating; copper electroplating; current density; brightener;
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Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 2
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