• 제목/요약/키워드: Metal thin foil

검색결과 53건 처리시간 0.029초

냉간 등방압 성형공정을 이용한 마이크로 엠보싱 패턴 성형 및 기계적 물성 측정 (Fabrication Method Of Micro Embossing Patterned Metallic Thin Foil Using CIP Process and It's Mechanical Property)

  • 이혜진;이낙규;이근안;이형욱;최석우
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.243-246
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    • 2006
  • In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

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Copper 박막의 레이저 미세홀 가공이 버 생성에 관한 연구 (A study on burr generation of laser micro-hole drilling for copper foil)

  • 오재용;신보성
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.873-877
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    • 2005
  • The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.

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박판 Insert 사출성형시 Insert 변형 특성에 관한 기초 연구 (A basic study on insert deformation characteristics of thin foil insert injection molding process)

  • 정우철;신광호;허영무;윤길상;이정원
    • Design & Manufacturing
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    • 제2권5호
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    • pp.5-10
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    • 2008
  • Recently, ultra precision and light-weight micro products are needed in various industries. Injection molding products with metal insert material is often satisfied with light-weight and precision simultaneously. The researches on macro-size insert deformation have been performed but, a research on micro-size insert is meager. In this paper, the injection molding product with $300{\mu}m$ thin foil insert is designed and insert injection molding process is performed. Finally, the deformation of thin foil insert is analyzed according to insert feature and gate length.

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초미세 금속 박판 홀 어레이 가공 (Fabrication of Ultra Small Size Hole Array on Thin Metal Foil)

  • 임성한;손영기;오수익
    • 소성∙가공
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    • 제15권1호
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    • pp.9-14
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    • 2006
  • In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

Poly-Si TFT on Metal Foil for 5.6-inch UTL (ultra-thin and light) AMOLED

  • Jeong, Jae-Kyeong;Lee, Hun-Jung;Kim, Min-Kyu;Hwang, In-Chan;Kim, Tae-Jin;Shin, Hyun-Soo;Ahn, Tae-Kyung;Lee, Jae-Seob;Kwack, Jin-Ho;Jin, Dong-Un;Mo, Yeon-Gon;Chung, Ho-Kyun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.198-201
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    • 2006
  • The optimization of poly-Si TFT process on metal foil for UTL AMOLED was systematically investigated. The improvement in device performance of poly-Si TFT on metal foil was achieved by optimizing the dopant activation condition and gate dielectric structure. Hence, the world first flexible full color 5.6-inch AMOLED with top emission mode on poly-Si TFT stainless steel foil is demonstrated.

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355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구 (A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing)

  • 오재용;신보성
    • 한국정밀공학회지
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    • 제24권2호
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

Pd-based metallic membranes for hydrogen separation and production

  • Tosti, Silvano;Basile, Angelo
    • 한국막학회:학술대회논문집
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    • 한국막학회 2003년도 The 4th Korea-Italy Workshop
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    • pp.25-28
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    • 2003
  • Low cost composite metallic membranes for the hydrogen separation and production have been prepared by using thin Pd-Ag foils reinforced by metallic (stainless steel and nickel) structures. Especially, “supported membranes” have been obtained by a diffusion welding procedure in which Pd-Ag thin foils have been joined with perforated metals (nickel) and expanded metals (stainless steel): in these membranes the thin palladium foil assures both the high hydrogen permeability and the perm-selectivity while the metallic support provides the mechanical strength. A second studied method of producing "laminated membranes" consists of coating non-noble metal sheets with very thin palladium layers by diffusion welding and cold-rolling. Palladium thin coatings over these metals reduce the activation energy of the hydrogen adsorption process and make them permeable to the hydrogen. In this case, the dense non-noble metal has been used as a support structure of the thin Pd-Ag layers coated over its surfaces: a proper thickness of the metal assures the mechanical strength, the absence of defects (cracks, micro-holes) and the complete hydrogen selectivity of the membrane. membrane.

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The thermal annealing effect on electrical performances of a-Si:H TFT fabricated on a metal foil substrate

  • Han, Chang-Wook;Nam, Woo-Jin;Kim, Chang-Dong;Kim, Ki-Yong;Kang, In-Byeong;Chung, In-Jae;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.745-748
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    • 2007
  • Hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) were fabricated on a flexible metal substrate at $150\;^{\circ}C$. To increase the stability of the flexible a-Si:H TFTs, they were thermally annealed at $230\;^{\circ}C$. The field effect mobility was reduced because of the strain in a- Si:H TFT under thermal annealing.

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Thin Film Energy Storage Device with Spray-Coated Sliver Paste Current Collector

  • Yoon, Seong Man;Jang, Yunseok;Jo, Jeongdai;Go, Jeung Sang
    • ETRI Journal
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    • 제39권6호
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    • pp.874-879
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    • 2017
  • This paper challenges the fabrication of a thin film energy storage device on a flexible polymer substrate specifically by replacing most commonly used metal foil current collectors with coated current collectors. Mass-manufacturable spray-coating technology enables the fabrication of two different half-cell electric double layer capacitors (EDLC) with a spray-coated silver paste current collector and a Ni foil current collector. The larger specific capacitances of the half-cell EDLC with the spray-coated silver current collector are obtained as 103.86 F/g and 76.8 F/g for scan rates of 10 mV/s and 500 mV/s, respectively. Further, even though the half-cell EDLC with the spray-coated current collector is heavier than that with the Ni foil current collector, smaller Warburg impedance and contact resistance are characterized from Nyquist plots. For the applied voltages ranging from -0.5 V to 0.5 V, the spray-coated thin film energy storage device exhibits a better performance.