Characteristics of Plated Bump on Multi-layer Build up PCB by Pulse-reverse Electroplating
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Seo, Min-Hye
(Plant Engineering Center, Institute for Advanced Engineering)
Kong, Man-Sik (Plant Engineering Center, Institute for Advanced Engineering) Hong, Hyun-Seon (Plant Engineering Center, Institute for Advanced Engineering) Sun, Jee-Wan (Research and Development Team, Hojinplatech) Kong, Ki-Oh (Research and Development Team, Hojinplatech) Kang, Kae-Myung (Department of Materials Engineering, Seoul National University of Technology) |
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