• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.641-642
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• 2010

• Journal of Industrial Technology
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• v.26 no.B
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• pp.35-41
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• 2006

Recently, as ultrasonic medical devices are gradually developed, many of those requires smaller and more precision coaxial cables in probe. So, the use of micro coaxial cable becomes an efficient solution for ultrasonic machine. However, there are many difficulties in stripping micro coaxial cable by traditional mechanical process. In this paper, we use the Nd-YAG laser for the efficient stripping of conduct wire of cable. We propose a new method to strip the shield wire of micro coaxial cable. Through some experiments, we found that there is a new possibility in the proposed method. Also, in order to enhance the performance, we propose a preprocess of the cable before stripping.

• Journal of Mechanical Science and Technology
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• v.20 no.5
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• pp.668-674
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• 2006

In order to develop a cell based robot, we present a micro-mechanical force measurement system for the biological muscle actuators, which utilize glucose as a power source. The proposed measurement system is composed of a micro-manipulator, a force transducer with a glass probe, a signal processor, an inverted microscope and video recording system. Using this measurement system, the contractile force and frequency of the cardiac myocytes were measured in real time and the magnitudes of the contractile force of each cardiac myocyte under different conditions were compared. From the quantitative experimental results, we could estimate that the force of cardiac myocytes is about $20\sim40{\mu}N$, and show that there are differences between the control cells and the micro-patterned cells.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.11a
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• pp.341-346
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• 2000

The effect of OTS(octadecyltrichlorosilane) SAM(self-assembled monolayer) on the micro-adhesion has been studied. OTS SAM was formed on the Si(100) surface and SPM (scanning probe microscope) tips with different radius of curvature were fabricated by a series of masking and etching processes. Pull-off forces of different tips on Si and OTS SAM surfaces were measured by SPM in different relative humidities. The surface of OTS SAM was changed to hydrophobic surface and the micro-adhesion force of OTS SAM was lower than that of pure Si. As the tip radius of curvature and the relative humidity increased. the micro-adhesion force increased. Based on the test results. the main parameter affected to the micro-adhesion was absorbed humidity on the surface.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.6
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• pp.235-239
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• 2006

ZnO-doped near-stoichiometric $LiNbO_3$ single crystals of $0.8{\sim}1.0mm$ diameter and $30{\sim}35mm$ length were grown by the micro-pulling down (U-PD) method. The structure of the grown crystals was confirmed by powder x-ray diffraction (XRD) patterns. Electron probe micro analysis (EPMA) showed that Zn ions were homogeneously incorporated In grown crystals. The threshold in ZnO doping level was confirmed that an abrupt change in the features of $OH^-$ absorption band as doping level reaching about 2 mol%.

• Journal of the Korean Ceramic Society
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• v.39 no.9
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• pp.835-839
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• 2002

Stoichiometric $LiNbO_3$(LN) single crystals of 1 mm diameter and 30∼40 mm length with co-doped the $Er_2O_3$ and MgO were grown by the Micro-Pulling Down(${\mu}$-PD) method. The grown crystals were investigated for the change of the up-conversion property by the $Er_2O_3$ and MgO addition and the optical damage by the MgO concentration. Also, the crystals were studied the defects using the optical microscope and it is identified the homogeneities of the distribution of the $Er_2O_3$ and MgO concentration by the Electron Probe Micro Analysis(EPMA).

• Journal of Applied Reliability
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• v.7 no.1
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.63-66
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• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.33-42
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• 2002

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.68-68
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• 2009

최근 디스플레이 산업의 발달로 LCD 판넬의 수요가 급증함에 따라 검사장치 분야도 동반 성장하고 있다. LCD 검사를 위한 probe unit은 미세전기기계시스템 (MEMS) 공정을 이용하여 제작된다. 본 연구에서는 probe card의 미세 슬릿을 제작하기 위한 Si 깊은 식각 공정을 수행하였다. 공정에 사용된 장비는 STS 사의 D-RIE 시스템으로 식각가스로 $SF_6$, passivation용으로 $C_4F_8$ 가스를 각각 사용하였다. 식각용 마스크는 $30{\sim}50{\mu}m$의 선폭을 probe card의 패턴에 따라 제작되었으며, 분석은 SEM 측정을 이용하였다. 식각 공정 중 발생하는 scallop은 시료를 oxidation 시켜 $SiO_2$ 층을 형성한 후에 식각용액에 에칭하여 제거하였다. 제거전 scallop의 크기는 약 120 nm에서 제거후 약 $50{\mu}m$로 크게 개선됨을 SEM 사진으로 확인하였다.