• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.243-246
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• 2006

In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.

• Design & Manufacturing
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• v.2 no.5
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• pp.5-10
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• 2008

Recently, ultra precision and light-weight micro products are needed in various industries. Injection molding products with metal insert material is often satisfied with light-weight and precision simultaneously. The researches on macro-size insert deformation have been performed but, a research on micro-size insert is meager. In this paper, the injection molding product with $300{\mu}m$ thin foil insert is designed and insert injection molding process is performed. Finally, the deformation of thin foil insert is analyzed according to insert feature and gate length.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.198-201
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• 2006

The optimization of poly-Si TFT process on metal foil for UTL AMOLED was systematically investigated. The improvement in device performance of poly-Si TFT on metal foil was achieved by optimizing the dopant activation condition and gate dielectric structure. Hence, the world first flexible full color 5.6-inch AMOLED with top emission mode on poly-Si TFT stainless steel foil is demonstrated.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• Proceedings of the Membrane Society of Korea Conference
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• 2003.07a
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• pp.25-28
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• 2003

Low cost composite metallic membranes for the hydrogen separation and production have been prepared by using thin Pd-Ag foils reinforced by metallic (stainless steel and nickel) structures. Especially, “supported membranes” have been obtained by a diffusion welding procedure in which Pd-Ag thin foils have been joined with perforated metals (nickel) and expanded metals (stainless steel): in these membranes the thin palladium foil assures both the high hydrogen permeability and the perm-selectivity while the metallic support provides the mechanical strength. A second studied method of producing "laminated membranes" consists of coating non-noble metal sheets with very thin palladium layers by diffusion welding and cold-rolling. Palladium thin coatings over these metals reduce the activation energy of the hydrogen adsorption process and make them permeable to the hydrogen. In this case, the dense non-noble metal has been used as a support structure of the thin Pd-Ag layers coated over its surfaces: a proper thickness of the metal assures the mechanical strength, the absence of defects (cracks, micro-holes) and the complete hydrogen selectivity of the membrane. membrane.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.89-90
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• 2009

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.745-748
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• 2007

Hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) were fabricated on a flexible metal substrate at $150\;^{\circ}C$. To increase the stability of the flexible a-Si:H TFTs, they were thermally annealed at $230\;^{\circ}C$. The field effect mobility was reduced because of the strain in a- Si:H TFT under thermal annealing.

• ETRI Journal
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• v.39 no.6
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• pp.874-879
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• 2017

This paper challenges the fabrication of a thin film energy storage device on a flexible polymer substrate specifically by replacing most commonly used metal foil current collectors with coated current collectors. Mass-manufacturable spray-coating technology enables the fabrication of two different half-cell electric double layer capacitors (EDLC) with a spray-coated silver paste current collector and a Ni foil current collector. The larger specific capacitances of the half-cell EDLC with the spray-coated silver current collector are obtained as 103.86 F/g and 76.8 F/g for scan rates of 10 mV/s and 500 mV/s, respectively. Further, even though the half-cell EDLC with the spray-coated current collector is heavier than that with the Ni foil current collector, smaller Warburg impedance and contact resistance are characterized from Nyquist plots. For the applied voltages ranging from -0.5 V to 0.5 V, the spray-coated thin film energy storage device exhibits a better performance.